Patents by Inventor Jens Troetzschel

Jens Troetzschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11213254
    Abstract: An implantable sensor is proposed including a ring shaped element and a coil. The ring shaped element is made of a silicone and is electrically conductive. The coil may be formed by a wire with a number of windings, wherein at least the free ends of the wire are enclosed by the silicone of the ring shaped element, wherein an electrical resistance of the ring shaped element varies upon a deformation of the ring shaped element.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 4, 2022
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan Schibli, Jens Troetzschel, Thomas Doerge, Murad Abu Asal
  • Patent number: 10881837
    Abstract: One aspect relates to a guidewire system, a measuring system, and a method for manufacturing such guidewire system. The guidewire system includes a guidewire and a surface acoustic wave sensor device. A portion of a surface of the guidewire is coated by the surface acoustic wave sensor device. The surface acoustic wave sensor device may be configured for measuring a pressure change. The surface acoustic wave sensor device includes a piezoelectric substrate and a transducer. A thickness of the surface acoustic wave sensor device perpendicular to a longitudinal direction of the guidewire is smaller than 100 ?m.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: January 5, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan Schibli, Jens Troetzschel, Ronald Von Wald
  • Patent number: 10679778
    Abstract: One aspect relates to a component comprising i. a base body having a first component surface and a further component surface, the base body comprising a ceramic at least to an extent of 50 wt %, based on the total weight of the base body; ii. at least one electrical conduction element, the at least one electrical conduction element comprising a metal at least to an extent of 51 wt %, based on the electrical conduction element, and the at least one electrical conduction element passing through the entire base body from the first component surface to the further component surface; iii. at least one fastening element having a contact area, the at least one fastening element comprising a metal at least to an extent of 51 wt %, based on the fastening element, and the fastening element being surrounded at least in part by the base body.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: June 9, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens Troetzschel, Ulrich Hausch
  • Patent number: 10617878
    Abstract: One aspect relates to a composite including a ceramic body, including a ceramic, a first surface, and a hole, including a front face, an end face and a lateral surface. The front face is an opening in the first surface. The ceramic body further includes a second surface and conductor a1. The conductor a1 electrically connects the second surface to the lateral surface, and includes a cermet.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: April 14, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jean-Francois Fischer, Ulrich Hausch, Jens Troetzschel
  • Patent number: 10290400
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes forming a holding element for holding the electrical bushing in the implantable medical device, the holding element including a through-opening. An insulation element of aluminum oxide is formed within the through-opening. At least one elongated conduction element is formed extending through insulation element. The at least one elongated conduction element includes an aluminum oxide in a metallic matrix. The insulation element and the at least one elongated conduction element are jointly fired thereby forming a hermetic seal therebetween without welding or soldering.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: May 14, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens Troetzschel, Heiko Specht
  • Publication number: 20180318589
    Abstract: One aspect relates to a biocompatible composite system, an implantable medical device, and a manufacturing method for a biocompatible composite system. The biocompatible composite system includes a printed multi-layer circuit board and a feedthrough. The circuit board includes at least one electrically conductive via. The feedthrough includes an insulating ceramic base material and at least one electrically conductive cermet pathway. The pathway is embedded into the base material to form an electrically conductive and hermetically sealed connection to the via of the circuit board. The feedthrough and the circuit board are integrated into one composite part.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 8, 2018
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Quartz America LLC
    Inventors: Matthew Joseph DONELON, Robert DITTMER, Ulrich HAUSCH, Jens TROETZSCHEL
  • Publication number: 20180075952
    Abstract: One aspect relates to a component comprising i. a base body having a first component surface and a further component surface, the base body comprising a ceramic at least to an extent of 50 wt %, based on the total weight of the base body; ii. at least one electrical conduction element, the at least one electrical conduction element comprising a metal at least to an extent of 51 wt %, based on the electrical conduction element, and the at least one electrical conduction element passing through the entire base body from the first component surface to the further component surface; iii. at least one fastening element having a contact area, the at least one fastening element comprising a metal at least to an extent of 51 wt %, based on the fastening element, and the fastening element being surrounded at least in part by the base body.
    Type: Application
    Filed: February 19, 2016
    Publication date: March 15, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens TROETZSCHEL, Ulrich Hausch
  • Publication number: 20180071538
    Abstract: One aspect relates to a composite including a ceramic body, including a ceramic, a first surface, and a hole, including a front face, an end face and a lateral surface. The front face is an opening in the first surface. The ceramic body further includes a second surface and conductor a1. The conductor a1 electrically connects the second surface to the lateral surface, and includes a cermet.
    Type: Application
    Filed: August 17, 2017
    Publication date: March 15, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jean-Francois Fischer, Ulrich Hausch, Jens Troetzschel
  • Publication number: 20170354801
    Abstract: One aspect relates to a guidewire system, a measuring system, and a method for manufacturing such guidewire system. The guidewire system includes a guidewire and a surface acoustic wave sensor device. A portion of a surface of the guidewire is coated by the surface acoustic wave sensor device. The surface acoustic wave sensor device may be configured for measuring a pressure change. The surface acoustic wave sensor device includes a piezoelectric substrate and a transducer. A thickness of the surface acoustic wave sensor device perpendicular to a longitudinal direction of the guidewire is smaller than 100 ?m.
    Type: Application
    Filed: June 9, 2017
    Publication date: December 14, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan SCHIBLI, Jens TROETZSCHEL, Ronald VON WALD
  • Publication number: 20170203096
    Abstract: One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers includes an electrically conductive polymer.
    Type: Application
    Filed: April 3, 2017
    Publication date: July 20, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan Schibli, Jami A. Hafiz, Jens Troetzschel
  • Publication number: 20170182310
    Abstract: One aspect relates generally to a method for electrically contacting a coated lead. One aspect relates to a method for electrically contacting a coated lead including providing a coated lead including an electrically conductive core and an electrically insulating coating. A via hole is provided in the electrically insulating coating in order to expose a section of the electrically conductive core. A first electrically conductive material is introduced into the via hole such that it contacts at least a part of the exposed section of the electrically conductive core. A further electrically conductive material is applied to the coated lead such that it contacts at least a part of the first conductive material.
    Type: Application
    Filed: December 22, 2016
    Publication date: June 29, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens TROETZSCHEL, Stefan SCHIBLI
  • Publication number: 20170182311
    Abstract: One aspect relates generally to a process for electrically contacting a coated lead. One aspect relates to a process for electrically contacting a coated lead including providing a coated lead comprising an electrically conductive core and an electrically insulating coating. A via hole is provided in the electrically insulating coating in order to expose a section of the electrically conductive core. A first electrically conductive material is applied to the coated lead such that it contacts at least a part of the exposed section of the electrically conductive core via the via hole. Further electrically conductive material is applied to the coated lead such that it contacts at least a part of the first conductive material.
    Type: Application
    Filed: December 22, 2016
    Publication date: June 29, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Oliver KEITEL, Jens TROETZSCHEL, Stefan SCHIBLI
  • Patent number: 9636026
    Abstract: One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers comprises an electrically conductive polymer.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: May 2, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
  • Publication number: 20170055909
    Abstract: An implantable sensor is proposed including a ring shaped element and a coil. The ring shaped element is made of a silicone and is electrically conductive. The coil may be formed by a wire with a number of windings, wherein at least the free ends of the wire are enclosed by the silicone of the ring shaped element, wherein an electrical resistance of the ring shaped element varies upon a deformation of the ring shaped element.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 2, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan SCHIBLI, Jens TROETZSCHEL, Thomas DOERGE, Murad ABU ASAL
  • Publication number: 20170018337
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes forming a holding element for holding the electrical bushing in the implantable medical device, the holding element including a through-opening. An insulation element of aluminum oxide is formed within the through-opening. At least one elongated conduction element is formed extending through insulation element. The at least one elongated conduction element includes an aluminum oxide in a metallic matrix. The insulation element and the at least one elongated conduction element are jointly fired thereby forming a hermetic seal therebetween without welding or soldering.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens TROETZSCHEL, Heiko SPECHT
  • Patent number: 9498142
    Abstract: One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 22, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
  • Patent number: 9480168
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: October 25, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens Troetzschel, Heiko Specht
  • Patent number: 9407076
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal or cermet material with a metal fraction into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: August 2, 2016
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Nicole Staudt
  • Publication number: 20160120423
    Abstract: One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers comprises an electrically conductive polymer.
    Type: Application
    Filed: January 8, 2016
    Publication date: May 5, 2016
    Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
  • Publication number: 20160005509
    Abstract: One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 7, 2016
    Inventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel