Patents by Inventor Jia Lin

Jia Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8778491
    Abstract: A coated article is described. The coated article includes a substrate, a titanium bonding layer, a titanium-chromium alloy transition layer, and a titanium-chromium-nitrogen hard layer formed thereon, and in that order. The titanium bonding layer is a titanium layer. The titanium-chromium alloy transition layer is a titanium-chromium alloy layer. The titanium-chromium-nitrogen hard layer is a titanium-chromium-nitrogen layer. The titanium bonding layer, titanium-chromium alloy transition layer, and the titanium-chromium-nitrogen hard layer are formed by ion beam assisted sputtering.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: July 15, 2014
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Chwan-Hwa Chiang, Jia-Lin Chen, Yi-Jun Huang, Hai-Bo Pan, Xu Li
  • Publication number: 20140122794
    Abstract: A control circuit is connected between a motherboard and a number of hard disks for controlling power and data transmission of the number of hard disks. Each hard disk corresponds to one power control unit and one data control unit. The power control unit controls power transmission to the corresponding hard disk. The data control unit controls data transmission of the corresponding hard disk. When one hard disk is selected as an operation object to enter a disable state, the data control unit cuts off data transmission of the selected hard disk before the power control unit cuts off power transmission of the operation object. When the hard disk is selected as an operation object to enter an enable state, the power control unit resets the power transmission to the operation object before the data control unit resets data transmission of the operation object.
    Type: Application
    Filed: October 30, 2013
    Publication date: May 1, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD
    Inventors: JIA LI, JUN-JIA LIN
  • Patent number: 8710601
    Abstract: A micro electro mechanical system (MEMS) structure is disclosed. The MEMS structure includes a backplate electrode and a 3D diaphragm electrode. The 3D diaphragm electrode has a composite structure so that a dielectric is disposed between two metal layers. The 3D diaphragm electrode is adjacent to the backplate electrode to form a variable capacitor together.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: April 29, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Chien-Hsin Huang, Bang-Chiang Lan, Ming-I Wang, Hui-Min Wu, Tzung-I Su, Chao-An Su, Tzung-Han Tan, Min Chen, Meng-Jia Lin
  • Patent number: 8706489
    Abstract: A system and method for selecting audio contents by using the speech recognition to obtain a textual phrase from a series of audio contents are provided. The system includes an output module outputting the audio contents, an input module receiving a speech input from a user, a buffer temporarily storing the audio contents within a desired period and the speech input, and a recognizing module performing a speech recognition between the audio contents within the desired period and the speech input to generate an audio phrase and the corresponding textual phrase matching with the speech input.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: April 22, 2014
    Assignee: Delta Electronics Inc.
    Inventors: Jia-lin Shen, Chien-Chou Hung
  • Patent number: 8698175
    Abstract: The present invention relates to a light-emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: April 15, 2014
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Wei-Kang Cheng, Jia-Lin Li, Shyi-Ming Pan, Kuo-Chin Huang
  • Patent number: 8642986
    Abstract: An integrated circuit (IC) having a microelectromechanical system (MEMS) device buried therein is provided. The integrated circuit includes a substrate, a metal-oxide semiconductor (MOS) device, a metal interconnect, and the MEMS device. The substrate has a logic circuit region and a MEMS region. The MOS device is located on the logic circuit region of the substrate. The metal interconnect, formed by a plurality of levels of wires and a plurality of vias, is located above the substrate to connect the MOS device. The MEMS device is located on the MEMS region, and includes a sandwich membrane located between any two neighboring levels of wires in the metal interconnect and connected to the metal interconnect.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: February 4, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Tzung-Han Tan, Bang-Chiang Lan, Ming-I Wang, Tzung-I Su, Chien-Hsin Huang, Hui-Min Wu, Chao-An Su, Min Chen, Meng-Jia Lin
  • Publication number: 20130302933
    Abstract: A microelectromechanical system (MEMS) device and a method for fabricating the same are described. The method of the present invention includes the following steps. A substrate is provided, including a circuit region and a MEMS region separated from each other. An interconnection structure is formed on the substrate in the circuit region, and simultaneously a plurality of dielectric layers and a first electrode are formed on the substrate in the MEMS region. The first electrode includes at least two metal layers and a protection ring. The metal layers and the protection ring are formed in the dielectric layers. The protection ring connects two adjacent metal layers, so as to define an enclosed space between the two adjacent metal layers. A second electrode is formed on the first electrode. The dielectric layers outside the enclosed space in the MEMS region are removed to form a cavity between the electrodes.
    Type: Application
    Filed: July 18, 2013
    Publication date: November 14, 2013
    Inventors: Tzung-Han TAN, Bang-Chiang Lan, Ming-I Wang, Chien-Hsin Huang, Meng-Jia Lin
  • Patent number: 8577394
    Abstract: A security management system is provided. The security management system includes a storage unit and at least one processor. The storage unit stores a restricting table which records relationships between positional information of a mobile device and functions of the mobile device. The at least one processor includes an information module, a restricting module and a disabling module. The information module provides positional information of the mobile device. The restricting module generates a restricting instruction according to the provided positional information of the mobile device and the restricting table. The disabling module disables the corresponding functions of the mobile device according to the generated restricting instruction.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: November 5, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ho-Leung Cheung, Jia-Lin Chen, Chun-Wen Wang, Chia-Hung Chien
  • Patent number: 8558336
    Abstract: A semiconductor photodetector structure is provided. The structure includes a substrate, a photodetecting element and a semiconductor layer disposed on the photodetecting element. The substrate includes a first semiconductor material and includes a deep trench. The surface of the deep trench includes a first type dopant. The photodetecting element is disposed in the deep trench. The photodetecting element includes a second semiconductor material. The semiconductor layer includes a second type dopant.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: October 15, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Tzung-I Su, Bang-Chiang Lan, Chao-An Su, Hui-Min Wu, Ming-I Wang, Chien-Hsin Huang, Tzung-Han Tan, Min Chen, Meng-Jia Lin, Wen-Yu Su
  • Patent number: 8551812
    Abstract: In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: October 8, 2013
    Assignee: Unitech Printed Circuit Board Corp.
    Inventors: Ming Yi Yeh, Jia Lin Liu, Chung Shih Wu
  • Publication number: 20130258474
    Abstract: An optoelectronic device includes a base part and a lens cap. The base part has an optoelectronic chip mounted thereon. The lens cap is mounted over the optoelectronic chip and includes a metallic hollow cylindrical part and a plastic inner cylindrical part. The hollow cylindrical part has an opening on a top thereof. The inner cylindrical part is firmly coupled within the hollow cylindrical part, and the inner cylindrical part has a lens part located within the opening and at least three aligning members in contact with an upper circumference of the base part so as to align the lens part with the optoelectronic chip.
    Type: Application
    Filed: April 3, 2012
    Publication date: October 3, 2013
    Inventors: Cheng-Ta Chen, Yi-Ming Chen, Chia-Hisen Liang, Jia-Lin Lin
  • Patent number: 8539048
    Abstract: A method for loading a configuration file from a remote server to an electronic device includes obtaining a default configuration file from the remote server, and executing the default configuration file to boot the electronic device, identifying a corresponding MAC list in the remote server according to hardware configurations of the electronic device, and obtaining a specific MAC value corresponding to an unused status flag from the MAC list. The method further includes obtaining a default MAC value of a network card of the electronic device, replacing the default MAC value of the network card with the specific MAC value, obtaining a specific configuration file from the remote server according to the specific MAC value, and rebooting the electronic device according to the specific configuration file.
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: September 17, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jun-Jia Lin, Xue-Wen Hong
  • Patent number: 8525389
    Abstract: A microelectromechanical system (MEMS) device and a method for fabricating the same are described. The MEMS device includes a first electrode and a second electrode. The first electrode is disposed on a substrate, and includes at least two metal layers, a first protection ring and a dielectric layer. The first protection ring connects two adjacent metal layers, so as to define an enclosed space between two adjacent metal layers. The dielectric layer is disposed in the enclosed space and connects two adjacent metal layers. The second electrode is disposed on the first electrode, wherein a cavity is formed between the first electrode and the second electrode.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: September 3, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Tzung-Han Tan, Bang-Chiang Lan, Ming-I Wang, Chien-Hsin Huang, Meng-Jia Lin
  • Patent number: 8502382
    Abstract: A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: August 6, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Bang-Chiang Lan, Ming-I Wang, Hui-Min Wu, Min Chen, Chien-Hsin Huang, Tzung-I Su, Chao-An Su, Tzung-Han Tan, Li-Che Chen, Meng-Jia Lin
  • Patent number: 8468076
    Abstract: A charge control system which is applied in a hardware environment includes an electronic device, an intelligent ammeter, and a server. The intelligent ammeter is connected to the server by a network connection. The charge control system includes a storage unit, and at least one processor. The storage unit stores a plurality of validation information. The at least one processor includes a receiving module, a validating module and a charge control module. The receiving module receives information from a user intended to validate the user. The validating module determines whether the received information matches one of the items of predetermined validation information. The charge control module controls the intelligent ammeter to begin charging the electronic device when the received information matches one of items of the predetermined validation information.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: June 18, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ho-Leung Cheung, Jia-Lin Chen, Chun-Wen Wang, Chia-Hung Chien
  • Patent number: 8463609
    Abstract: In the present invention, a voice input system and a voice input method are provided. The voice input method includes the steps of: (A) initiating a speech recognition process by a first input associated with a first parameter of a first speech recognition subject; (B) providing a voice and a searching space constructed by a speech recognition model associated with the first speech recognition subject; (C) obtaining a sub-searching space from the searching space based on the first parameter; (D) searching at least one candidate item associated with the voice from the sub-searching space; and (E) showing the at least one candidate item.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: June 11, 2013
    Assignee: Delta Electronics Inc.
    Inventors: Keng-Hung Yeh, Liang-Sheng Huang, Chao-Jen Huang, Jia-Lin Shen
  • Patent number: 8460960
    Abstract: A method for fabricating integrated circuit is provided. First, a first interconnect structure including a plurality of first dielectric layers and a plurality of first conductive patterns stacked therewith alternately is formed on a MEMS region of a conductive substrate. Next, an interlayer is formed on the first interconnect structure and covering the first conductive patterns. Next, a poly silicon mask layer corresponding to the first conductive patterns is formed on the interlayer and exposing a portion of the media layer. Next, the portion of the interlayer exposed by the poly silicon mask layer and a portion of the first dielectric layer corresponding thereto are removed to form a plurality of openings. Then, a portion of the conductive substrate in the MEMS region is removed.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: June 11, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Meng-Jia Lin, Bang-Chiang Lan, Ming-I Wang, Chien-Hsin Huang
  • Patent number: 8457630
    Abstract: There is disclosed a system and method for transferring a mobile handheld device between mobile carriers. In an embodiment, a system for transferring a handheld device between mobile carriers comprises a provisioning system for receiving from a first mobile carrier a request to register the device on the first mobile carrier's wireless network; a database uniquely identifying the device to determine if the device has been previously registered; deactivation means for deactivating the device from the second mobile carrier's wireless network if the device has been previously registered to a second mobile carrier; and registration means for registering the device on the first mobile carrier's wireless network upon confirmation that the device has been deactivated from the second mobile carrier's wireless network. The device may be uniquely identified by a unique electronic serial number (ESN) or a unique product identification number (PIN).
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: June 4, 2013
    Assignee: Research In Motion Limited
    Inventors: Piotr Madej, Jia-Lin Chin, Diana G. Vitorino, Levente Janosi
  • Publication number: 20130132272
    Abstract: A charge control system which is applied in a hardware environment includes an electronic device, an intelligent ammeter, and a server. The intelligent ammeter is connected to the server by a network connection. The charge control system includes a storage unit, and at least one processor. The storage unit stores a plurality of validation information. The at least one processor includes a receiving module, a validating module and a charge control module. The receiving module receives information from a user intended to validate the user. The validating module determines whether the received information matches one of the items of predetermined validation information. The charge control module controls the intelligent ammeter to begin charging the electronic device when the received information matches one of items of the predetermined validation information.
    Type: Application
    Filed: December 29, 2011
    Publication date: May 23, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HO-LEUNG CHEUNG, JIA-LIN CHEN, CHUN-WEN WANG, CHIA-HUNG CHIEN
  • Publication number: 20130130650
    Abstract: A security management system is provided. The security management system includes a storage unit and at least one processor. The storage unit stores a restricting table which records relationships between positional information of a mobile device and functions of the mobile device. The at least one processor includes an information module, a restricting module and a disabling module. The information module provides positional information of the mobile device. The restricting module generates a restricting instruction according to the provided positional information of the mobile device and the restricting table. The disabling module disables the corresponding functions of the mobile device according to the generated restricting instruction.
    Type: Application
    Filed: December 29, 2011
    Publication date: May 23, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HO-LEUNG CHEUNG, JIA-LIN CHEN, CHUN-WEN WANG, CHIA-HUNG CHIEN