Abstract: A MEMS microphone package structure having a non-planar substrate is provided. It includes a non-planar substrate, a lid and a transducer. The non-planar substrate includes a bearing base and a peripheral wall connecting to the bearing base. The lid is covered and connected to the non-planar substrate to form a cavity, and at least one solder pad is disposed on an outer surface of the lid or the non-planar substrate. The transducer is disposed in the cavity. A sound hole is provided to correspond to the transducer, and the sound hole is disposed at the non-planar substrate or the lid.

Abstract: Provided is a micro-electro-mechanical system (MEMS) chip package, including a circuit substrate, a MEMS chip, a driving chip, a cover, an insulator, and at least one first pad. The circuit substrate has a first surface and a second surface opposite to each other. The circuit substrate has a sound port passing through the first surface and the second surface. The MEMS chip is disposed on the first surface of the circuit substrate. The driving chip is electrically connected to the MEMS chip. The cover is disposed on the first surface of the circuit substrate. The cover covers the MEMS chip and the driving chip. The insulator covers the cover. The first pad is electrically connected to the driving chip by a first electrical path.

Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

Abstract: A method for manufacturing a MEMS device includes the following operations. An SOI wafer including a device layer, an insulating layer and a handle layer is provided. The device layer is etched to form a recess and an annular protrusion surrounding the recess. A moving part and a spring of the MEMS device are formed on the recess by etching the device layer, the insulating layer and the handle layer. An anchor of the MEMS device is formed at the annular protrusion by etching the device layer, the insulating layer and the handle layer. The moving part and the anchor are connected to each other by the spring. The insulating layer is disposed between a first conductive portion and a second conductive portion of the moving part. The insulating layer is disposed between a first conductive portion and a second conductive portion of the anchor.

Abstract: An acoustic transducer with high sensitivity includes a base plate, a back plate and a vibrating membrane. The vibrating membrane is peripherally fixed to the base plate and covers an opening of the base plate. The back plate has a positioning member connected between the back plate and the vibrating membrane, so as to define at least one vibratile portion that is arranged annularly by a plurality of elastic members. Thereby, the vibratile portion has a reduced deformable width and increased rigidity, so can effectively improve its acoustically receiving sensitivity and signal-to-noise ratio.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A multi-floor type MEMS microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity. A MEMS transducer is disposed in the second cavity and electrically conducted with the housing, and an ASIC chip is disposed in the first cavity and electrically conducted with the housing. By this design, the volume of the back chamber of a vibrating diaphragm of the MEMS transducer can be increased in a limited space of the housing, and thus the sensitivity of the microphone can be improved.

Abstract: The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A multi-floor type MEMS microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity. A MEMS transducer is disposed in the second cavity and electrically conducted with the housing, and an ASIC chip is disposed in the first cavity and electrically conducted with the housing. By this design, the volume of the back chamber of a vibrating diaphragm of the MEMS transducer can be increased in a limited space of the housing, and thus the sensitivity of the microphone can be improved.

Abstract: An MEMS microphone package structure includes a substrate, a carrier and an acoustic transducer. The carrier covers the substrate from above and connects to the substrate. The carrier has an n-shaped cross section and includes a flat plate portion, a sidewall connected to the flat plate portion, and two oblique blocks protruded from the inner surface of the sidewall. The oblique blocks each have an inclined surface for connecting the flat plate portion and the bottom surface of the sidewall. The acoustic transducer is posited on the bottom surface of the flat plate portion and electrically connected to the substrate through a plurality of electrical conduction paths passing through the inclined surfaces. The electrical conduction paths are conducive to simplification of wirings of the substrate and the thinning of the substrate. Therefore, simplify the manufacturing process to reduce the manufacturing time and cost.

Abstract: A chip-stacked microphone includes a cover, an acoustic wave transducer module, an application-specific integrated circuit chip (ASIC) and a substrate arranged in proper order from top to bottom. The cover is connected to the substrate and covered over the acoustic wave transducer module, providing a sound hole. The application-specific integrated circuit chip (ASIC) is electrically connected to the substrate. The acoustic wave transducer module is electrically connected to the application-specific integrated circuit chip (ASIC) using a 3D packaging technology, allowing an acoustic wave to pass therebetween. Thus, the invention greatly reduces the area for footprint and fully utilizes the space between the cover and the two modules for back chamber to maintain the overall performance of the microphone.

Abstract: A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.

Abstract: A dual-diaphragm acoustic transducer includes a substrate defining an opening, an inner diaphragm and an outer diaphragm concentrically mounted at one same side of the substrate corresponding to the opening of the substrate, and a plurality of elastic supporting members connected between the outer perimeter of the inner diaphragm and the inner perimeter of the outer diaphragm. Thus, when a sound wave enters the opening of the substrate, the sound wave pressure forces the outer diaphragm to displace and to carry the inner diaphragm to move, and the inner diaphragm itself will also be forced by the sound wave pressure to have a larger displacement than the outer diaphragm, enhancing the sensitivity. Further, using the inner and outer diaphragms to respond to different sound wave pressures can enhance the sound wave pressure sensing range.

Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions. The acoustic transducer further has a connecting portion that is connected to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The vibratile portions are geometrically different. Thereby, the vibratile portions can vibrate independently. This allows a designer to easily enhance the dynamic range of the acoustic transducer by geometrically modifying the vibrating membrane without increasing the total area of the vibrating membrane while maintaining a certain good degree of sensitivity and signal-to-noise ratio.

Abstract: An acoustic transducer with high sensitivity includes a base plate, a back plate and a vibrating membrane. The vibrating membrane is peripherally fixed to the base plate and covers an opening of the base plate. The back plate has a positioning member connected between the back plate and the vibrating membrane, so as to define at least one vibratile portion that is arranged annularly by a plurality of elastic members. Thereby, the vibratile portion has a reduced deformable width and increased rigidity, so can effectively improve its acoustically receiving sensitivity and signal-to-noise ratio.

Abstract: A dual-diaphragm acoustic transducer includes a substrate defining an opening, an inner diaphragm and an outer diaphragm concentrically mounted at one same side of the substrate corresponding to the opening of the substrate, and a plurality of elastic supporting members connected between the outer perimeter of the inner diaphragm and the inner perimeter of the outer diaphragm. Thus, when a sound wave enters the opening of the substrate, the sound wave pressure forces the outer diaphragm to displace and to carry the inner diaphragm to move, and the inner diaphragm itself will also be forced by the sound wave pressure to have a larger displacement than the outer diaphragm, enhancing the sensitivity. Further, using the inner and outer diaphragms to respond to different sound wave pressures can enhance the sound wave pressure sensing range.

Abstract: A method of semiconductor processing comprises providing a semiconductor wafer in a processing chamber; feeding at least one tungsten-containing precursor in a gas state into the processing chamber for atomic layer deposition (ALD) of tungsten; feeding at least one reducing chemical in a gas state into the processing chamber; and monitoring a concentration of at least one gaseous byproduct in the chamber; and providing a signal indicating concentration of the at least one gaseous byproduct in the chamber. The byproduct is produced by a reaction between the at least one tungsten-containing precursor and the at least one reducing chemical during the ALD.

Abstract: The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.