Abstract: A method of manufacturing a semiconductor device includes forming a plurality of fins by forming a plurality of first device isolating trenches repeated at a first pitch in a substrate, forming a plurality of fin-type active areas protruding from a top surface of a first device isolating layer by forming the first device isolating layer in the plurality of first device isolating trenches, forming a plurality of second device isolating trenches at a pitch different from the first pitch by etching a portion of the substrate and the first device isolating layer, and forming a second device isolating layer in the plurality of second device isolating trenches, so as to form a plurality of fin-type active area groups separated from each other with the second device isolating layer therebetween.

Abstract: A method of extracting an Integrated Circuit (IC) current is provided. The method includes generating a transfer function value by using a voltage measured in a node nearest an input terminal of the IC, substituting the generated transfer function value for a reverse fast Fourier transform function, so as to extract the IC voltage, and extracting the IC current from the extracted IC voltage through a simulation in a time domain.

Abstract: A chemical supplier includes a chemical reservoir containing a chemical mixture at a room temperature, an inner space of the chemical reservoir being separated from surroundings, a supply line through which the chemical mixture is supplied to a process chamber from the chemical reservoir, an inline heater positioned on the supply line and heating the chemical mixture in the supply line to a process temperature, and a power source driving the chemical mixture to move the chemical mixture toward the process chamber.

Abstract: A method of controlling a chemical mechanical polishing (CMP) process, a temperature control, and a CMP apparatus, the method including measuring actual temperatures of at least two regions in a platen in real time during the CMP process in which a polishing pad attached to the platen polishes a substrate held by a polishing head using slurry and deionized water; receiving the measured actual temperatures of the regions; and individually controlling the actual temperatures of the regions in real time during the CMP process to provide the regions with a predetermined set CMP process temperature.

Abstract: A semiconductor device includes a gate spacer defining a trench. The trench includes a first part and a second part sequentially positioned on a substrate. An inner surface of the first part has a slope of an acute angle and an inner surface of the second part has a slope of a right angle or obtuse angle with respect to the substrate. A gate electrode fills at least a portion of the trench.

Abstract: A waterproof cover of a motor comprises a flange unit having a hollow section at a center; a cover unit formed around the flange unit to have a shape declined toward an outer circumference; an opening section opened to expose a hall sensor cover at one side of the cover unit; a plurality of ribs formed to be projected on the cover unit toward the outer circumference; a plurality of drain guides formed to be projected along the outer circumference of the cover unit; and a drain channel formed between adjacent drain guides among the plurality of drain guides.

Abstract: The present invention relates to a multi-coil wireless charging method, and an apparatus and a system therefor, and a wireless power transmission system having a plurality of transmission coils, according to one embodiment of the present invention, comprises: first to n-th sub-wireless power transmitters respectively having a plurality of transmission coils and transmitting a first sensing signal; and a main control unit for identifying the sub-wireless power transmitter for transmitting a second sensing signal on the basis of whether a first signal strength indicator corresponding to the first sensing signal is received. Therefore, the present invention has an advantage of providing a multi-coil wireless charging method capable of more rapidly and correctly sensing a wireless power receiver.

Abstract: Disclosed is a battery device including a battery; a plurality of sensors attached to the battery; and a transceiving circuit configured to transmit a signal received from a monitoring device to the plurality of sensors and to transmit signals received from the plurality of sensors to the monitoring device. The plurality of sensors generate surface acoustic waves (SAWs) in response to the signal received from the monitoring device, when receiving the signal from the monitoring device through the transceiving circuit, and the plurality of sensors include at least one first sensor configured to output a first signal corresponding to a SAW varied depending on a temperature of the battery; at least one second sensor configured to output a second signal corresponding to a SAW varied depending on pressure of the battery; and at least one third sensor configured to output a third signal corresponding to a SAW varied depending on an electrolyte leakage state of the battery.

Abstract: A method of manufacturing a semiconductor device includes forming a plurality of fins by forming a plurality of first device isolating trenches repeated at a first pitch in a substrate, forming a plurality of fin-type active areas protruding from a top surface of a first device isolating layer by forming the first device isolating layer in the plurality of first device isolating trenches, forming a plurality of second device isolating trenches at a pitch different from the first pitch by etching a portion of the substrate and the first device isolating layer, and forming a second device isolating layer in the plurality of second device isolating trenches, so as to form a plurality of fin-type active area groups separated from each other with the second device isolating layer therebetween.

Abstract: An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.

Abstract: A method of manufacturing a semiconductor device includes forming a plurality of fins by forming a plurality of first device isolating trenches repeated at a first pitch in a substrate, forming a plurality of fin-type active areas protruding from a top surface of a first device isolating layer by forming the first device isolating layer in the plurality of first device isolating trenches, forming a plurality of second device isolating trenches at a pitch different from the first pitch by etching a portion of the substrate and the first device isolating layer, and forming a second device isolating layer in the plurality of second device isolating trenches, so as to form a plurality of fin-type active area groups separated from each other with the second device isolating layer therebetween.

Abstract: Various embodiments of the present disclosure provide an antenna device and/or an electronic device including the antenna device. The antenna device may include: a circuit board; a conductive layer disposed in a partial region of the circuit board; a first radiation conductor disposed at one side of the conductive layer on the circuit board; and second radiation conductors disposed at one side of the conductive layer on the circuit board, the second radiation conductors being respectively disposed at opposite sides of the first radiation conductor to be symmetrical to each other. The first radiation conductor may transmit or receive a wireless signal in a first frequency band, and the second radiation conductors may transmit or receive a wireless signal in a second frequency band that is different from the first frequency band.

Abstract: Disclosed herein is an apparatus for tilting a steering column, capable of smoothly guiding tooth-on-tooth between a moving gear moved along with a tilt shaft when an operating lever is operated such that a steering column tilts up and down, and a fixing gear fixed to a vehicle body. Consequently, it is possible to resolve faulty operation and prevent the emotional quality of product from deteriorating.

Abstract: A loosening-preventing device for pipe fitting. In the device, a casing includes a semispherical member equipped with an open surface, a female screw thread disposed at one end of the semispherical member, and a finishing member disposed at the other end of the semispherical member. A locking member has a male screw thread and a head at one end of the male screw thread, so as to connect to the female screw thread of the casing. The screw clamping of the casing and the locking member prevents the pipe fitting from rotating, thereby preventing the pipe fitting from being loosened.

Abstract: A method of fabricating a semiconductor device includes forming an inter-metal dielectric layer including a first trench and a second trench which are spaced from each other on a substrate, forming a first dielectric layer along the sides and bottom of the first trench, forming a second dielectric layer along the sides and bottom of the second trench, forming first and second lower conductive layers on the first and second dielectric layers, respectively, forming first and second capping layers on the first and second lower conductive layer, respectively, performing a heat treatment after the first and second capping layers have been formed, removing the first and second capping layers and the first and second lower conductive layers after performing the heat treatment, and forming first and second metal gate structures on the first and second dielectric layers, respectively.

Abstract: A method of manufacturing a semiconductor device includes forming a plurality of fins by forming a plurality of first device isolating trenches repeated at a first pitch in a substrate, forming a plurality of fin-type active areas protruding from a top surface of a first device isolating layer by forming the first device isolating layer in the plurality of first device isolating trenches, forming a plurality of second device isolating trenches at a pitch different from the first pitch by etching a portion of the substrate and the first device isolating layer, and forming a second device isolating layer in the plurality of second device isolating trenches, so as to form a plurality of fin-type active area groups separated from each other with the second device isolating layer therebetween.

Abstract: A semiconductor device includes an active fin formed to extend in a first direction, a gate formed on the active fin and extending in a second direction crossing the first direction, a source/drain formed on upper portions of the active fin and disposed at one side of the gate, an interlayer insulation layer covering the gate and the source/drain, a source/drain contact passing through the interlayer insulation layer to be connected to the source/drain and including a first contact region and a second contact region positioned between the source/drain and the first contact region, and a spacer layer formed between the first contact region and the interlayer insulation layer. A width of the second contact region in the first direction is greater than the sum of a width of the first contact region in the first direction and a width of the spacer layer in the first direction.

Abstract: An apparatus for mounting a portable terminal is provided and may include a plurality of fixators configured to move in diagonal directions of one surface of the portable terminal and fix corners of the portable terminal. A controller is configured to detect the portable terminal and execute the movement of the fixators so that the fixators closely adhere to the corners of the portable terminal.

Abstract: Provided are an apparatus and method for treating wafers using a supercritical fluid. The wafer treatment apparatus includes a plurality of chambers; a first supply supplying a first fluid in a supercritical state; a second supply supplying a mixture of the first fluid and a second fluid; a plurality of first and second valves; and a controller selecting a first chamber of the plurality of chambers for wafer treatment to control the open/closed state of each of the plurality of first valves so that the first fluid can be supplied only to the first chamber of the plurality of chambers and selecting a second chamber of the plurality of chambers to control the open/closed state of each of the plurality of second valves so that the mixture of the first fluid and a second fluid can be supplied only to the second chamber of the plurality of chambers.

Abstract: An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.