Patents by Inventor Jen-Yi Chen

Jen-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12129169
    Abstract: Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: October 29, 2024
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Kai-Yu Jiang
  • Publication number: 20240267027
    Abstract: A resonant structure in micro electro mechanical systems includes a main body and at least one electrode. The main body has a major axis. The main body includes an induction portion and a support portion. The induction portion has at least one first induction side surface that is not parallel to the major axis. The main body has a plurality of first protruding teeth on the first induction side surface. The electrode has a second induction side surface that is not parallel to the major axis. The electrode has a plurality of second protruding teeth on the second induction side surface. When a separation distance between the first induction side surface and the second induction side surface is changed, a plurality of surfaces of the first protruding teeth and a plurality of surfaces of the second protruding teeth are configured to produce a capacitance change.
    Type: Application
    Filed: May 14, 2023
    Publication date: August 8, 2024
    Inventors: JEN-YI CHEN, YU-MIN CHUANG, YAN-MING HUANG
  • Patent number: 11930318
    Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 12, 2024
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Yueh-Kang Lee, Jen-Yi Chen, Kai-Yu Jiang
  • Patent number: 11800298
    Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: October 24, 2023
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang
  • Patent number: 11781901
    Abstract: A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: October 10, 2023
    Assignee: MERRY ELECTRONICS CO., LTD.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Yung-Hsiang Chang
  • Patent number: 11671735
    Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
    Type: Grant
    Filed: July 31, 2022
    Date of Patent: June 6, 2023
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
  • Patent number: 11619544
    Abstract: A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. An air gap is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. An adhesive layer is formed between a spacer and a circuit board, and the air gap is formed in an adhesive-absent section between the spacer and the circuit board. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 4, 2023
    Assignee: MERRY ELECTRONICS CO., LTD.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Yueh-Kang Lee
  • Patent number: 11561129
    Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: January 24, 2023
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang, Kai-Yu Jiang
  • Publication number: 20220408197
    Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.
    Type: Application
    Filed: May 6, 2022
    Publication date: December 22, 2022
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang
  • Publication number: 20220404196
    Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.
    Type: Application
    Filed: July 21, 2021
    Publication date: December 22, 2022
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang, Kai-Yu Jiang
  • Patent number: 11509984
    Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: November 22, 2022
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
  • Publication number: 20220369012
    Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
    Type: Application
    Filed: July 31, 2022
    Publication date: November 17, 2022
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
  • Patent number: 11467027
    Abstract: A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. A first through hole is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: October 11, 2022
    Assignee: MERRY ELECTRONICS CO., LTD.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Yueh-Kang Lee
  • Publication number: 20220298010
    Abstract: Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided.
    Type: Application
    Filed: November 26, 2021
    Publication date: September 22, 2022
    Applicant: Merry Electronics Co., Ltd.
    Inventors: Jen-Yi Chen, Yueh-Kang Lee, Kai-Yu Jiang
  • Publication number: 20220303667
    Abstract: An electronic device, including a first substrate, a partition wall structure, a pressurizing component, a second substrate, a shell, and multiple first conductive parts, is provided. The first substrate has a through hole, and a first surface and a second surface that are opposite to each other. The partition wall structure is disposed on the first surface and surrounds to form a first chamber. The pressurizing component is disposed on the partition wall structure and covers the first chamber. The pressurizing component includes at least a mass and a vibration membrane. The shell is disposed on the second substrate and jointly forms a second chamber with the second substrate. The first chamber is formed in the second chamber. The multiple first conductive parts are disposed between the first substrate and the second substrate. There is a gap between any two adjacent first conductive parts.
    Type: Application
    Filed: June 23, 2021
    Publication date: September 22, 2022
    Applicant: Merry Electronics Co., Ltd.
    Inventors: Yueh-Kang Lee, Jen-Yi Chen, Kai-Yu Jiang
  • Publication number: 20220191605
    Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.
    Type: Application
    Filed: January 25, 2021
    Publication date: June 16, 2022
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
  • Patent number: 11223908
    Abstract: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: January 11, 2022
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Kai-Yu Jiang, Jen-Yi Chen, Yueh-Kang Lee
  • Publication number: 20210409873
    Abstract: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.
    Type: Application
    Filed: September 7, 2020
    Publication date: December 30, 2021
    Inventors: Kai-Yu JIANG, Jen-Yi CHEN, Yueh-Kang LEE
  • Publication number: 20210364346
    Abstract: A vibration sensor includes a circuit board, a spacer, a pressure sensing device and a housing. The spacer is located on the circuit board. The pressure sensing device is located on the spacer, and the circuit board, the spacer and the pressure sensing device jointly form a first chamber and an air gap. The housing is mounted on the circuit board to defining a third chamber along with the circuit board, wherein the air gap allows the first chamber venting to the third chamber.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Yueh-Kang LEE
  • Publication number: 20210302225
    Abstract: A vibration sensor includes a circuit board, a pressure sensing device and a metal housing. The circuit board has a concave recess. The pressure sensing device is located on the circuit board and defines a first chamber along with the concave recess of the circuit board. The pressure sensing device includes a support board, a sensor and a pressure-enhancing member. The pressure-enhancing member includes a diaphragm and a mass. The support board, the sensor and the diaphragm of the pressure-enhancing member collectively define a second chamber. The metal housing is located on the circuit board and defines a third chamber along with the circuit board, wherein the circuit board has a sidewall which defines the concave recess and has a first through hole, and the first through hole allows the first chamber venting to the third chamber.
    Type: Application
    Filed: September 15, 2020
    Publication date: September 30, 2021
    Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Yueh-Kang LEE