Abstract: A network controlling method and a network controller are provided. The network controlling method includes the following steps. A hybrid SDN-Ethernet system including a plurality of hosts, a plurality of Ethernet switches and m Software-defined networking switches (SDN switches) is provided. m is larger than or equal to 1. A first path according to at least one default spanning tree in the hybrid SDN-Ethernet system is obtained. m×k optional paths are obtained. Each of the m SDN switches is set as a beginning of each of k of the m×k optional paths. A second path is selected according to the m×k optional paths and the first path of the at least one default spanning tree.

Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure comprises a base substrate and a MEMS structure. The base substrate comprises a CMOS structure. The MEMS structure is formed on the base substrate adjacent to the CMOS structure. The MEMS structure is connected to the CMOS structure. The MEMS structure comprises a membrane and a backplate. The base substrate has a cavity corresponding to the MEMS structure.

Abstract: A system, a computer program product and a method associate service licenses with a wireless device. A device identifier (device ID) which identifies the wireless device and a Subscriber Identity Module identifier (SIM ID) identifying a SIM card currently inserted in the wireless device are received. If the SIM ID is not currently associated with the device ID, a listing of service licenses associated with the SIM ID is aggregated with a listing of service licenses associated with the device ID. The wireless device is authorized to use service licenses listed in the aggregate listing of service licenses. If the SIM ID was currently associated with a second device ID, the service licenses associated with the SIM ID are removed from a listing of service licenses associated with the second device ID and the second wireless device is deauthorized from using these service licenses.

Abstract: A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads.

Abstract: A carbon dioxide capture system comprises a carbon dioxide absorption unit, an ammonia absorption unit, a carbon dioxide stripper unit, an ammonia stripper unit, a heating unit, and a condensing unit. The carbon dioxide absorption unit interconnects with the ammonia absorption unit; the carbon dioxide stripper unit interconnects with the ammonia stripper unit, whereby a first regeneration agent of the carbon dioxide stripper unit and a recirculated ammonia-rich liquid of the ammonia absorption unit directly flow into the carbon dioxide absorption unit to assist a first absorbent to absorb carbon dioxide, and whereby the heat energy generated by the heating unit is more efficiently used by the carbon dioxide absorption unit, the ammonia absorption unit, the carbon dioxide stripper unit, and the ammonia stripper unit. Compared with the conventional carbon dioxide capture system, the present invention has advantages of low power consumption and low equipment cost.

Abstract: An integrated circuit copper wire bond connection is provided having a copper ball (32) bonded directly to an aluminum bond pad (31) formed on a low-k dielectric layer (30) to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location (42) under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.

Abstract: An isolation circuit includes a first multiplexer, a D flip-flop, a second multiplexer, an OR gate, and an AND gate. The first multiplexer selects a data signal or a scan-in signal as a first element output signal according to a scan enable signal. The D flip-flop generates a second element output signal according to the first element output signal. The second element output signal is fed back to the first multiplexer and is used as the data signal. The second multiplexer selects an isolation signal or the second element output signal as a third element output signal according to a test enable signal. The OR gate generates a fourth element output signal according to the scan enable signal and the third element output signal. The AND gate generates a second power domain signal according to a first power domain signal and the fourth element output signal.

Abstract: An isolation circuit includes a first multiplexer, a D flip-flop, a second multiplexer, an OR gate, and an AND gate. The first multiplexer selects a data signal or a scan-in signal as a first element output signal according to a scan enable signal. The D flip-flop generates a second element output signal according to the first element output signal. The second element output signal is fed back to the first multiplexer and is used as the data signal. The second multiplexer selects an isolation signal or the second element output signal as a third element output signal according to a test enable signal. The OR gate generates a fourth element output signal according to the scan enable signal and the third element output signal. The AND gate generates a second power domain signal according to a first power domain signal and the fourth element output signal.

Abstract: A method for fabricating a microelectromechanical system (MEMS) device of the present invention includes the following steps: providing a substrate, comprising a circuit region and a MEMS region separated from each other; forming an interconnection structure on the substrate in the circuit region, and simultaneously forming a plurality of dielectric layers and a first electrode on the substrate in the MEMS region, wherein the first electrode comprises at least two metal layers formed in the dielectric layers and a protection ring formed in the dielectric layers and connecting two adjacent metal layers, so as to define an enclosed space between the two adjacent metal layers; forming a second electrode on the first electrode; and removing the dielectric layers outside the enclosed space in the MEMS region to form a cavity between the electrodes.

Abstract: The present disclosure provides systems for predicting semiconductor reliability. In an embodiment a method for predicting the semiconductor reliability includes receiving a degradation parameter input of a semiconductor device and using a degradation equation to determine a plurality of bias dependent slope values for degradation over a short time period according to the degradation parameter input. The plurality of slope values include at least two different slope values for degradation over time. The system accumulates the plurality of slope values and projects the accumulated slope values over a long time period to determine a stress effect for the semiconductor device.

Abstract: A method for controlling compressed air output of an air compression station which supplies compressed air to a pneumatic apparatus comprises steps of: the air compression station recording a first consumption and a first estimated consumption of the compressed air supplied to the pneumatic apparatus in a first time interval; the air compression station using an EWMA method to estimate a second estimated consumption of the compressed air supplied to the pneumatic apparatus in a second time interval according to the first consumption and the first estimated consumption; and the air compression station generates and supplies the compressed air to the pneumatic apparatus in the second time interval according to the second estimated consumption. The present invention generates an appropriate amount of the compressed air according to the first consumption lest excessive compressed air causes waste.

Abstract: A packaged semiconductor device has a lead frame, a semiconductor die, and bond wires. The lead frame has a two-dimensional array of leads with a subset of interior leads located in the interior of the array that do not extend to the perimeter of the array. The bond wires are connected to the semiconductor die and respective ones of the leads of the array.

Abstract: An electrically non-conductive mounting assembly is disclosed for coupling an electronic faucet to a sink deck. The mounting assembly includes a spout insulator configurable to attach to a delivery spout and a mounting bracket configured to attach to an underside of the sink deck.

Abstract: The present invention provides a method for eicosapentaenoic acid (EPA) and/or arachidonic acid (ARA) production by using Halophytophthora and Halophytophthora isolates that are suitable for EPA and/or ARA production. The disclosure of the present invention provides another choice for the industry to produce EPA and ARA that are good for human's health and promotes the industrial value of Halophytophthora.

Abstract: A method for selecting webpage test paths includes segmenting a current webpage into blocks; performing operations on a representative interactive element contained in a user concerned block to proceed to a next webpage; iteratively repeating the segmenting and the performing on a next webpage until an ending webpage; recording webpage test paths from the beginning webpage to the ending webpage; and determining importance degrees of the webpage test paths and selecting webpage test paths to be test according to the importance degrees.

Abstract: A computer case includes a housing and a cooling device. The cooling device includes a first pillar, a second pillar, a movable element, and a heat-dissipating element. The first pillar penetrates a top guidance slot hole and a bottom guidance slot hole of the housing and has an elongated slot hole; the second pillar penetrates a first side guidance slot hole, a second side guidance slot hole, and the elongated slot hole and forms an intersection portion of the first and the second pillar. The movable element is disposed in the intersection portion, and a heat-dissipating element is fixed to the movable element. When the first pillar moves along a first direction and/or the second pillar moves along a second direction, the movable element drives the heat-dissipating element to move along the first direction and/or the second direction, so as to adjust the position of the heat-dissipating element.

Abstract: An integrated circuit copper wire bond connection is provided having a copper ball (32) bonded directly to an aluminum bond pad (31) formed on a low-k dielectric layer (30) to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location (42) under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess. The main body of the protecting member forms at least one containing recess. A combining component for combining the rod lens array and the protecting member is disposed within the containing recess.

Abstract: The invention relates to liquid-crystalline compounds of the formula (I) having a —CF2O— bridge. The invention also relates to liquid-crystalline media prepared therewith and to liquid-crystal display devices (LC displays) containing these media. This kind of compounds has the excellent characteristics including a large dielectric anisotropy, fast response time and high clearing point, and good miscibility at low temperature in the same time which has important significance in new TFT LC mixture.

Abstract: According to embodiments described in the specification, a method, system and apparatus for configuring a mobile electronic device are provided. The method comprises storing, in a memory of a provisioning server, a plurality of service records and one of a plurality of operation type parameters in association with each service record; receiving, at the provisioning server, a registration request for the mobile electronic device, the registration request including one or more identifiers identifying ones of the service records that are maintained in the mobile electronic device; selecting, based on the received identifiers and the operation type parameters, at least one service record for transmission; and, transmitting the at least one selected service record.