Patents by Inventor Jiaming Zhang

Jiaming Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130193219
    Abstract: A low pressure and high-low temperature test box capable of controlling humidity comprises a test box body (1), a first heater (2) and a first evaporator (3) which are installed in the test box body (1), a humiture sensor (4) for detecting the humiture inside the test box body (1) and a vacuum manometer (5) for detecting the pressure inside the test box body (1) which are both installed on the test box body (1), an air circulation device (6) for circulating the air inside the test box body (1), and a humidity adjusting device (7) which is connected to the test box body (1) and used for adjusting the humidity inside the test box body (1). A vacuum pump (8) for vacuumizing the test box body (1) is also provided on the test box body (1).
    Type: Application
    Filed: October 18, 2010
    Publication date: August 1, 2013
    Inventors: Keyu Xia, Jiaming Zhang
  • Patent number: 8389978
    Abstract: Consistent with the present disclosure, a package is provided that includes a housing having a recessed portion to accommodate an integrated circuit or chip. The housing has an inner periphery that defines or delineates the recessed portion. The inner periphery may be stepped and includes first and second surfaces that are spaced vertically from one another and extend in respective parallel planes, for example, to thereby constitute first and second shelves. First bonding pads or contacts (“housing pads”) may be provided on the first surface, which may electrically connect or interconnect with first pads on the integrated circuit (“IC pads”), and second housing pads may be provided on the second surface, which can electrically connect or interconnect with second IC pads. Thus, the IC pads connect to corresponding housing pads on the inner periphery of the housing that are above and below one another.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: March 5, 2013
    Assignee: Infinera Corporation
    Inventors: Donald J. Pavinski, Jr., Renshan Zhang, Jiaming Zhang, James Stewart, Jie Tang
  • Publication number: 20130036794
    Abstract: Detection system and humidity detection method for detecting volatile organic compound comprises a device for introducing clean air and a controller, wherein the device for introducing clean air is connected with a test chamber; a test chamber sheath is sleeved outside the test chamber; the test chamber is provided with a temperature sensor for detecting the temperature in the test chamber, a high-temperature test exhaust device is connected with a high-temperature exhaust pipeline of the test chamber, and a low-temperature test exhaust device is connected with a low-temperature exhaust pipeline of the test chamber; a pipeline connecting the test chamber with the low-temperature test exhaust device is also provided with a dew point sensor for detecting dew point of the air in the low-temperature exhaust pipeline; and the temperature sensor and the dew point sensor are connected with the controller.
    Type: Application
    Filed: November 18, 2010
    Publication date: February 14, 2013
    Inventors: Keyu Xia, Jiaming Zhang
  • Publication number: 20110204507
    Abstract: Consistent with the present disclosure, a package is provided that includes a housing having a recessed portion to accommodate an integrated circuit or chip. The housing has an inner periphery that defines or delineates the recessed portion. The inner periphery may be stepped and includes first and second surfaces that are spaced vertically from one another and extend in respective parallel planes, for example, to thereby constitute first and second shelves. First bonding pads or contacts (“housing pads”) may be provided on the first surface, which may electrically connect or interconnect with first pads on the integrated circuit (“IC pads”), and second housing pads may be provided on the second surface, which can electrically connect or interconnect with second IC pads. Thus, the IC pads connect to corresponding housing pads on the inner periphery of the housing that are above and below one another.
    Type: Application
    Filed: February 22, 2010
    Publication date: August 25, 2011
    Inventors: Donald J. Pavinski, JR., Renshan Zhang, Jiaming Zhang, James Stewart, Jie Tang
  • Patent number: 6856441
    Abstract: A method of tuning an electroabsorption modulator (EAM). A reference average power loss factor for light having a reference peak wavelength that is modulated by the EAM is provided. This loss factor is based on operation of the EAM using a reference bias voltage, a reference temperature, and a reference modulation signal which has a predetermined duty cycle. Input light is coupled into the EAM and modulated using a modulation signal which has the same duty cycle as the reference modulation signal. The input power of the input light and the average output power of light emitted from the EAM are measured. These input and average output powers are used to generate an average power loss factor. The average power loss factor is compared to the reference average power loss factor and the bias voltage and/or the temperature of the EAM are adjusted to reduce differences between these loss factors.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: February 15, 2005
    Assignee: T-Networks, Inc.
    Inventors: Liyan Zhang, Newton C. Frateschi, Jiaming Zhang, Aaron Bond
  • Publication number: 20050018732
    Abstract: A method for improving the reliability of an uncooled long reach optical transmitter operating substantially at a predetermined output power. The uncooled long reach optical transmitter in this method includes a laser, an SOA and a modulator. The laser is operated to produce a reduced power laser beam, thereby improving the laser reliability. The SOA bias current is controlled so that the SOA amplifies the reduced power laser beam to substantially maintain the predetermined output power. The SOA is sufficiently long to provide this amplification, while maintaining a reduced current density within the SOA, thereby improving the SOA reliability. Small signal chirp parameters are measured for two bias voltages of the modulator. A linear function of the modulator bias voltage versus temperature is determined. The modulator bias voltage as a function of temperature is adjusted to maintain a constant dispersion penalty for data transmission.
    Type: Application
    Filed: December 19, 2003
    Publication date: January 27, 2005
    Inventors: Aaron Bond, Newton Frateschi, Jiaming Zhang
  • Publication number: 20040090659
    Abstract: A method of tuning an electroabsorption modulator (EAM). A reference average power loss factor for light having a reference peak wavelength that is modulated by the EAM is provided. This loss factor is based on operation of the EAM using a reference bias voltage, a reference temperature, and a reference modulation signal which has a predetermined duty cycle. Input light is coupled into the EAM and modulated using a modulation signal which has the same duty cycle as the reference modulation signal. The input power of the input light and the average output power of light emitted from the EAM are measured. These input and average output powers are used to generate an average power loss factor. The average power loss factor is compared to the reference average power loss factor and the bias voltage and/or the temperature of the EAM are adjusted to reduce differences between these loss factors.
    Type: Application
    Filed: August 25, 2003
    Publication date: May 13, 2004
    Inventors: Liyan Zhang, Newton C. Frateschi, Jiaming Zhang, Aaron Bond