Patents by Inventor Jens Troetzschel
Jens Troetzschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170354801Abstract: One aspect relates to a guidewire system, a measuring system, and a method for manufacturing such guidewire system. The guidewire system includes a guidewire and a surface acoustic wave sensor device. A portion of a surface of the guidewire is coated by the surface acoustic wave sensor device. The surface acoustic wave sensor device may be configured for measuring a pressure change. The surface acoustic wave sensor device includes a piezoelectric substrate and a transducer. A thickness of the surface acoustic wave sensor device perpendicular to a longitudinal direction of the guidewire is smaller than 100 ?m.Type: ApplicationFiled: June 9, 2017Publication date: December 14, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Stefan SCHIBLI, Jens TROETZSCHEL, Ronald VON WALD
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Publication number: 20170203096Abstract: One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers includes an electrically conductive polymer.Type: ApplicationFiled: April 3, 2017Publication date: July 20, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Stefan Schibli, Jami A. Hafiz, Jens Troetzschel
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Publication number: 20170182311Abstract: One aspect relates generally to a process for electrically contacting a coated lead. One aspect relates to a process for electrically contacting a coated lead including providing a coated lead comprising an electrically conductive core and an electrically insulating coating. A via hole is provided in the electrically insulating coating in order to expose a section of the electrically conductive core. A first electrically conductive material is applied to the coated lead such that it contacts at least a part of the exposed section of the electrically conductive core via the via hole. Further electrically conductive material is applied to the coated lead such that it contacts at least a part of the first conductive material.Type: ApplicationFiled: December 22, 2016Publication date: June 29, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Oliver KEITEL, Jens TROETZSCHEL, Stefan SCHIBLI
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Publication number: 20170182310Abstract: One aspect relates generally to a method for electrically contacting a coated lead. One aspect relates to a method for electrically contacting a coated lead including providing a coated lead including an electrically conductive core and an electrically insulating coating. A via hole is provided in the electrically insulating coating in order to expose a section of the electrically conductive core. A first electrically conductive material is introduced into the via hole such that it contacts at least a part of the exposed section of the electrically conductive core. A further electrically conductive material is applied to the coated lead such that it contacts at least a part of the first conductive material.Type: ApplicationFiled: December 22, 2016Publication date: June 29, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Jens TROETZSCHEL, Stefan SCHIBLI
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Patent number: 9636026Abstract: One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers comprises an electrically conductive polymer.Type: GrantFiled: January 8, 2016Date of Patent: May 2, 2017Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
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Publication number: 20170055909Abstract: An implantable sensor is proposed including a ring shaped element and a coil. The ring shaped element is made of a silicone and is electrically conductive. The coil may be formed by a wire with a number of windings, wherein at least the free ends of the wire are enclosed by the silicone of the ring shaped element, wherein an electrical resistance of the ring shaped element varies upon a deformation of the ring shaped element.Type: ApplicationFiled: August 26, 2016Publication date: March 2, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Stefan SCHIBLI, Jens TROETZSCHEL, Thomas DOERGE, Murad ABU ASAL
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Publication number: 20170018337Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes forming a holding element for holding the electrical bushing in the implantable medical device, the holding element including a through-opening. An insulation element of aluminum oxide is formed within the through-opening. At least one elongated conduction element is formed extending through insulation element. The at least one elongated conduction element includes an aluminum oxide in a metallic matrix. The insulation element and the at least one elongated conduction element are jointly fired thereby forming a hermetic seal therebetween without welding or soldering.Type: ApplicationFiled: September 28, 2016Publication date: January 19, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Jens TROETZSCHEL, Heiko SPECHT
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Publication number: 20160369814Abstract: One aspect is a pump device comprising an impeller, and a pump housing which at least partly surrounds an interior region and has an inlet and an outlet, wherein the impeller is provided in the interior region of the pump housing. The pump housing comprises a composite of a first hollow body and a further hollow body which at least partly surrounds the first hollow body on the side facing away from the interior region. At least 60% of the surface area of the side of the first hollow body facing away from the interior space is connected to the further hollow body. The further surface of the first hollow body facing the interior region of the pump housing has a hardness of at least 330 HV.Type: ApplicationFiled: June 20, 2014Publication date: December 22, 2016Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Stefan SCHIBLI, Jens TRĂ–TZSCHEL
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Patent number: 9498142Abstract: One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.Type: GrantFiled: July 3, 2014Date of Patent: November 22, 2016Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
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Patent number: 9480168Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.Type: GrantFiled: February 3, 2014Date of Patent: October 25, 2016Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Jens Troetzschel, Heiko Specht
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Patent number: 9407076Abstract: One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal or cermet material with a metal fraction into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.Type: GrantFiled: September 10, 2013Date of Patent: August 2, 2016Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Nicole Staudt
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Publication number: 20160120423Abstract: One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers comprises an electrically conductive polymer.Type: ApplicationFiled: January 8, 2016Publication date: May 5, 2016Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
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Publication number: 20160005509Abstract: One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.Type: ApplicationFiled: July 3, 2014Publication date: January 7, 2016Inventors: Jami A. Hafiz, Stefan Schibli, Jens Troetzschel
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Patent number: 9090975Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.Type: GrantFiled: June 20, 2011Date of Patent: July 28, 2015Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Heiko Specht, Andreas Reisinger, Ulrich Hausch, Frank Krueger, Jens Troetzschel
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Patent number: 8929987Abstract: One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conducting wire extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conducting wire is arranged in the through-opening. One aspect provides for a cermet-containing bearing element to be arranged between the insulation element and the conducting wire.Type: GrantFiled: August 4, 2010Date of Patent: January 6, 2015Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Jens Troetzschel, Heiko Specht
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Patent number: 8886320Abstract: One aspect relates to an electrical bushing for an implantable device including an electrically insulating base body and at least one electrically conductive bushing body that is embedded in at least one bushing opening that extends through the base body. The base body is produced from a sintered ceramic material, characterized in that the at least one bushing body is made of a sintered cermet material or a sintered metallic material. The base body and the at least one bushing body comprise a firmly bonded sintered connection.Type: GrantFiled: July 15, 2013Date of Patent: November 11, 2014Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Jens Troetzschel, Goran Pavlovic, Harald Manhardt, Norbert Wollenberg, Nicole Staudt
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Patent number: 8778262Abstract: One aspect is an alloy consisting of niobium, zirconium, tantalum, and tungsten. The alloy is formed with a melt metallurgical route such that all four metals solidify as a homogeneous alloy having no inclusions more than 10 ?m in size.Type: GrantFiled: March 1, 2013Date of Patent: July 15, 2014Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel
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Patent number: 8755887Abstract: One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conduction element extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conduction element is arranged in the through-opening. One aspect provides for the at least one conduction element to include a cermet.Type: GrantFiled: August 4, 2010Date of Patent: June 17, 2014Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Jens Troetzschel, Heiko Specht
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Publication number: 20140144014Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.Type: ApplicationFiled: February 3, 2014Publication date: May 29, 2014Applicant: Heraeus Precious Metals GmbH & Co. KGInventors: Jens Troetzschel, Heiko Specht
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Patent number: 8636825Abstract: One aspect relates to a method for producing an alloy characterized by grinding tantalum to form a tantalum powder and grinding tungsten to form a tungsten powder; mixing the tantalum powder and the tungsten powder to form a blended powder. The weight fraction of tungsten powder in the blended powder is larger than in the desired alloy. A blended body is produced from the blended powder by a powder metallurgical route. A pre-alloy is produced by a first melting of the blended body and at least a fraction of at least one further metal by a melt metallurgical route. The alloy is produced by a second melting of the pre-alloy and the remaining fraction of at least one metal by a melt metallurgical route.Type: GrantFiled: April 21, 2011Date of Patent: January 28, 2014Assignee: W. C. Heraeus GmbHInventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel, Egbert Stiedl