Abstract: A proactive data recovery system is provided. The system includes a memory having computer-readable instructions stored therein and a processor configured to execute the computer-readable instructions to access a data storage platform and to monitor a plurality of parameters indicative of a requirement of data restore and/or recovery for the data storage platform. The requirement corresponds to a predicted occurrence of a disaster event. The processor is further configured trigger backup of data stored in the data storage platform based upon the plurality of parameters to create a restore package and to initiate the data restore and/or data recovery operation for the data storage platform using the restore package in response to the occurrence of the disaster event.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a destination address that matches an address of the AP or that matches a wildcard address associated with the AP, irrespective of the source address included in the header of the data packet.

Abstract: Aspects of the disclosure relate to a multipoint environment that enables a station (STA) to communicate with multiple access points (APs) and an AP to communicate with multiple STAs in a single wireless protocol stack. For example, a STA can authenticate simultaneously with multiple APs and decode any data packet that includes in a header a destination address that matches an address of the STA, irrespective of the source address included in the header of the data packet. Similarly, an AP can decode any data packet that includes in a header a source address that matches an address of an authenticated STA, irrespective of the destination address included in the header of the data packet.

Abstract: Structured data archival with reduced downtime is disclosed. One example is a system including a deployer that manages an active table (AT), and a non-active table (NAT), and creates an intermediate table (IT) to record, during data archival, changes to the data to be archived. The deployer creates triggers on the AT and the NAT to facilitate the record, by the IT, of the changes to the data to be archived. An archiver initiates the data archival by archiving the copy of the data to be archived from the NAT, merges the recorded data from the IT to the NAT upon receiving an indication that the client access to the AT is not enabled, and switches the client access from the AT to the NAT by changing a table synonym, where the client access to the NAT is enabled upon completion of the data archival.

Abstract: Provided herein is a personal care composition that can exhibit an increased vapor release while maintaining physical stability and texture. The personal care composition can have from about 35% to about 90% petrolatum, an additional microcrystalline wax having a needle penetration at 25° C. of from about 35 to about 75 dmm, from about 1% to about 8% of a gelling agent mixture, and from about 20% to about 50% of an olfactory composition, all by weight of the composition.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of electrically floating heat transfer structures for improved thermal management. In one example, a chip package assembly is provided. The chip package assembly includes a substrate, a first integrated circuit (IC) die and a plurality of electrically floating conductive heat transfer structures. The substrate has a first surface and an opposing second surface. The first IC die has a first surface, an opposing second surface, and four lateral sides. The second surface of the first IC die is mounted to the first surface of the substrate. The plurality of electrically floating conductive heat transfer structures extend in a first direction defined between the first and second surfaces of the first IC die.

Abstract: A device includes a die with perimeters associated therewith, a substrate, and a test channel. The die is coupled to the substrate via a plurality of C4 bumps on a first side of the substrate. The substrate has connections on a second side of the substrate, opposite to the first side. A first connection connects a C4 bump on the first side of the substrate to a connection on the second side using a metal layer. The test channel is positioned within the substrate and further positioned outside of the perimeter of the die coupled to the substrate. The test channel is positioned at substantially a same depth as the metal layer of the first connection. A probe connecting to the test channel via pads positioned on a same side of the substrate that provides electrical characteristics that is substantially the same as electrical characteristics of the first connection.

Abstract: Examples described herein provide techniques for multi-die device structures having improved gap uniformity between neighboring dies. In some examples, a first die and a second die are attached to an interposer. A first gap is defined by and between the first die and the second die. At least one of the first die or the second die is etched at the first gap. The etching defines a second gap defined by and between the first die and the second die. The first die, the second die, and the interposer are encapsulated with an encapsulant. The encapsulant is disposed in the second gap.

Abstract: A resource recommendation system is described to recommend and standardize resource tagging in a networked computing environment. In one example, cloud resources and related data are discovered, a database of the discovered information is generated, machine learning is applied to the database to build a prediction model, and tags for the resources are recommended, based on the prediction model, at a computing device.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of electrically floating heat transfer structures for improved thermal management. In one example, a chip package assembly is provided. The chip package assembly includes a substrate, a first integrated circuit (IC) die and a plurality of electrically floating conductive heat transfer structures. The substrate has a first surface and an opposing second surface. The first IC die has a first surface, an opposing second surface, and four lateral sides. The second surface of the first IC die is mounted to the first surface of the substrate. The plurality of electrically floating conductive heat transfer structures extend in a first direction defined between the first and second surfaces of the first IC die.

Abstract: A method of coordinating a plurality of radio access networks (RANs) includes aggregating, with a gateway, communications interfaces between a plurality of RANs and a packet core network through the gateway. A plurality of radio nodes (RNs) in each of the RANs is communicatively coupled to the gateway and to user equipment (UE) devices associated with the RNs in each of the RANs. The gateway also controls and coordinates mobility of the UE devices within and among the RANs. In addition, the gateway acts as a virtual enhanced NodeB (eNB) to the packet core network, thereby hiding the aggregated communications interfaces from the packet core network.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of electrically floating extra-die heat transfer posts for improved thermal management. In one example, a chip package assembly is provided that includes a substrate, a first integrated circuit (IC) die, and a first plurality of electrically floating extra-die conductive posts. The substrate has a first surface and an opposing second surface. The first integrated circuit (IC) die has a first surface and an opposing second surface. The second surface of the first IC die is mounted to the first surface of the substrate. The first plurality of electrically floating extra-die conductive posts extend from the first surface of the first IC die to provide a heat transfer path away from the first IC die.

Abstract: Systems and methods are disclosed that provide a closed loop power control system including adaptively adjusting the desired target SINR over time so as to ultimately achieve a feasible SINR. In one implementation, a method is provided of optimizing uplink closed loop power control in a RAN in which one or more base stations each service a plurality of mobile stations, including: determining a power level for each mobile station for its respective uplink transmissions, including measuring a current achieved SINR for each mobile station; and for each mobile station, adjusting the power level to be sufficiently high to meet desired transmission characteristics but not so high as to cause unnecessary interference with transmissions from other mobile stations, by adjusting a desired target SINR based on factors selected from the following: current and prior achieved SINRs, current and prior interference measurements, and current and prior transmission power control commands.

Abstract: A battery pack for a vehicle electrical system includes a casing for receiving one or more battery modules. The battery modules are insertable into a casing of the battery pack by sliding couplers along pairs of rails and are securable to the ends of the rails. After insertion, the rails thermally insulate one battery module from other battery modules coupled to the casing. In some examples, a first stiffness or a first mechanical frequency of the casing with the one or more battery modules inserted may differ from a second stiffness or a second mechanical frequency associated with a body of a vehicle or another component associated therewith by a threshold amount. Additionally, the casing may be configured with vents for venting the hot gases, such as those generated by a battery module in a thermal runaway event.

Abstract: A resource recommendation system is described to recommend and standardize resource tagging in a networked computing environment. In one example, cloud resources and related data are discovered, a database of the discovered information is generated, machine learning is applied to the database to build a prediction model, and tags for the resources are recommended, based on the prediction model, at a computing device.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of posts in mold compound for improved resistance to delamination. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die, a substrate, a redistribution layer, a mold compound and a plurality of posts. The redistribution layer provides electrical connections between circuitry of the first IC die and circuitry of the substrate. The mold compound is disposed in contact with the first IC die and spaced from the substrate by the redistribution layer. The plurality of posts are disposed in the mold compound and are laterally spaced from the first IC die. The plurality of posts are not electrically connected to the circuitry of the first IC die.

Abstract: A battery pack for a vehicle electrical system includes a casing for receiving one or more battery modules. The battery modules are insertable into a casing of the battery pack by sliding couplers along pairs of rails and are securable to the ends of the rails. After insertion, the rails thermally insulate one battery module from other battery modules in the battery pack. Additionally, the battery modules may include a top cover with an insulating material to further thermally insulate one battery module from another battery module. The battery pack may additionally be configured with vents for venting the hot gases, such as those generated by a battery module in a thermal runaway event. Additionally, the battery modules may include a second insulating material disposed between cells and configured to thermally insulate the cells from one another.

Abstract: A chip package and method of fabricating the same are described herein. The chip package generally includes a stand-off which spaces a die from a substrate to control the collapse of a solder joint coupling the die to the substrate.

Abstract: Methods and systems for an ubiquitous collaboration feature in a managed application environment are described herein. The collaboration service and/or server may store session information and one or more configuration files for use in rendering the collaboration features in combination with managed applications executing on a user's computing device.

Abstract: A proactive data recovery system is provided. The system includes a memory having computer-readable instructions stored therein and a processor configured to execute the computer-readable instructions to access a data storage platform and to monitor a plurality of parameters indicative of a requirement of data restore and/or recovery for the data storage platform. The requirement corresponds to a predicted occurrence of a disaster event. The processor is further configured trigger backup of data stored in the data storage platform based upon the plurality of parameters to create a restore package and to initiate the data restore and/or data recovery operation for the data storage platform using the restore package in response to the occurrence of the disaster event.