Patents by Inventor Jen-Yi Chen

Jen-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8695426
    Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: April 15, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu Wen Hsu, Shih Ting Lin, Jen Yi Chen, Chao Ta Huang
  • Publication number: 20130323859
    Abstract: A method of semiconductor processing comprises providing a semiconductor wafer in a processing chamber; feeding at least one tungsten-containing precursor in a gas state into the processing chamber for atomic layer deposition (ALD) of tungsten; feeding at least one reducing chemical in a gas state into the processing chamber; and monitoring a concentration of at least one gaseous byproduct in the chamber; and providing a signal indicating concentration of the at least one gaseous byproduct in the chamber. The byproduct is produced by a reaction between the at least one tungsten-containing precursor and the at least one reducing chemical during the ALD.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kun-Ei CHEN, Jen-Yi CHEN, Yi-Chung LIN, Chen-Chieh CHIANG, Ling-Sung WANG
  • Patent number: 8586486
    Abstract: A method of patterning a material layer of a semiconductor device is disclosed, the method including treating a material layer above a semiconductor substrate with plasma oxygen; depositing a layer of photoresist over a first surface of the material layer after the treating of the material layer; patterning the layer of photoresist, thereby forming a patterned photoresist, exposing portions of the material layer; etching the exposed portions of at least the material layer to form at least one contact via in the material layer extending to a source or drain region of a device at a surface of the substrate; and removing the patterned photoresist from the first surface of the material layer.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: November 19, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jen-Yi Chen, Kun-Ei Chen, Ling-Sung Wang, Chen-Chieh Chiang
  • Patent number: 8468665
    Abstract: A method of manufacturing a capacitive microphone comprises providing a substrate having at least one cavity. The method further comprises forming a backplate on the substrate, wherein the backplate has a plurality of holes, and forming a diaphragm on the backplate, wherein there are a first distance and a second distance between the diaphragm and the backplate. The method still further comprises forming an air gap between the backplate and the diaphragm through the first distance, and fastening the diaphragm to the backplate through the second distance.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: June 25, 2013
    Assignee: Industrial Technology Research Institute
    Inventor: Jen-Yi Chen
  • Publication number: 20130157467
    Abstract: A method of patterning a material layer of a semiconductor device is disclosed, the method including treating a material layer above a semiconductor substrate with plasma oxygen; depositing a layer of photoresist over a first surface of the material layer after the treating of the material layer; patterning the layer of photoresist, thereby forming a patterned photoresist, exposing portions of the material layer; etching the exposed portions of at least the material layer to form at least one contact via in the material layer extending to a source or drain region of a device at a surface of the substrate; and removing the patterned photoresist from the first surface of the material layer.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jen-Yi CHEN, Kun-Ei CHEN, Ling-Sung WANG, Chen-Chieh CHANG
  • Publication number: 20120160027
    Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.
    Type: Application
    Filed: August 29, 2011
    Publication date: June 28, 2012
    Applicant: INDUSTRIALTECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu Wen HSU, Shih Ting Lin, Jen Yi Chen, Chao Ta Huang
  • Patent number: 8144899
    Abstract: An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: March 27, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Hsun Song, Jen-Yi Chen, Kai-Hsiang Yen
  • Patent number: 8039910
    Abstract: An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 18, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Kai-Hsiang Yen, Jen-Yi Chen, Po-Hsun Sung
  • Patent number: 8035402
    Abstract: A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: October 11, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Patent number: 7960805
    Abstract: An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielectric layer, and at least one peripheral metal wall. The dielectric layer is sandwiched by the metal layers, and the peripheral metal wall is parallel to a thickness direction of the suspended microstructure and surrounds an edge of the dielectric layer.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: June 14, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Jen-Yi Chen, Chin-Horng Wang
  • Publication number: 20110131794
    Abstract: A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
    Type: Application
    Filed: February 15, 2011
    Publication date: June 9, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Jen-Yi Chen
  • Publication number: 20110121843
    Abstract: A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.
    Type: Application
    Filed: January 31, 2011
    Publication date: May 26, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Patent number: 7912235
    Abstract: A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: March 22, 2011
    Assignee: Industrial Technology Research Institute
    Inventor: Jen-Yi Chen
  • Patent number: 7902843
    Abstract: A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: March 8, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Publication number: 20100084723
    Abstract: An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielectric layer, and at least one peripheral metal wall. The dielectric layer is sandwiched by the metal layers, and the peripheral metal wall is parallel to a thickness direction of the suspended microstructure and surrounds an edge of the dielectric layer.
    Type: Application
    Filed: January 5, 2009
    Publication date: April 8, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jen-Yi Chen, Chin-Horng Wang
  • Publication number: 20090115430
    Abstract: A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.
    Type: Application
    Filed: April 28, 2008
    Publication date: May 7, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Jen Fang, Jen-Yi Chen, Kai-Hsiang Yen, Po-Hsun Sung
  • Publication number: 20090101998
    Abstract: An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transducing and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.
    Type: Application
    Filed: December 27, 2007
    Publication date: April 23, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Hsiang Yen, Jen-Yi Chen, Po-Hsun Sung
  • Publication number: 20090086999
    Abstract: An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.
    Type: Application
    Filed: July 31, 2008
    Publication date: April 2, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Hsun SONG, Jen-Yi CHEN, Kai-Hsiang YEN
  • Publication number: 20070154040
    Abstract: A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.
    Type: Application
    Filed: October 3, 2006
    Publication date: July 5, 2007
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Jen-Yi Chen
  • Publication number: 20060146215
    Abstract: A thin film transistor array substrate and a repairing method thereof are provided. The thin film transistor array substrate comprises a substrate, plural scan lines, plural data lines, plural common lines, and plural pixels. The scan lines and the data lines are disposed over the substrate and define plural pixel areas. Each pixel is disposed in one of the pixel areas corresponding thereto. Each pixel comprises a thin film transistor, a pixel electrode, a top electrode, and a conductive line. In each pixel, the thin film transistor is coupled to the corresponding scan line and the corresponding data line, and the pixel electrode is disposed over the corresponding common line. Furthermore, the top electrode is disposed between the corresponding pixel electrode and common line, and the conductive line is disposed out of the corresponding common line and coupled between the corresponding top electrode and pixel electrode.
    Type: Application
    Filed: March 3, 2005
    Publication date: July 6, 2006
    Inventors: Wei-Kai Huang, Jen-Yi Chen, Chen-Shun Tsai, Chiung-Pin Wang