Abstract: One embodiment of a camera module comprises: a lens part; a front body on which the lens part is mounted; a substrate part which is disposed apart from the lens part in a first direction and coupled to the front body; an image sensor which is disposed on the substrate part and disposed opposite to the lens part; and a first adhesive part which is disposed between the front body and the substrate part, wherein the front body and the substrate part are coupled by the first adhesive part, and at least one through-hole is formed between the front body and the substrate part.

Abstract: A memory device includes a plurality of data input pads and at least one test data input pad. The memory device also includes a plurality of data input circuits corresponding to a plurality of channels, respectively, the plurality of data input circuits suitable for transmitting respective data received through the data input pads to the corresponding channels. The memory device further includes a test control circuit suitable for selecting at least one data input circuit among the plurality of data input circuits based on test mode information and suitable for controlling the selected data input circuit to transmit set data to the corresponding channel, during a test operation.

Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.

Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.

Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.

Abstract: A photonic radiator device forming a photonic phased array antenna includes a light waveguide including a waveguide clad and a waveguide core using a semiconductor material, and a grating periodically formed an upper or lower part of the light waveguide. The photonic radiator device receives an input light wave in a direction of the grating and the light waveguide and radiates an output light wave to a space by using scattering from the grating.

Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: Provided are: a composition for a window film, containing a silicone resin comprising chemical formula 1 below, a cross-linking agent, and an initiator; a window film formed therefrom; and a flexible display device comprising the same. (R1SiO3/2)x(SiO3/2-Q-SiO3/2)y(R2SiO3/2)z (In chemical formula 1, R1 and R2 are each independently a cycloaliphatic epoxy group, a cycloaliphatic epoxy group-containing functional group, a glycidyl group, or a glycidyl group-containing functional group; Q is R3 or -A1-T-A2-; R3 is a substituted or unsubstituted C1 to C10 alkylene group, or a substituted or unsubstituted C6 to C30 arylene group; A1 and A2 are each independently a single bond, or a substituted or unsubstituted C1 to C5 alkylene group; T is a mono- or polyalkylene oxide group, or an imide group-containing functional group; and 0<x<1, 0<y<1, 0?z<1, and x+y+z=1.

Abstract: One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.

Abstract: A method for fabricating a semiconductor device includes: forming a transistor in a semiconductor substrate; forming a capacitor including a hydrogen-containing top electrode over the transistor; and performing an annealing process for hydrogen passivation after the capacitor is formed.

Abstract: A device for fixing a camera module, comprising: a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein the plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and the plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: A composition for a window film including a first silicon resin including a compound represented by Formula 1; a second silicon resin including a crosslinkable functional group and at least one of a Q unit and a bridge unit; a crosslinking agent; and an initiator, a flexible window film formed therefrom, and a flexible display device including the same are disclosed.

Abstract: One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical direction; a support unit arranged in the housing while accommodating the first printed circuit board therein, and having a stepped portion including a first loading portion at which the second printed circuit board is placed and a second loading portion at which the third printed circuit board is placed; and a fixing unit coupled to the housing by penetrating through a first groove portion and a second groove portion, which are respectively formed at the edge parts of the second printed circuit board and the third printed circuit board, and through a third groove portion formed at the edge part of the support unit.

Abstract: Provided are: a composition for a window film, containing a siloxane resin including chemical formula 1, a cross-linking agent, and an initiator; a flexible window film formed therefrom; and a flexible display device including the same.

Abstract: A method for fabricating a semiconductor device includes: forming a transistor in a semiconductor substrate; forming a capacitor including a hydrogen-containing top electrode over the transistor; and performing an annealing process for hydrogen passivation after the capacitor is formed.

Abstract: A robot which executes a mounted artificial intelligence (AI) algorithm and/or machine learning algorithm and is capable of communicating with other electronic devices and external servers in a 5G communication environment and an operating method thereof. The robot includes a distance sensing sensor, an input unit which includes a plurality of microphones and is for inputting an audio signal, an output unit which includes a display, and a processor which obtains a sound of a base sound source disposed within a sensible range of the distance sensing sensor through a plurality of microphones to process the sound. The processor measures the distance between the robot and the base sound source using the distance sensing sensor, calculates reference CDR information corresponding to the measured distance information, and estimates CDR information of a sound corresponding to the distance from the robot based on the calculated reference CDR information.

Abstract: Provided are a composition for a window film, a flexible window film formed therefrom, and a flexible display device comprising same, the composition for a window film comprising: a first silicone resin comprising chemical formula 1; a second silicone resin containing a crosslinkable functional group and one or more among a Q unit and a bridge unit; a crosslinking agent; and an initiator. (R1SiO3/2)x([R2R3SiO2/2]n)y(R4R5SiO2/2)z(R6R7R8SiO1/2)w (where R1 is a crosslinkable functional group; R2 and R3 are each independently a methyl group; R4 and R5 are each independently hydrogen, a crosslinkable functional group, an unsubstituted or substituted C1-C20 alkyl group, or an unsubstituted or substituted C5-C20 cycloalkyl group; R6, R7, and R8 are each independently hydrogen, a crosslinkable functional group, an unsubstituted or substituted C1-C20 alkyl group, an unsubstituted or substituted C5-C20 cycloalkyl group, or an unsubstituted or substituted C6-C30 aryl group; n is an integer from 7 to 100; 0<x<1, 0.

Abstract: According to a method of manufacturing kimchi of the present invention, there is provided high-quality kimchi which contains Dendropanax morbifera Lev. and one or more functional ingredients selected from among a dandelion, Capsella bursa-pastoris, Kalopanax septemlobus, Cuscuta chinensis Lamarck, and Sambucus williamsii var. coreana Nakai, so that an irritating odor is reduced, freshness is maintained over a long period of time, an improved mouthfeel is ensured, excessive fermentation caused by the occurrence of microorganisms is prevented, and storage stability is improved.