Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.

Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.

Abstract: An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.

Abstract: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.

Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.

Abstract: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.

Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.

Abstract: A speaker includes a diaphragm and a MEMS actuator. The MEMS actuator includes a coupling member attached to the diaphragm and at least one closed cantilever ring that is surrounded around and connected to the coupling member by plural first bridge members, wherein the closed cantilever ring is configured to be electrically-biased to cause an axial movement of the coupling member and the diaphragm.

Abstract: A speaker includes a diaphragm and a MEMS actuator. The MEMS actuator includes a coupling member attached to the diaphragm and at least one closed cantilever ring that is surrounded around and connected to the coupling member by plural first bridge members, wherein the closed cantilever ring is configured to be electrically-biased to cause an axial movement of the coupling member and the diaphragm.

Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.

Abstract: A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.

Abstract: A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.

Abstract: An air pressure sensing system including a first sensing unit and a second sensing unit is provided. The first sensing unit includes a substrate, a diaphragm, and a supporting member. The substrate has a cavity connected with an exterior environment. The diaphragm is movably and deformably disposed at the substrate and suspended in the cavity. An electrostatic force is provided to the substrate and the diaphragm to move the diaphragm, such that a portion of the base, the supporting member and the diaphragm are contacted with each other and a closed space is formed therebetween in the cavity. The closed space and the exterior environment are divided by the diaphragm, and the diaphragm is deformed due to an air pressure difference between the closed space and the exterior environment. An air pressure sensing method is also provided.

Abstract: A MEMS microphone package structure is provided to have a circuit substrate, an acoustic wave transducer, an application-specific integrated circuit, a lid, and at least two solder pads. The circuit substrate has a top surface, a bottom surface, and a sound hole passing through the top surface and the bottom surface. The acoustic wave transducer and the application-specific integrated circuit are disposed on the top surface and electrically connected. The lid is disposed on the top surface and made by a multilayer printed circuit boards. The lid surrounds and covers the acoustic wave transducer and the application-specific integrated circuit. The lid further has a shielding layer completely disposed on inner surfaces of the lid and two embedded first metal layers served for signal transmission and grounding and electrically connected with the solder pads respectively.

Abstract: An air pressure sensing system including a first sensing unit and a second sensing unit is provided. The first sensing unit includes a substrate, a diaphragm, and a supporting member. The substrate has a cavity connected with an exterior environment. The diaphragm is movably and deformably disposed at the substrate and suspended in the cavity. An electrostatic force is provided to the substrate and the diaphragm to move the diaphragm, such that a portion of the base, the supporting member and the diaphragm are contacted with each other and a closed space is formed therebetween in the cavity. The closed space and the exterior environment are divided by the diaphragm, and the diaphragm is deformed due to an air pressure difference between the closed space and the exterior environment. An air pressure sensing method is also provided.

Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions. The acoustic transducer further has a connecting portion that is connected to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The vibratile portions are geometrically different. Thereby, the vibratile portions can vibrate independently. This allows a designer to easily enhance the dynamic range of the acoustic transducer by geometrically modifying the vibrating membrane without increasing the total area of the vibrating membrane while maintaining a certain good degree of sensitivity and signal-to-noise ratio.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

Abstract: Provided is a micro-electro-mechanical system (MEMS) chip package, including a circuit substrate, a MEMS chip, a driving chip, a cover, an insulator, and at least one first pad. The circuit substrate has a first surface and a second surface opposite to each other. The circuit substrate has a sound port passing through the first surface and the second surface. The MEMS chip is disposed on the first surface of the circuit substrate. The driving chip is electrically connected to the MEMS chip. The cover is disposed on the first surface of the circuit substrate. The cover covers the MEMS chip and the driving chip. The insulator covers the cover. The first pad is electrically connected to the driving chip by a first electrical path.

Abstract: A MEMS microphone package structure having a non-planar substrate is provided. It includes a non-planar substrate, a lid and a transducer. The non-planar substrate includes a bearing base and a peripheral wall connecting to the bearing base. The lid is covered and connected to the non-planar substrate to form a cavity, and at least one solder pad is disposed on an outer surface of the lid or the non-planar substrate. The transducer is disposed in the cavity. A sound hole is provided to correspond to the transducer, and the sound hole is disposed at the non-planar substrate or the lid.