Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.

Abstract: A sealing film suitable for food packaging is provided, which adopts the following solution. The sealing film comprises, in sequence, a PET layer, a VMPET layer and a PE layer from inside to outside, wherein the PE layer comprises 100-110 parts of PE, 15-20 parts of EVA, 15-20 parts of EAA, 55-60 parts of HDPE and 10-15 parts of LLDPE in parts by mass. In this manner, the addition of HDPE and LLDPE into the PE layer is intended to enhance the tensile strength of the sealing film.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.

Abstract: Consistent with the present disclosure, a photonic integrated circuit (PIC) is provided that has 2 N channels (N being an integer). The PIC is optically coupled to N optical fibers, such that each of N polarization multiplexed optical signals are transmitted over a respective one of the N optical fibers. In another example, each of the N optical fibers supply a respective one of N polarization multiplexed optical signals to the PIC for coherent detection and processing. A multiplexer and demultiplexer may be omitted from the PIC, such that the optical signals are not combined on the PIC. As a result, the transmitted and received optical signals incur less loss and amplified spontaneous emission (ASE) noise. In addition, optical taps may be more readily employed on the PIC to measure outputs of the lasers, such as widely tunable lasers (WTLs), without crossing waveguides. In addition, wavelength locker (WLL) circuitry may be provided on the PIC.

Abstract: Provided are a transmission method, terminal and system for application software. In the method, a first terminal creates a wireless hotspot; a second terminal joins a wireless network constructed by the wireless hotspot when joining request information sent by the second terminal is received; and interaction of application software with the second terminal is performed based on the wireless network. By the technical solution, the application software may be shared among these terminals, and the users do not have to download the application software from the network so as to save the data consumption of the users. Moreover, downloaded application software may also be shared among these terminals through application store clients on the terminals, so as to improve enthusiasm of the user in searching for and downloading the application software and facilitate popularization of the application store clients as well as the application software thereof.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.

Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.

Abstract: A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.

Abstract: The present disclosure discloses a method for transmission of multimedia data, which includes: converting analogue multimedia data received from a terminal to digital multimedia data; separating the digital multimedia data into digital audio data and digital video data, and converting coding format of the digital video data; compressing the digital audio data and the digital video data in converted thecoding format respectively, converting protocol format of the compressed digital audio data and of the compressed digital video data respectively, and sending the resulting digital audio data and the resulting digital video data to a network. The present disclosure further discloses a device for transmission of multimedia data. With the technical solutions of the present disclosure, both video data and audio data may be transmitted, and the transmission rate of multimedia data may be increased efficiently.

Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.

Abstract: A low pressure and high-low temperature test box capable of controlling humidity comprises a test box body (1), a first heater (2) and a first evaporator (3) which are installed in the test box body (1), a humiture sensor (4) for detecting the humiture inside the test box body (1) and a vacuum manometer (5) for detecting the pressure inside the test box body (1) which are both installed on the test box body (1), an air circulation device (6) for circulating the air inside the test box body (1), and a humidity adjusting device (7) which is connected to the test box body (1) and used for adjusting the humidity inside the test box body (1). A vacuum pump (8) for vacuumizing the test box body (1) is also provided on the test box body (1).

Abstract: Detection system and humidity detection method for detecting volatile organic compound comprises a device for introducing clean air and a controller, wherein the device for introducing clean air is connected with a test chamber; a test chamber sheath is sleeved outside the test chamber; the test chamber is provided with a temperature sensor for detecting the temperature in the test chamber, a high-temperature test exhaust device is connected with a high-temperature exhaust pipeline of the test chamber, and a low-temperature test exhaust device is connected with a low-temperature exhaust pipeline of the test chamber; a pipeline connecting the test chamber with the low-temperature test exhaust device is also provided with a dew point sensor for detecting dew point of the air in the low-temperature exhaust pipeline; and the temperature sensor and the dew point sensor are connected with the controller.

Abstract: A low pressure and high-low temperature test box capable of controlling humidity comprises a test box body (1), a first heater (2) and a first evaporator (3) which are installed in the test box body (1), a humiture sensor (4) for detecting the humiture inside the test box body (1) and a vacuum manometer (5) for detecting the pressure inside the test box body (1) which are both installed on the test box body (1), an air circulation device (6) for circulating the air inside the test box body (1), and a humidity adjusting device (7) which is connected to the test box body (1) and used for adjusting the humidity inside the test box body (1). A vacuum pump (8) for vacuumizing the test box body (1) is also provided on the test box body (1).

Abstract: Consistent with the present disclosure, a package is provided that includes a housing having a recessed portion to accommodate an integrated circuit or chip. The housing has an inner periphery that defines or delineates the recessed portion. The inner periphery may be stepped and includes first and second surfaces that are spaced vertically from one another and extend in respective parallel planes, for example, to thereby constitute first and second shelves. First bonding pads or contacts (“housing pads”) may be provided on the first surface, which may electrically connect or interconnect with first pads on the integrated circuit (“IC pads”), and second housing pads may be provided on the second surface, which can electrically connect or interconnect with second IC pads. Thus, the IC pads connect to corresponding housing pads on the inner periphery of the housing that are above and below one another.