Patents by Inventor Jen-Yi Chen

Jen-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method of wafer level package
    Publication number: 20060001114
    Abstract: An apparatus of wafer level package for the micro elements and methods of fabricating the same is disclosed. The apparatus is utilized to provide a lid substrate for bonding the lid substrate to a substrate having several micro elements and therefore form a cavity capable of being operated for the micro elements. The openings of the cavity are used to make the micro elements capable of being contacted with the atmosphere and therefore form an apparatus of wafer level package for the micro elements.
    Type: Application
    Filed: August 27, 2004
    Publication date: January 5, 2006
    Inventors: Jen-Yi Chen, Jing-Hung Chiou, Kai-Hsiang Yen