Abstract: Disclosed herein an isolated neutralizing antibody, which is capable of specifically binding to chitinase-3-like protein-1 (YKL-40) and uses thereof. The neutralizing antibody can further conjugate with a metal chelator to form an antibody complex. Further, labeling the antibody complex with a radioactive metal nuclide results in formation of a radioactive antibody complex, which can be used as a contrast agent and treatment for YKL-40 over-expression-related diseases. The radioactive antibody complex can specifically bind to YKL-40, and can be used for diagnosis and the preparation of the use of the treatment for cancers related to YKL-40 over-expression.

Abstract: A method of aligning a component to a structure in a diagnostic laboratory system. The method includes aligning a position sensor to the structure; sensing a position of the component using the position sensor; and calculating the position of the component relative to the structure based at least in part on the sensing. Other methods, apparatus, and systems are disclosed.

Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: A method coding video data includes receiving a block of video data, wherein chroma samples of the block of video data are subsampled relative to luma samples of the block of video data (e.g., 4:2:0 or 4:2:2 video content). A video coder may determine a subsampling technique, from a plurality of subsampling techniques, for the luma samples of the block of video data for a cross-component prediction mode, and may code the block of video data using the subsampling technique and the cross-component prediction mode. A first subsampling technique of the plurality of subsampling techniques includes not applying subsampling to the luma samples of the block of video data, and a second subsampling technique of the plurality of subsampling techniques includes a combination of downsampling filters to be applied to the luma samples of the block.

Abstract: The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate structure on the first semiconductor layer. The gate structure includes a first stack disposed on the first semiconductor layer and a second stack disposed on the first stack. The first stack includes a first sidewall adjacent to the drain region and a second sidewall opposite to the first sidewall in a first direction parallel to a top surface of the base pattern. The first sidewall is at a first distance from the second stack in the first direction, and the second sidewall is at a second distance from the second stack in the first direction. The first distance is greater than the second distance.

Abstract: A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.

Abstract: Methods of predicting a fault in a diagnostic laboratory system include providing one or more sensors; generating data using the one or more sensors; inputting the data into an artificial intelligence algorithm, the artificial intelligence algorithm configured to predict at least one fault in the diagnostic laboratory system in response to the data; and predicting at least one fault in the diagnostic laboratory system using the artificial intelligence algorithm. Other methods, systems, and apparatus are also disclosed.

Abstract: A computer system and a processing method thereof of sound signal are provided. The computer system includes a platform path controller (PCH), a high-definition audio (HDA) codec, and a digital microphone. The HDA codec is coupled to the PCH. The digital microphone is coupled to the PCH and the HDA codec. The digital microphone is used to generate sound signal. The HDA codec processes the sound signal from the digital microphone. Accordingly, the audio recording with high quality could be provided.

Abstract: Apparatus for robotic arm alignment in an automated sample analysis system includes a robotic arm, a sample tube carrier, a plurality of optical components (including, e.g., one or more cameras), and a controller. The controller is operative to process images received from the optical components to determine a first set of coordinates of a first marker relative to the sample tube carrier and determine a second set of coordinates of a second marker relative to the robotic arm. The controller is further operative to adjust the position of the robotic arm and/or the sample tube carrier in response to an excessive offset between the first and second sets of coordinates. In some embodiments, a positioning tool includes the first and second markers thereon. Methods of robotic arm alignment with a sample tube carrier in an automated sample analysis system are also provided, as are other aspects.

Abstract: An identifying method of a sound watermark and a sound watermark identifying apparatus are provided. The method includes the following. A synthesized sound signal is received through a network. Noise interference transferred through the network in the synthesized sound signal is determined according to a reflection-cancelling sound signal. A coding threshold is determined according to the noise interference. A sound watermark signal in the synthesized sound signal is identified according to the coding threshold.

Abstract: Aspects of the disclosure relate to identifying legitimate websites and removing false positives from domain discovery analysis. Based on a list of known legitimate domains, a computing platform may generate a baseline dataset of feature vectors corresponding to the known legitimate domains. Subsequently, the computing platform may receive information identifying a first domain for analysis and may execute one or more machine learning algorithms to compare the first domain to the baseline dataset. Based on execution of the one or more machine learning algorithms, the computing platform may generate first domain classification information indicating that the first domain is a legitimate domain. In response to determining that the first domain is a legitimate domain, the computing platform may send one or more commands directing a domain identification system to remove the first domain from a list of indeterminate domains maintained by the domain identification system.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A power adapter can include a power input node, a communication channel node, an output node, a low-pass filter, a modulator, and a high-pass filter. The low-pass filter can include a low-pass input node coupled to the power input node and a low-pass output node coupled to the output node. The modulator can include a modulator input node coupled to the communication channel node and a modulator output node. The modulator can be configured to modulate data received from the communication channel node onto a signal having a higher frequency than a data-carrying signal carrying the data received from the communication channel node and output the modulated data to a high-pass input node of a high-pass filter. The high-pass filter can include the high-pass input node coupled to the modulator output node and a high-pass output node coupled to the output node.

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: An IC structure includes a first active area including a first plurality of fin structures extending in a first direction, a second active area including a second plurality of fin structures extending in the first direction, an electrical fuse (eFuse) extending in the first direction between the first and second active areas and electrically connected to each of the first and second pluralities of fin structures, a first plurality of gate structures extending over the first active area perpendicular to the first direction, a second plurality of gate structures extending over the second active area in the second direction, a first signal line extending in the first direction adjacent to the first active area and electrically connected to the first plurality of gate structures, and a second signal line extending in the first direction adjacent to the second active area and electrically connected to the second plurality of gate structures.

Abstract: A circuit includes a reference voltage node, first and second data lines, a sense amplifier, first and second switching devices coupled between the first and second data lines and first and second input terminals of the sense amplifier, third and fourth switching devices coupled between the first and second data lined and first and second nodes, fifth and sixth switching devices coupled between the first and second nodes and the reference voltage node, and first and second capacitive devices coupled between the first and second nodes and second and first input terminals. Each of the first through fourth switching devices is switched on and each of the fifth and sixth switching devices is switched off in a first operational mode, and each of the first through fourth switching devices is switched off and each of the fifth and sixth switching devices is switched on in a second operational mode.

Abstract: To find enriching contextual information for an abbreviated domain name, a data enrichment engine can comb through web content source code corresponding to the abbreviated domain name. From textual content in the web content source code, the data enrichment engine can identify words with initial characters that match characters of the abbreviated domain name to thereby establish a relationship there-between. This relationship can facilitate more accurate and efficient domain name classification. The data enrichment engine can query a WHOIS server to find out if candidate domains having initial characters that match the characters of the abbreviated domain name are registered to the same entity. If so, keywords can be extracted from the candidate domains and used to find more relevant domains for domain risk analysis and detection. Candidate domains determined by the data enrichment engine can be provided to a downstream computing facility such as a domain filter.

Abstract: A focus has an opening and an upper surface surrounding the opening. The opening is configured to accommodate a SiC wafer. The SiC wafer has a first surface and a second surface opposite to the first surface. When the focus ring is mounted in a semiconductor wafer processing apparatus and the SiC wafer is positioned in the opening of the focus ring, the upper surface of the focus ring is lower than the first surface of the SiC wafer and is higher than the second surface of the SiC wafer.