Abstract: A package structure is provided. The package structure includes a substrate, a first electronic component, a first electrical connector, and a protective layer. The first electronic component is over the substrate. The first electrical connector is between the substrate and the first electronic component. The protective layer encapsulates the first electrical connector. The protective layer has a first curved lateral surface concave toward the first electrical connector and recessed with respect to a lateral surface of the first electronic component.

Abstract: An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.

Abstract: A method includes providing a first electrode, forming a stack of magnetic tunneling junction (MTJ) layers on the first electrode, forming a second electrode on the stack of MTJ layers, and forming a hybrid hard mask on the second electrode. The hybrid hard mask includes a first material layer, a second material layer, and a third material layer. The method also includes patterning the third material layer and the second material layer, patterning the first material layer while using the patterned third material layer and the patterned second material layer as a first mask, patterning the second electrode while using the patterned first material layer as a second mask, and etching the stack of MTJ layers and the first electrode using the patterned second electrode as a third mask. After the etching the stack of MTJ layers and the first electrode, the hybrid hard mask is completely removed.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, and a driving assembly. The movable part is for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is for driving the movable part to move relative to the fixed part. The optical element is used to correspond to an electromagnetic wave.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, a driving assembly, and a first supporting assembly. The movable part is used for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is used for driving the movable part to move relative to the fixed part. The movable part is movable relative to the fixed part through the support of the first supporting assembly. There is a gap between the movable part and the fixed part.

Abstract: A semiconductor device includes a plurality of interlayer dielectric layers, a memory cell, and a first capping layer. The memory cell is embedded in the interlayer dielectric layers, the first capping layer covers the memory cell and surrounds the sidewalls of the memory cell, the first capping layer includes a hydrogen absorbing material, and the hydrogen absorbing material prevents hydrogen gas from entering the memory cell.

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor device includes a resistive random access memory (RRAM) device, a dual damascene structure, and a spacer. The dual damascene structure is disposed near the RRAM device, and the spacer is disposed in a sidewall of the RRAM device. The RRAM device includes a lower electrode, a metal oxide layer, and an upper electrode. The metal oxide layer is disposed on the lower electrode, and the upper electrode is disposed on the metal oxide layer. The dual damascene structure includes a via and a wire disposed on the via, in which a top part of the wire is coplanar with a top part of the upper electrode in the RRAM device.

Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.

Abstract: A force sensing device is mounted on a tool to sense force, particularly quasi-static and static forces. The force sensing device includes at least one a sensor. A piezoelectric element in the sensor includes a driving portion and a sensing portion. A first voltage is input to the driving portion to generate a vibration in the piezoelectric element and a second voltage in response to the vibration is output from the sensing portion. The second voltage output from the sensing portion is changed as the vibration in the piezoelectric element is suppressed by an external force acting on the force sensing device so variation of the second voltage can be used to measure the external force.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the optical element relative to the fixed part.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the optical element relative to the fixed part.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the optical element relative to the fixed part.

Abstract: A magnetic tunnel junction (MTJ) structure and a memory cell are provided. The MTJ includes a barrier layer, a free layer and a metal oxide cap layer. The free layer is disposed on the barrier layer. The metal oxide cap layer is disposed on the free layer. The metal oxide cap layer has a first surface and a second surface opposite to the first surface. The first surface of the metal oxide cap layer is in contact with the free layer. In a direction of a thickness of the metal oxide cap layer, both of an oxygen concentration at the first surface of the metal oxide cap layer and an oxygen concentration at the second surface of the metal oxide cap layer are higher than an oxygen concentration in a middle portion of the metal oxide cap layer.

Abstract: Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

Abstract: A device structure includes: an interposer including metal wiring structures and optical waveguides that are embedded in interlayer dielectric layers, wherein the interposer includes a stepped outer sidewall including an outermost vertical surface segment, a laterally-recessed sidewall segment that is laterally recessed relative to the outermost vertical surface segment, and a connecting horizontal surface segment that connects the outermost vertical surface segment and the laterally-recessed vertical sidewall segment; and a fiber access unit having a first end that is optically coupled to a subset of the optical waveguides through at least one optical glue portion that is interposed between the fiber access unit and the laterally-recessed sidewall segment of the stepped outer sidewall.

Abstract: A method for etching a magnetic tunneling junction (MTJ) structure is described. A MTJ stack is deposited on a bottom electrode wherein the MTJ stack comprises at least a pinned layer, a barrier layer on the pinned layer, and a free layer on the barrier layer, A top electrode layer is deposited on the MTJ stack. A hard mask is deposited on the top electrode layer. The top electrode layer and hard mask are etched. Thereafter, the MTJ stack not covered by the hard mask is etched, stopping at or within the pinned layer. Thereafter, an encapsulation layer is deposited over the partially etched MTJ stack and etched away on horizontal surfaces leaving a self-aligned hard mask on sidewalls of the partially etched MTJ stack. Finally, the remaining MTJ stack not covered by hard mask and self-aligned hard mask is etched to complete the MTJ structure.

Abstract: An optical element driving system is provided. The optical element driving system includes an optical element driving mechanism and a control assembly. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used for connecting to an optical element. The movable portion is movable relative to the fixed portion. The movable portion is in an accommodating space in the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. The control assembly provides a driving signal to the driving assembly to control the driving assembly. The driving assembly includes a first driving element, and the material of the first driving element includes shape memory alloy.