Patents by Inventor Jen-An Chang

Jen-An Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153842
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240152327
    Abstract: A computing circuit is provided. The computing circuit is disposed in a memory device and electrically coupled to a memory cell of the memory device. The computing circuit includes a weight decoder, a multiplier, an adder tree, and an accumulator. The weight decoder is configured to obtain a compressed weight from the memory cell and generate a decoded weight based on the compressed weight. The multiplier is configured to generate a partial-product by multiplying an input signal with the decoded weight. The adder tree is configured to generate a partial-sum by performing an addition operation based on the partial-product. The accumulator is configured to generate an accumulated sum by performing an accumulation operation based on the partial-sum and output an output signal based on the accumulated sum. The accumulated sum is left shifted based on a shift signal.
    Type: Application
    Filed: February 3, 2023
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Win-San Khwa, Chuan-Jia Jhang, Yi-Lun Lu, Jui-Jen Wu, Meng-Fan Chang
  • Publication number: 20240152326
    Abstract: A memory device includes a memory array, a multiply-accumulate (MAC) circuit and an encoder-decoder circuit. The MAC circuit performs a MAC operation on an encoded weight data stored in the memory array and an input data to generate a partial MAC result. An encoder of the encoder-decoder circuit is configured to encode m weight bits among n weight bits of weight data according to an encryption key to generate the encoded weight data, wherein m and n are positive integers, and m is less than n. A decoder of the encoder-decoder circuit is configured to detect an error in the partial MAC result according to the encryption key to generate a decoded partial MAC result.
    Type: Application
    Filed: February 3, 2023
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Win-San Khwa, Meng-Fan Chang, Jui-Jen Wu, Chuan-Jia Jhang
  • Publication number: 20240145697
    Abstract: A multi-layer cathode coating for positive electrode of a rechargeable electrochemical cell (or secondary cell) (such as a lithium-ion secondary battery) and a secondary battery including a cathode having a multi-layer cathode coating. Multi-layer cathode coatings containing blends of one or more cathode active materials in certain weight ratios thereof.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: SAFT AMERICA
    Inventors: Xilin Chen, Frank Cao, Carine Margez Steinway, Kamen Nechev, Shih-Chieh Liao, Chia-Ming Chang, Dar-Jen Liu
  • Publication number: 20240142440
    Abstract: This disclosure provides photosensitive probes useful for photoactivated and tagging of subsets of biomolecules. These photosensitive probes described herein may be especially useful for selectively tagging and proximity labeling of biomolecules via selective light illumination through a microscope system. The methods and compositions may be particularly useful for analyzing biological samples, such as identifying proximal biomolecules in cell or tissue samples.
    Type: Application
    Filed: October 16, 2023
    Publication date: May 2, 2024
    Inventors: Hsiao-Jen CHANG, Jung-Chi LIAO
  • Patent number: 11972585
    Abstract: Machine learning is used to train a network to estimate a three-dimensional (3D) body surface and body regions of a patient from surface images of the patient. The estimated 3D body surface of the patient is used to determine an isocenter of the patient. The estimated body regions are used to generate heatmaps representing visible body region boundaries and unseen body region boundaries of the patient. The estimation of 3D body surfaces, the determined patient isocenter, and the estimated body region boundaries may assist in planning a medical scan, including automatic patient positioning.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: April 30, 2024
    Assignee: Siemens Healthineers AG
    Inventors: Yao-Jen Chang, Jiangping Wang, Vivek Singh, Ruhan Sa, Ankur Kapoor, Andreas Wimmer
  • Patent number: 11973799
    Abstract: A domain processing system is enhanced with a first-pass domain filter configured for loading character strings representing a pair of domains consisting of a seed domain and a candidate domain in a computer memory, computing a similarity score and a dynamic threshold for the pair of domains, determining whether the similarity score exceeds the dynamic threshold, and iterating the loading, the computing, and the determining for each of a plurality of candidate domains paired with the seed domain. A similarity score between the seed domain and the candidate domain and a corresponding dynamic threshold for the pair are computed. If the similarity score exceeds the corresponding dynamic threshold, the candidate domain is provided to a downstream computing facility. Otherwise, it is dropped. In this way, the first-pass domain filter can significantly reduce the number of domains that otherwise would need to be processed by the downstream computing facility.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: April 30, 2024
    Assignee: PROOFPOINT, INC.
    Inventors: Hung-Jen Chang, Ali Mesdaq, Gaurav Dalal, Kevin Dedon
  • Publication number: 20240133908
    Abstract: A method of determining a 3D center location of a specimen container on a track. The method includes providing a calibration object on the track; providing an initially calibrated image capture device adjacent to the track; moving the calibration object to at least two different longitudinal positions along the track; capturing a first image with the calibration object located at the first longitudinal position; capturing a second image with the calibration object located at the second longitudinal position; and determining a three-dimensional path trajectory of a center location along the track based at least upon the first image and the second image. The method can be used to determine a 3D center location of a specimen container imaged anywhere within a viewing area. Characterization apparatus and specimen testing apparatus adapted to carry out the methods are described, as are other aspects.
    Type: Application
    Filed: February 10, 2022
    Publication date: April 25, 2024
    Applicant: Siemens Healthcare Diagnostics Inc.
    Inventors: Rayal Raj Prasad Nalam Venkat, Yao-Jen Chang, Benjamin S. Pollack, Ankur Kapoor
  • Publication number: 20240133909
    Abstract: A method of aligning a component to a structure in a diagnostic laboratory system. The method includes aligning a position sensor to the structure; sensing a position of the component using the position sensor; and calculating the position of the component relative to the structure based at least in part on the sensing. Other methods, apparatus, and systems are disclosed.
    Type: Application
    Filed: February 10, 2022
    Publication date: April 25, 2024
    Applicant: Siemens Healthcare Diagnostics Inc.
    Inventors: Rayal Raj Prasad Nalam Venkat, Yao-Jen Chang, Benjamin S. Pollack, Ankur Kapoor
  • Publication number: 20240132621
    Abstract: Disclosed herein an isolated neutralizing antibody, which is capable of specifically binding to chitinase-3-like protein-1 (YKL-40) and uses thereof. The neutralizing antibody can further conjugate with a metal chelator to form an antibody complex. Further, labeling the antibody complex with a radioactive metal nuclide results in formation of a radioactive antibody complex, which can be used as a contrast agent and treatment for YKL-40 over-expression-related diseases. The radioactive antibody complex can specifically bind to YKL-40, and can be used for diagnosis and the preparation of the use of the treatment for cancers related to YKL-40 over-expression.
    Type: Application
    Filed: April 18, 2023
    Publication date: April 25, 2024
    Inventors: Ming-Cheng Chang, Ping-Fang Chiang, Yu-Jen Kuo
  • Publication number: 20240126002
    Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 18, 2024
    Applicant: Coretronic Corporation
    Inventors: Chih-Jen Tsang, Chung-Wei Huang, Shih-Yen Cheng, Jung-Wei Chang, Han-Yuan Liu, Chun-Wei Lee
  • Publication number: 20240129458
    Abstract: A method coding video data includes receiving a block of video data, wherein chroma samples of the block of video data are subsampled relative to luma samples of the block of video data (e.g., 4:2:0 or 4:2:2 video content). A video coder may determine a subsampling technique, from a plurality of subsampling techniques, for the luma samples of the block of video data for a cross-component prediction mode, and may code the block of video data using the subsampling technique and the cross-component prediction mode. A first subsampling technique of the plurality of subsampling techniques includes not applying subsampling to the luma samples of the block of video data, and a second subsampling technique of the plurality of subsampling techniques includes a combination of downsampling filters to be applied to the luma samples of the block.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 18, 2024
    Inventors: Yao-Jen Chang, Vadim Seregin, Bappaditya Ray, Marta Karczewicz
  • Publication number: 20240128341
    Abstract: The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate structure on the first semiconductor layer. The gate structure includes a first stack disposed on the first semiconductor layer and a second stack disposed on the first stack. The first stack includes a first sidewall adjacent to the drain region and a second sidewall opposite to the first sidewall in a first direction parallel to a top surface of the base pattern. The first sidewall is at a first distance from the second stack in the first direction, and the second sidewall is at a second distance from the second stack in the first direction. The first distance is greater than the second distance.
    Type: Application
    Filed: December 14, 2022
    Publication date: April 18, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Chia-Hao Chang, Jih-Wen Chou, Hwi-Huang Chen, Hsin-Hong Chen, Yu-Jen Huang
  • Patent number: 11963296
    Abstract: A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: April 16, 2024
    Assignee: Google LLC
    Inventors: Yuan Jen Chang, Ronald Trinidad
  • Publication number: 20240118862
    Abstract: A computer system and a processing method thereof of sound signal are provided. The computer system includes a platform path controller (PCH), a high-definition audio (HDA) codec, and a digital microphone. The HDA codec is coupled to the PCH. The digital microphone is coupled to the PCH and the HDA codec. The digital microphone is used to generate sound signal. The HDA codec processes the sound signal from the digital microphone. Accordingly, the audio recording with high quality could be provided.
    Type: Application
    Filed: November 16, 2022
    Publication date: April 11, 2024
    Applicant: Acer Incorporated
    Inventors: Po-Jen Tu, Jia-Ren Chang, Kai-Meng Tzeng, Ming-Chun Yu
  • Publication number: 20240120082
    Abstract: Methods of predicting a fault in a diagnostic laboratory system include providing one or more sensors; generating data using the one or more sensors; inputting the data into an artificial intelligence algorithm, the artificial intelligence algorithm configured to predict at least one fault in the diagnostic laboratory system in response to the data; and predicting at least one fault in the diagnostic laboratory system using the artificial intelligence algorithm. Other methods, systems, and apparatus are also disclosed.
    Type: Application
    Filed: February 7, 2022
    Publication date: April 11, 2024
    Applicant: Siemens Healthcare Diagnostics Inc.
    Inventors: Vivek Singh, Rayal Raj Prasad Nalam Venkat, Yao-Jen Chang, Venkatesh NarasimhaMurthty, Benjamin S. Pollack, Ankur Kapoor
  • Publication number: 20240118300
    Abstract: Apparatus for robotic arm alignment in an automated sample analysis system includes a robotic arm, a sample tube carrier, a plurality of optical components (including, e.g., one or more cameras), and a controller. The controller is operative to process images received from the optical components to determine a first set of coordinates of a first marker relative to the sample tube carrier and determine a second set of coordinates of a second marker relative to the robotic arm. The controller is further operative to adjust the position of the robotic arm and/or the sample tube carrier in response to an excessive offset between the first and second sets of coordinates. In some embodiments, a positioning tool includes the first and second markers thereon. Methods of robotic arm alignment with a sample tube carrier in an automated sample analysis system are also provided, as are other aspects.
    Type: Application
    Filed: February 10, 2022
    Publication date: April 11, 2024
    Applicant: Siemens Healthcare Diagnostics Inc.
    Inventors: Yao-Jen Chang, Rayal Raj Prasad Nalam Venkat, Benjamin S. Pollack, Ankur Kapoor
  • Patent number: 11955132
    Abstract: An identifying method of a sound watermark and a sound watermark identifying apparatus are provided. The method includes the following. A synthesized sound signal is received through a network. Noise interference transferred through the network in the synthesized sound signal is determined according to a reflection-cancelling sound signal. A coding threshold is determined according to the noise interference. A sound watermark signal in the synthesized sound signal is identified according to the coding threshold.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: April 9, 2024
    Assignee: Acer Incorporated
    Inventors: Po-Jen Tu, Jia-Ren Chang, Kai-Meng Tzeng
  • Patent number: 11956272
    Abstract: Aspects of the disclosure relate to identifying legitimate websites and removing false positives from domain discovery analysis. Based on a list of known legitimate domains, a computing platform may generate a baseline dataset of feature vectors corresponding to the known legitimate domains. Subsequently, the computing platform may receive information identifying a first domain for analysis and may execute one or more machine learning algorithms to compare the first domain to the baseline dataset. Based on execution of the one or more machine learning algorithms, the computing platform may generate first domain classification information indicating that the first domain is a legitimate domain. In response to determining that the first domain is a legitimate domain, the computing platform may send one or more commands directing a domain identification system to remove the first domain from a list of indeterminate domains maintained by the domain identification system.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: April 9, 2024
    Assignee: Proofpoint, Inc.
    Inventors: Hung-Jen Chang, Gaurav Mitesh Dalal, Ali Mesdaq
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao