Abstract: A sealing valve is provided for a sensor that includes a sensing element and a sensor opening that exposes the sensing element. The sealing valve includes a housing that is configured to be mounted to the sensor such that an internal channel of the housing fluidly communicates with the sensor opening. The sealing valve includes a float element configured to float along a surface of the liquid. The float element is configured to move within the internal channel between an open position and a closed position. The float element is configured to close the sensor opening to the internal channel in the closed position. The sensor opening is open to the internal channel when the float element is in the open position. The float element is configured to rise with the surface of the liquid within the internal channel toward the closed position.

Abstract: A method of manufacturing an insulation elbow can include placing raw material at a processing machine. The method can further include implementing, at the processing machine, insulation elbow processing instructions for creating a plurality of insulation elbow segments from the raw material. Each of the plurality of insulation elbow segments can correspond to the insulation elbow such that the plurality of insulation elbow segments are configured to be assembled to form at least part of the insulation elbow. The method can also include creating, at the processing machine, the plurality of insulation elbow segments from the raw material according to the insulation elbow processing instructions and placing the plurality of insulation elbow segments in a package.

Abstract: A device wafer is provided that includes a substrate having major and minor surfaces, and a plurality of active devices located at the major surface. A eutectic alloy composition is formed at the minor surface of the substrate. The eutectic alloy composition is removed from the minor surface of the substrate such that a portion of the eutectic alloy composition remains at an outer perimeter of the minor surface to strengthen the outer perimeter of the substrate. A bonding layer is deposited over the minor surface and over the portion of the eutectic alloy composition at the outer perimeter of the minor surface. The bonding layer is utilized for joining semiconductor components of the device wafer to secondary structures. Additional eutectic alloy composition may remain on the minor surface of the substrate at the streets to strengthen the substrate during device wafer separation.

Abstract: An ideal diode circuit is described which uses an NMOS transistor as a low-loss ideal diode. The control circuit for the transistor is referenced to the anode voltage and not to ground, so the control circuitry may be low voltage circuitry, even if the input voltage is very high, referenced to earth ground. A capacitor is clamped to about 10-20V, referenced to the anode voltage. The clamped voltage powers a differential amplifier for the detecting if the anode voltage is greater than the cathode voltage. The capacitor is charged to the clamped voltage during normal operation of the ideal diode by controlling the conductivity of a second transistor coupled between the cathode and the capacitor, enabling the circuit to be used with a wide range of frequencies and voltages. All voltages applied to the differential amplifier are equal to or less than the clamped voltage.

Abstract: Systems and methods are provided for enhancement of vacuum bagging processes for a composite part. One system includes dispensers configured to dispense materials onto a forming tool for a composite part, and a controller. The controller is able to identify a selected location for placing the composite part on the tool, to direct the dispensers to apply a mold release agent onto the tool based on the selected location, to apply a sealant onto the tool proximate to the selected location, to lay up a ply of constituent material for the composite part atop the mold release agent at the selected location, to apply a pressure pad material atop the constituent material, to apply a breather material atop the pressure pad, and to apply vacuum bag material atop the ply proximate to the selected location to cover the ply as well as the sealant.

Abstract: A file system is setup in user space of an operating system (OS) of a device without editing kernal code of the OS. Data of a file at the device is archived to a target location. The data of the file is replaced with a link to the target location. The archived data is retrieved via the file system in response to an input/output (I/O) request to the data of the file.

Abstract: The present invention relates to methods of treating, preventing, and/or improving disorders and conditions related to certain metabolic abnormalities including methods of improving blood lipid profiles and muscle recovery and repair in athletes, methods of treating fibromyalgia, erectile dysfunction, diseases associated with certain HLA-DQ gene alleles and/or gluten intolerance, including Celiac Disease, headaches and migraines, as well as idiopathic neuropathy, inability to sleep, inability to concentrate, and/or neurological development issues in children, the methods involving the administration of one or more downstream folate compounds and optionally methyl-B12. In one particular embodiment, the method comprises administration of L-methylfolate. In certain embodiments, the method further involves identifying a subject organism with a malfunction in one or more of the folate or B4 cycles. In certain embodiments, such a malfunction is one or more of the C677T and A1298C genetic polymorphisms.

Abstract: Systems and methods are provided for enhancement of vacuum bagging processes for a composite part. One system includes dispensers configured to dispense materials onto a forming tool for a composite part, and a controller. The controller is able to identify a location for placing the composite part on the tool, and to direct the dispensers to lay up a laminate of constituent material for the composite part at the location. The controller is also able to direct the dispensers to spray vacuum bag material atop the laminate to form a vacuum bag that covers the laminate.

Abstract: A floor lighting assembly includes a luminous composite sheet and a light transmissive carpet. The luminous composite sheet has a top side, a bottom side, and an edge extending from the top side to the bottom side. The light sources are arranged in a row and are configured to emit light into the light guide film through the edge. The light transmissive carpet is disposed above the top side of the light guide film. The light transmissive carpet includes a backing structure and a pile mounted to and extending from the backing structure. The light guide film is configured to spread and redirect the light that is received therein through the edge for emitting the light through the top side of the light guide film such that some of the light is transmitted through the light transmissive carpet.

Abstract: A platform load sensing system connected between a boom and a platform includes an upper bearing link connecting the boom side to the platform side, and a lower bearing link connecting the boom side to the platform side. The upper and lower bearing links are configured to allow for relative motion between the boom side and the platform side. A load member is secured to the platform side between the upper and lower bearing links, and a load cell is secured to the boom side. A load moment on the platform side is functionally eliminated by the upper and lower bearing links, and a vertical load on the platform side is transferred through the load member to the load cell.

Abstract: The present invention provides for a composition comprising a pigment, wherein the composition is suitable for coating a surface that is, or is expected to be, exposed to the sun. The pigment comprises particles that fluoresce in sunlight, thereby remaining cooler in the sun than coatings pigmented with non-fluorescent particles. The particles comprise solids that fluoresce or glow in the visible or near infrared (NIR) spectra, or that fluoresce when doped. Suitable dopants include, but are not limited to, ions of rare earths and transition metals. A coating composition includes: (i) a film-forming resin; (ii) an infrared reflective pigment; and (iii) an infrared fluorescent pigment different from the infrared reflective pigment.

Abstract: Described herein are ?9-THC prodrugs, methods of making ?9-THC prodrugs, formulations comprising ?9-THC prodrugs and methods of using ?9-THC. One embodiment described herein relates to the transdermal administration of a ?9-THC prodrug for treating and preventing diseases and/or disorders.

Abstract: A floor lighting assembly includes a luminous composite sheet and a light transmissive carpet. The luminous composite sheet has a top side, a bottom side, and an edge extending from the top side to the bottom side. The light sources are arranged in a row and are configured to emit light into the light guide film through the edge. The light transmissive carpet is disposed above the top side of the light guide film. The light transmissive carpet includes a backing structure and a pile mounted to and extending from the backing structure. The light guide film is configured to spread and redirect the light that is received therein through the edge for emitting the light through the top side of the light guide film such that some of the light is transmitted through the light transmissive carpet.

Abstract: A device wafer is provided that includes a substrate having major and minor surfaces, and a plurality of active devices located at the major surface. A eutectic alloy composition having a first thickness is formed at the minor surface of the substrate. The eutectic alloy composition is partially removed from the minor surface of the substrate such that a second thickness of the eutectic alloy composition remains on the minor surface, the second thickness being less than the first thickness. A bonding layer is deposited over the eutectic alloy composition. The bonding layer is utilized for joining semiconductor components of the device wafer to secondary structures.

Abstract: A device wafer is provided that includes a substrate having major and minor surfaces, and a plurality of active devices located at the major surface. A eutectic alloy composition is formed at the minor surface of the substrate. The eutectic alloy composition is removed from the minor surface of the substrate such that a portion of the eutectic alloy composition remains at an outer perimeter of the minor surface to strengthen the outer perimeter of the substrate. A bonding layer is deposited over the minor surface and over the portion of the eutectic forming alloy composition at the outer perimeter of the minor surface. The bonding layer is utilized for joining semiconductor components of the device wafer to secondary structures. Additional eutectic alloy composition may remain on the minor surface of the substrate at the streets to strengthen the substrate during device wafer separation.

Abstract: Disclosed are systems, methods, and non-transitory computer-readable media for authorizing transactions based on a private key stored in secure hardware on an authorized client device. An authorization system receives an external authorization request identifying a user account and a requested action. The authorization system transmits, to a client device associated with the user account, an internal authorization request that causes the client device to present a prompt to authorize the requested action. The authorization system receives an internal authorization message indicating that the requested action has been authorized. The internal authorization message includes a digital signature that was generated by the client device using a private key stored in a secure hardware of the client device.

Abstract: A surgical instrument comprises a first arm including a first closed loop engageable with a first spinal implant disposed with a first vertebral surface. A second arm is movable relative to the first arm and includes a second closed loop engageable with a second spinal implant disposed with a second vertebral surface. Surgical systems, constructs, implants and methods are disclosed.

Abstract: A surgical retractor comprises at least one blade including a first arm and a second arm spaced apart from the first arm. The at least one blade further including a member being disposed with the arms to support at least one surgical instrument in a selected orientation relative to a surgical site. Surgical systems, instruments, constructs, implants and methods are disclosed.

Abstract: Described herein are ?9-THC prodrugs, methods of making ?9-THC prodrugs, formulations comprising ?9-THC prodrugs and methods of using ?9-THC. One embodiment described herein relates to the transdermal administration of a ?9-THC prodrug for treating and preventing diseases and/or disorders.

Abstract: A power trowel blade that is made of non-rusting solid component material for use with a power trowel apparatus. The trowel blade include a mounting surface and an oppositely facing finishing surface. The finishing surface is flush and free of voids or protrusions. The flush finishing surface prevents surface material being collected as the trowel blade is used to finish surfaces to a hard finish.