Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.

Abstract: Consistent with the present disclosure, low pass filters are provided in the electrical paths connecting digital to analog converter (DAC) circuitry to an optical block package (also referred to as a “gold box”). The low pass filter blocks or substantially attenuates high frequency noise components present in an analog signal output from the DAC, thereby reducing errors that might otherwise be present in the transmitted data.

Abstract: Systems and methods to predict and optimize automated recipe selection and item delivery for a customer. A server uses an artificial intelligence model to selects a plurality of predicted recipes for a customer based on customer preferences. Different types of constraints are obtained for the customer to generate a plurality of sets of recipes from the predicted recipes and to optimize those sets of recipes for the customer. A specific set of recipes is selected for the customer based on the optimization, and the filling of the order is initiated for the customer with items associated with the selected set of recipes.

Abstract: A voltage measurement device includes a probe module movably arranged around an alternating-current transmission line, and a measurement unit. A metal electrode is arranged on a surface of the probe module facing toward the alternating-current transmission line, electrically coupled with the alternating-current transmission line to form a coupling capacitor, and then forms an electrical circuit with an inductor element, a resistor element, and a reference signal source in the measurement unit. A processor controls the reference signal source to input reference voltage signals at different frequencies to the electrical circuit, determines a resonant frequency of the electrical circuit according to currents of the electrical circuit under the reference voltage signals at different frequencies, and determines a voltage of the alternating-current transmission line according to a first current component amplitude and the resonant frequency of the electrical circuit.

Abstract: The present disclosure is directed to a single-phase reclosing method, device and storage medium for AC/DC system. The method comprises: acquiring three-phase voltages at inverter-side AC bus close to the transformer, three-phase currents measured at the outlet of inverter-side AC line and three-phase voltages at inverter-side AC bus far from the transformer; calculating the energy calculation value and energy operation value of the fault line; identifying the fault nature of fault line within the maximum time delay, according to the energy calculation value and energy operation value of fault line and an energy criterion of transient/permanent fault; issuing a reclosing control signal based on the fault nature of fault line to realize effective reclosing of the fault line.

Abstract: A voltage measurement device includes a probe module movably arranged around an alternating-current transmission line, and a measurement unit. A metal electrode is arranged on a surface of the probe module facing toward the alternating-current transmission line, electrically coupled with the alternating-current transmission line to form a coupling capacitor, and then forms an electrical circuit with an inductor element, a resistor element, and a reference signal source in the measurement unit. A processor controls the reference signal source to input reference voltage signals at different frequencies to the electrical circuit, determines a resonant frequency of the electrical circuit according to currents of the electrical circuit under the reference voltage signals at different frequencies, and determines a voltage of the alternating-current transmission line according to a first current component amplitude and the resonant frequency of the electrical circuit.

Abstract: Systems and methods to predict and optimize automated recipe selection and item delivery for a customer. An item-selection server selects a plurality of predicted recipes based on customer preferences and order history. Hard and soft constraints are obtained to perform the optimization of the predicted recipes. The hard constraints define parameters that cannot be violated by a recipe or set of recipes, and soft constraints define parameters that expresses a tradeoff value associated with a recipe or set of recipes. Optimization includes selecting multiple sets of predicted recipes based on the hard constraints and scoring each recipe set based on the soft constraints, item inventory, and customer preferences. A specific set of recipes is selected for the order based on the scores, and the filling of the order is initiated for the customer with items associated with the selected set of recipes.

Abstract: Disclosed herein are multi-layer substrates for integrated circuit packages and methods of making the same. The multi-layer substrate may comprise a plurality of lower layers, at least one core layer, a plurality of upper layers, and a side surface. A first connection and a second connection may extend through or on an uppermost layer of the plurality of upper layers. A trace may be embedded in or on one of the plurality of upper layers, the trace electrically connected to the first connection and the second connection. A first mounting pad and a second mounting pad may be positioned on the side surface and/or the uppermost layer of the plurality of upper layers and a blocking capacitor may be electrically connected to the first mounting pad and the second mounting pad with the second mounting pad electrically connected to the second connection.

Abstract: A sealing film suitable for food packaging is disclosed, which adopts the following solution. The sealing film comprises, in sequence, a PET layer, a VMPET layer and a PE layer from outside to inside, wherein the PE layer comprises 100-110 parts of PE, 15-20 parts of EVA, 15-20 parts of EAA, 55-60 parts of HDPE and 10-15 parts of LLDPE in parts by mass. In this manner, the addition of HDPE and LLDPE into the PE layer is intended to enhance the tensile strength of the sealing film.

Abstract: The present disclosure is directed to a single-phase reclosing method, device and storage medium for AC/DC system. The method comprises: acquiring three-phase voltages at inverter-side AC bus close to the transformer, three-phase currents measured at the outlet of inverter-side AC line and three-phase voltages at inverter-side AC bus far from the transformer; calculating the energy calculation value and energy operation value of the fault line; identifying the fault nature of fault line within the maximum time delay, according to the energy calculation value and energy operation value of fault line and an energy criterion of transient/permanent fault; issuing a reclosing control signal based on the fault nature of fault line to realize effective reclosing of the fault line.

Abstract: The disclosure relates to a method, system and storage medium for suppressing sub/super-synchronous oscillation for direct-drive wind turbine based on energy compensation.

Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.

Abstract: A sealing film suitable for food packaging is disclosed, which adopts the following solution. The sealing film comprises, in sequence, a PET layer, a VMPET layer and a PE layer from outside to inside, wherein the PE layer comprises 100-110 parts of PE, 15-20 parts of EVA, 15-20 parts of EAA, 55-60 parts of HDPE and 10-15 parts of LLDPE in parts by mass. In this manner, the addition of HDPE and LLDPE into the PE layer is intended to enhance the tensile strength of the sealing film.

Abstract: A sealing film suitable for food packaging is disclosed, which adopts the following solution. The sealing film comprises, in sequence, a PET layer, a VMPET layer and a PE layer from outside to inside, wherein the PE layer comprises 100-110 parts of PE, 15-20 parts of EVA, 15-20 parts of EAA, 55-60 parts of HDPE and 10-15 parts of LLDPE in parts by mass. In this manner, the addition of HDPE and LLDPE into the PE layer is intended to enhance the tensile strength of the sealing film.

Abstract: A flooring system includes multiple panels (10) which are connected to each other by connectors (20). Each panel (10) has a tongue (30) and each connector (20) has an engaging slot (40). The tongue (30) does not extend beyond the side of the panel (10). The panel (10) is moved horizontally to insert the lower protrusion (300) of the tongue (30) into the lower recess (400) of the engaging slot (40) of the connector (20). The inner inclined face (302) of the lower protrusion (300) of the tongue (30) contacts the curved wall (410) of the lower recess (400) of the connector (20). The tongue (30) of the panel (10) is engaged with the engaging slot (40) of the connector (20) by way of pressing the panel in a direction perpendicular to the panel. No hammering to the side of the panel is needed.

Abstract: An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of thermal expansion (CTE) of 2.3-14 ppm/° C. and the barrier comprises a material having a CTE of 3.5-14 ppm/° C.

Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.

Abstract: Consistent with the present disclosure, the back side of a chip is attached to a lid structure. Legs are attached or integrated monolithically to the lid such that the legs are provided in and around the periphery of the lid and are designed in such a way as to not interfere with the optical output/input (facet) of the PIC, for example, by not putting the leg or a portion of the leg in front of the optical output/input region of the PIGC. Since the lid, to which the chip is attached, is secured to the substrate, the electrical connections between the chip and the substrate are also subject to little, if any, mechanical stress, thereby obviating the need for the underfill. Accordingly, electrical traces on the chip and the substrate do not contact a high dielectric constant material, and, as a result, impedance and loss may be reduced.

Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.