Patents by Inventor Ji Hwan Park

Ji Hwan Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117211
    Abstract: A paint composition is prepared by mixing each of an acrylic resin, an acrylic polyol resin, a polycarbonate diol resin, a diisocyanate, a solvent, and an antibacterial agent in appropriate amounts. As a result, the paint composition has improved physical properties and effective antibacterial activities.
    Type: Application
    Filed: April 28, 2023
    Publication date: April 11, 2024
    Inventors: Hyun Jung Kim, Ho Tak Jeon, Jae Sik Seo, Ji Hwan Park, Dae Joung Cho
  • Patent number: 11945744
    Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
  • Patent number: 11948808
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 2, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Patent number: 11943985
    Abstract: Discussed are a light-emitting device and a light-emitting display device having improved efficiency and increased lifespan. A plurality of stacks is provided between an anode and a cathode for at least a subpixel to emit a predetermined color, and emissive layers in different stacks include the same color-based materials having different luminous properties.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: March 26, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jin Ho Park, Kyu Il Han, Chang Hwan Kwak, Dong Hyeok Lim, Hwa Yong Shin, Ji Hyung Lee
  • Patent number: 11926558
    Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: March 12, 2024
    Assignee: LG CHEM LTD.
    Inventors: Ilha Lee, Seung Heon Lee, Song Ho Jang, Dong Hyun Oh, Ji Young Hwang, Ki-Hwan Kim, Han Min Seo, Chan Hyoung Park, Sun Young Park
  • Publication number: 20240080983
    Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Kwang Sung KIM, Ji Hwan PARK, Yong Tae PARK, Beom Seok YU
  • Patent number: 11923216
    Abstract: An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 5, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEMES CO., LTD.
    Inventors: Seung Min Shin, Sang Jin Park, Hae Won Choi, Jang Jin Lee, Ji Hwan Park, Kun Tack Lee, Koriakin Anton, Joon Ho Won, Jin Yeong Sung, Pil Kyun Heo
  • Patent number: 11923426
    Abstract: A semiconductor device capable of improving a device performance and a reliability is provided. The semiconductor device comprising a gate structure including a gate electrode on a substrate, a source/drain pattern on a side face of the gate electrode, on the substrate and, a source/drain contact connected to the source/drain pattern, on the source/drain pattern, a gate contact connected to the gate electrode, on the gate electrode, and a wiring structure connected to the source/drain contact and the gate contact, on the source/drain contact and the gate contact, wherein the wiring structure includes a first via plug, a second via plug, and a wiring line connected to the first via plug and the second via plug, the first via plug has a single conductive film structure, and the second via plug includes a lower via filling film, and an upper via filling film on the lower via filling film.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Won Kang, Tae-Yeol Kim, Jeong Ik Kim, Rak Hwan Kim, Jun Ki Park, Chung Hwan Shin
  • Publication number: 20240069100
    Abstract: Designs of thermo-hygrostat devices capable of uniformly maintain temperature and humidity inside a chamber are disclosed. One example of such a device can include, among others, a chamber in which a sample is accommodated and internal temperature and humidity can be controlled; a lower duct provided on a first side of the chamber and sending a fluid inside the chamber to an outside of the chamber; a temperature and humidity control portion provided on the lower duct and controlling temperature and humidity of a fluid received from the lower duct.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Inventors: Jeong Hwan LEE, Ji Seok LEE, Yu Geun KWON, Hye Lim DO, Seok Ha PARK, Hyeon Seok CHA
  • Publication number: 20240072329
    Abstract: A battery module including at least one battery cell; a module case in which the at least one battery cell is accommodated, and including a lower plate and a side plate forming an internal space; and a thermally conductive coating layer formed on an internal surface of the lower plate or an internal surface of the lower plate and an internal surface of the side plate, and having a thickness of 70 ?m to 130 ?m, wherein the thermally conductive coating layer includes a polymeric binder resin and an inorganic filler, is disclosed.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 29, 2024
    Inventors: Ji Hoon LIM, Myeong Hwan MA, Ju Yong PARK
  • Patent number: 11902676
    Abstract: Provided are image signal processing apparatuses and methods for operating the same. In an embodiment, the image signal processing apparatus is configured to receive, from an image sensor device, an input image. The apparatus is further configured to perform a binning and crop operation on the input image to generate a first image. The apparatus is further configured to perform a Bayer domain processing on the first image to generate a second image. The apparatus is further configured to perform RGB domain processing on the second image to generate a third image. The apparatus is further configured to perform YUV domain processing on the third image to generate an output image. The YUV domain processing comprises at least one of a spatial de-noising operation, a temporal de-noising operation, a motion compensation operation, a tone mapping operation, a detail enhance operation, and a sharpening operation.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungwon Choi, Ildo Kim, Jongseong Choi, Ji Hwan Park, Ser Hoon Lee, Sukhwan Lim, Kyuyul Choi
  • Publication number: 20240017750
    Abstract: An autonomous driving control apparatus for transitioning control authority of an autonomous vehicle and a method thereof may include a processor provided in the autonomous vehicle configured to determine whether a predetermined condition required to transition to a manual driving mode while the autonomous vehicle may be traveling in an autonomous driving mode is met, determine a speed limit of the autonomous vehicle, and/or output a transition demand (TD) to a driver of the autonomous vehicle, and control autonomous driving such that a speed of the autonomous vehicle may not be greater than the speed limit while the TD is output. The autonomous driving control apparatus may be configured to include a time taken to transition control authority to the driver, thus improving safety.
    Type: Application
    Filed: March 20, 2023
    Publication date: January 18, 2024
    Inventors: Su Hong Chae, Ji Hwan Park, Young Jin Sung, Chan Hee Jung
  • Patent number: 11874482
    Abstract: A camera module includes a lens holder having a hollow region; a first lens unit disposed in the hollow region and including at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other. The adhesion unit includes an opening and a portion of an internal space formed by a coupling of the circuit board and the lens holder is to be open to an outside through the opening of the adhesion.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Hwan Park, Myoung Jin An, Dong Wook Park
  • Publication number: 20240010192
    Abstract: A device for controlling driving of a vehicle includes a sensor for acquiring state information of the vehicle during autonomous driving, a processor that performs emergency braking when a risk of collision of the vehicle is predicted based on the obtained state information of the vehicle, stores a vehicle event when the vehicle event occurs after the emergency braking is performed, and transitions to a driving mode for resolving the vehicle event when the risk of collision is resolved, and storage for storing an algorithm for an operation of the processor.
    Type: Application
    Filed: January 25, 2023
    Publication date: January 11, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Ji Hwan PARK, Chan Hee JUNG, Su Hong CHAE, Young Jin SUNG
  • Publication number: 20230421877
    Abstract: One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.
    Type: Application
    Filed: September 5, 2023
    Publication date: December 28, 2023
    Inventors: Ji Hwan Park, Myoung Jin An
  • Patent number: 11856697
    Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: December 26, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Sung Kim, Ji Hwan Park, Yong Tae Park, Beom Seok Yu
  • Publication number: 20230407095
    Abstract: Provided is an asphalt modifier for an asphalt mixture and an asphalt mixture containing the same, and more particularly, to an asphalt modifier in which a coating layer containing low-melting-point polyethylene and an inorganic material is formed on a reinforcing fiber bundle. Preferably, the asphalt modifier according to the present disclosure is intended to be mixed with aggregate and an asphalt binder, and comprises: a reinforcing fiber bundle having a length of 8 to 34 mm and composed of a plurality of reinforcing fiber strands; and a coating layer forming the envelope of the reinforcing fiber bundle and comprising polyethylene and an inorganic material.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 21, 2023
    Inventors: Hyeong Su KIM, Chan Heum YEON, Soon Hun PARK, Hyong Ho NAM, Su Ran KIM, Ji Hwan PARK, Seung Hoon SHIN, Young Suk KIM
  • Publication number: 20230400252
    Abstract: A method of processing a substrate includes disposing a substrate in a drying chamber, and supplying a fluid into the drying chamber in which the substrate is disposed. The supplying of the fluid into the drying chamber includes supplying a gas into the drying chamber, and supplying a supercritical fluid into the drying chamber after the supplying of the gas is started.
    Type: Application
    Filed: January 10, 2023
    Publication date: December 14, 2023
    Inventors: SANGJINE PARK, Ji Hwan PARK, KUNTACK LEE
  • Publication number: 20230384681
    Abstract: A substrate processing apparatus includes a wetting apparatus that supplies a fluid onto a substrate, a substrate weight measurement apparatus that measures a weight of the substrate which has passed through the wetting apparatus, and a drying apparatus that dries the substrate which has passed through the substrate weight measurement apparatus. The substrate weight measurement apparatus includes a measurement chamber providing a measurement space, a measurement stage in the measurement chamber, and a weight sensing sensor that senses the weight of the substrate disposed on the measurement stage.
    Type: Application
    Filed: December 7, 2022
    Publication date: November 30, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangjine PARK, Ji Hwan PARK, Kuntack LEE
  • Publication number: 20230382434
    Abstract: A vehicle driving control apparatus includes an input device that receives an input by a driver and a controller that performs control to perform autonomous driving for a predetermined time when there is a second input by the driver to perform the autonomous driving after it is determined that an accelerator pedal or a brake pedal has been pressed based on a first input by the driver. The controller may determine whether to maintain the autonomous driving according to whether there is a third input by the driver within the predetermined time.
    Type: Application
    Filed: September 22, 2022
    Publication date: November 30, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Young Jin Sung, Ji Hwan Park, Su Hong Chae, Chan Hee Jung