Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract: A mobile terminal that can prevent radiation performance deterioration of an antenna is provided. The mobile terminal includes a circuit board in which an antenna and one or more key buttons are mounted, a housing mounted on the antenna and the circuit board, and a case for enclosing a periphery of the one or more key buttons and having a plurality of openings according to the quantity of the key buttons, wherein an antenna adjacent opening among the plurality of openings is extended through a slot toward an edge of the case to embody a loop antenna. Therefore, radiation deterioration of an antenna due to a case can be prevented. In addition, production costs can be minimized, and a desired external appearance of the mobile terminal is not compromised.