Abstract: A method for verifying manufacturing measurements used for predicting outputs by virtual analysis instruments in a factory, which has production equipment and a virtual analysis instrument, comprises steps: using model-building data of the virtual analysis instrument to build a verification model via a PCA method, and obtaining control limits of the verification model; inputting a plurality of pre-verification measurements into the verification model to calculate verification statistic, and using the verification statistic and the control limits to exclude at least one failure value from the pre-verification measurements to generate the validated measurements; and finally inputting the validated measurements into the virtual analysis instrument for predicting the outputs to determine that the manufacturing measurements are valid, and using the production equipment to undertake production according to predictions of the virtual analysis instrument.

Abstract: A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads.

Abstract: A semiconductor device includes a lead frame having a flag and leads surrounding the flag. The flag includes a first die attach area and an interposer area. An insulated layer with at least one conductive trace is formed on the interposer area.

Abstract: A method of forming a semiconductor device is disclosed. Provided is a substrate having at least one MOS device, at least one metal interconnection and at least one MOS device formed on a first surface thereof. A first anisotropic etching process is performed to remove a portion of the substrate from a second surface of the substrate and thereby form a plurality of vias in the substrate, wherein the second surface is opposite to the first surface. A second anisotropic etching process is performed to remove another portion of the substrate from the second surface of the substrate and thereby form a cavity in the substrate, wherein the remaining vias are located below the cavity. An isotropic etching process is performed to the cavity and the remaining vias.

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess.

Abstract: The invention relates to liquid-crystalline compounds of the formula (I) having a —CF20- bridge. The invention also relates to liquid-crystalline media prepared therewith and to liquid-crystal display devices (LC displays) containing these media. This kind of compounds has the excellent characteristics including a large dielectric anisotropy, fast response time and high clearing point, and good miscibility at low temperature in the same time which has important significance in new TFT LC mixture.

Abstract: A lead frame for a packaged semiconductor device has multiple, configurable power bars that can be selectively electrically connected, such as with bond wires, to each other and/or to other leads of the lead frame to customize the lead frame for different package designs. One or more of the configurable power bars may extend into one or more cut-out regions in a die paddle of the lead frame, which allows for short bond wires to be used to connect the power bars to die pads of a semiconductor die mounted on the die paddle.

Abstract: The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.

Abstract: A wire bonded electrical interconnection includes a first electrical contact, a second electrical contact, and a bond wire having a first end bonded to the first electrical contact, a second end bonded to the second electrical contact, and a central portion connecting the first and second ends. The central portion includes notches formed during a wire bonding process, with each notch having at least two corners.

Abstract: A capillary bonding tool for wire bonding includes a first section, a second section and a bonding section. The first section has a first outer peripheral sidewall, an opposing first inner sidewall that extends generally parallel to the central longitudinal axis, and a first opening surrounded by the first inner sidewall. The second section has a second outer peripheral sidewall, an opposing second inner sidewall that extends at an angle with respect to the central longitudinal axis, and a second tapered opening surrounded by the second inner sidewall. The bonding section has a peripheral ridge extending axially outwardly from the second inner sidewall of the second section. The peripheral ridge has a third outer peripheral sidewall, a third inner tubular sidewall that extends generally parallel to the central longitudinal axis and radially outwardly of the first inner sidewall, and a third opening surrounded by the third inner tubular sidewall.

Abstract: There is disclosed a system and method for managing service for carrier subscribers and migrating them to service bundles. In an embodiment, the method comprises obtaining a list of existing services to which a subscriber is subscribed; comparing the list of services to available service bundles; and determining if there is an exact match of services between the list of existing services and services included in one or more available service bundles, and if so, migrating the subscriber to the one or more available service bundles with the exact match. A subscriber may be manually migrated if migration is not possible with an exact match or partial match.

Abstract: A method of forming a semiconductor device is disclosed. Provided is a substrate having at least one MOS device, at least one metal interconnection and at least one MOS device formed on a first surface thereof. A first anisotropic etching process is performed to remove a portion of the substrate from a second surface of the substrate and thereby form a plurality of vias in the substrate, wherein the second surface is opposite to the first surface. A second anisotropic etching process is performed to remove another portion of the substrate from the second surface of the substrate and thereby form a cavity in the substrate, wherein the remaining vias are located below the cavity. An isotropic etching process is performed to the cavity and the remaining vias.

Abstract: A computer case includes a first sidewall, a plurality of peripheral walls, a retractable fence, and a second sidewall. One side of each of the peripheral walls connects with the first sidewall in a surrounding manner; one end of the retractable fence is disposed to the other side of each of the peripheral walls. The retractable fence is able to reciprocate along an extending direction of the peripheral walls. Besides, the second sidewall connects with the other end of the retractable fence in a surrounding manner. An inner space of the computer case is selectively increased or decreased by the reciprocating of the retractable fence for replacing a cooling module or an electronic component with different width.

Abstract: A semiconductor die has outer leads with an outer lead external connection section and an outer lead bonding section. Inner leads are spaced from the outer leads. Each of the inner leads has an inner lead external connection section spaced and downset from an inner lead bonding section. A non-electrically conductive die mount is molded onto upper surface areas of each inner lead external connection section. A semiconductor die is mounted on the non-electrically conductive die mount and bond wire provide interconnects for selectively electrically connecting bonding pads of the die to the inner lead bonding sections and at least one outer lead bonding section. A mold compound covers the semiconductor die, the bond wires, and the outer and inner lead bonding sections.

Abstract: A method of making an electrical connection includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is then formed by bonding the first portion of the bond wire to a first contact such that the bond wire and the first device are electrically connected. A second bond is then formed by bonding a second portion of the bond wire to a second contact such that the first contact and the second contact are electrically connected.

Abstract: A semiconductor die has outer leads with an outer lead external connection section and an outer lead bonding section. Inner leads are spaced from the outer leads. Each of the inner leads has an inner lead external connection section spaced and downset from an inner lead bonding section. A non-electrically conductive die mount is molded onto upper surface areas of each inner lead external connection section. A semiconductor die is mounted on the non-electrically conductive die mount and bond wire provide interconnects for selectively electrically connecting bonding pads of the die to the inner lead bonding sections and at least one outer lead bonding section. A mold compound covers the semiconductor die, the bond wires, and the outer and inner lead bonding sections.

Abstract: A computer case includes a housing and a cooling device. The cooling device includes a first pillar, a second pillar, a movable element, and a heat-dissipating element. The first pillar penetrates a top guidance slot hole and a bottom guidance slot hole of the housing and has an elongated slot hole; the second pillar penetrates a first side guidance slot hole, a second side guidance slot hole, and the elongated slot hole and forms an intersection portion of the first and the second pillar. The movable element is disposed in the intersection portion, and a heat-dissipating element is fixed to the movable element. When the first pillar moves along a first direction and/or the second pillar moves along a second direction, the movable element drives the heat-dissipating element to move along the first direction and/or the second direction, so as to adjust the position of the heat-dissipating element.

Abstract: A computer case includes a first sidewall, a plurality of peripheral walls, a retractable fence, and a second sidewall. One side of each of the peripheral walls connects with the first sidewall in a surrounding manner; one end of the retractable fence is disposed to the other side of each of the peripheral walls. The retractable fence is able to reciprocate along an extending direction of the peripheral walls. Besides, the second sidewall connects with the other end of the retractable fence in a surrounding manner. An inner space of the computer case is selectively increased or decreased by the reciprocating of the retractable fence for replacing a cooling module or an electronic component with different width.

Abstract: An antenna includes a transparent substrate, a silver layer directly formed on a surface of the transparent substrate, an ink layer made of an electroconductive ink directly formed on the silver layer, and a transparent protective layer directly formed on the silver layer. The silver layer forms a desired antenna pattern and has a feed portion and grounding portion. The ink layer covers the feed portion and the grounding portion. The protective layer covers the silver layer besides the feed portion and the grounding portion. A method for making the antenna is also described.