Patents by Inventor Jian-Hong Chen

Jian-Hong Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220380300
    Abstract: The present invention provides novel compounds which activate the Kv7 potassium channels. Separate aspects of the invention are directed to pharmaceutical compositions comprising said compounds and uses of the compounds to treat disorders responsive to the activation of Kv7 potassium channels.
    Type: Application
    Filed: July 20, 2022
    Publication date: December 1, 2022
    Applicant: H. Lundbeck A/S
    Inventors: Mario Rottlander, Anette Graven Sams, Xiaofang Wang, Debasis Das, Jian Hong, Shu Hui Chen
  • Patent number: 11458715
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: October 4, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsin Shen, Yu-Chi Wang, Ming-Chia Yang, Yu-Bing Liou, Wei-Hong Chang, Yun-Han Lin, Hsin-Yi Hsu, Yun-Chung Teng, Chia-Jung Lu, Yi-Hsuan Lee, Jian-Wei Lin, Kun-Mao Kuo, Ching-Mei Chen
  • Publication number: 20220280455
    Abstract: The present invention provides novel compounds which activate the Kv7 potassium channels. Separate aspects of the invention are directed to pharmaceutical compositions comprising said compounds and uses of the compounds to treat disorders responsive to the activation of Kv7 potassium channels.
    Type: Application
    Filed: July 30, 2020
    Publication date: September 8, 2022
    Applicant: H. Lundbeck A/S
    Inventors: Anette Graven Sams, Mario Rottlãnder, Xiaofang Wang, Debasis Das, Jian Hong, Shu Hui Chen, Jesper Frank Bastlund, Jelena Ivkovic, Karina Krøjer Søby, Morten Grupe Larsen
  • Patent number: 11434199
    Abstract: The present invention provides novel compounds which activate the Kv7 potassium channels. Separate aspects of the invention are directed to pharmaceutical compositions comprising said compounds and uses of the compounds to treat disorders responsive to the activation of Kv7 potassium channels.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: September 6, 2022
    Assignee: H. Lundbeck A/S
    Inventors: Mario Rottlander, Anette Graven Sams, Xiaofang Wang, Debasis Das, Jian Hong, Shu Hui Chen
  • Publication number: 20220246798
    Abstract: A micro light emitting diode including an epitaxy layer, a first pad, a second pad, a first ohmic contact metal, a second ohmic contact metal and at least one etch protection conductive layer is provided. The first pad and the second pad are electrically connected to a first type semiconductor layer and a second type semiconductor layer of the epitaxy layer, respectively. The first ohmic contact metal is disposed between the first type semiconductor layer and the first pad. The second ohmic contact metal is disposed between the second type semiconductor layer and the second pad. The at least one etch protection conductive layer is disposed between the first ohmic contact metal and the first pad and/or between the second ohmic contact metal and the second pad. A display panel is also provided.
    Type: Application
    Filed: March 25, 2021
    Publication date: August 4, 2022
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Tzu-Yang Lin, Yen-Chun Tseng, Yun-Syuan Chou, Fei-Hong Chen, Pai-Yang Tsai, Jian-Zhi Chen
  • Publication number: 20220246799
    Abstract: A micro light-emitting diode including an epitaxy structure, a first pad, a first ohmic contact layer and a current conducting layer is provided. The epitaxy structure includes a first type semiconductor layer, a second type semiconductor layer and an active layer. The first pad is electrically connected to the first type semiconductor layer. The first ohmic contact layer is electrically connected between the first type semiconductor layer and the first pad. The current conducting layer is electrically connected between the first ohmic contact layer and the first pad. At least a portion of the orthogonal projection of the first ohmic contact layer on the plane upon which the first type semiconductor layer is located is away from the orthogonal projection of the first pad on the plane. A display panel is also provided.
    Type: Application
    Filed: September 12, 2021
    Publication date: August 4, 2022
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Jian-Zhi Chen, Pai-Yang Tsai, Fei-Hong Chen, Yen-Chun Tseng
  • Publication number: 20210343591
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Application
    Filed: July 13, 2021
    Publication date: November 4, 2021
    Inventors: Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen
  • Patent number: 11121031
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: September 14, 2021
    Assignee: XINTEC INC.
    Inventors: Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen
  • Patent number: 10796726
    Abstract: This application discloses a video recording method and apparatus of a mobile terminal. The video recording method of a mobile terminal includes: obtaining a target video played online, the target video being a video to be recorded; receiving, by using a video recording page, a recording instruction signal for recording the target video; entering a recording mode in response to the recording instruction signal, the target video being recorded in the recording mode, to obtain a video clip corresponding to video data of the target video; and generating a recorded video of the target video according to the video clip.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: October 6, 2020
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jian hong Chen, Jia chun Ke, Ning Jiang
  • Publication number: 20200144116
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Application
    Filed: October 30, 2019
    Publication date: May 7, 2020
    Inventors: Chia-Sheng LIN, Hui-Hsien WU, Jian-Hong CHEN, Tsang-Yu LIU, Kuei-Wei CHEN
  • Publication number: 20200105307
    Abstract: This application discloses a video recording method and apparatus of a mobile terminal. The video recording method of a mobile terminal includes: obtaining a target video played online, the target video being a video to be recorded; receiving, by using a video recording page, a recording instruction signal for recording the target video; entering a recording mode in response to the recording instruction signal, the target video being recorded in the recording mode, to obtain a video clip corresponding to video data of the target video; and generating a recorded video of the target video according to the video clip.
    Type: Application
    Filed: November 29, 2019
    Publication date: April 2, 2020
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jian hong CHEN, Jia chun KE, Ning JIANG
  • Patent number: 10529384
    Abstract: This application discloses a video recording method and apparatus of a mobile terminal. The video recording method includes obtaining a target video that is played online, controlling to display a video recording page in which the target video is played, and receiving, via the video recording page that is displayed, a recording instruction for recording the target video. The video recording method further includes entering a recording mode to record the target video, in response to the recording instruction being received, to obtain a first video clip corresponding to video data of the target video, and generating a recorded video of the target video, based on the first video clip.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: January 7, 2020
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jian hong Chen, Jia chun Ke, Ning Jiang
  • Publication number: 20180268870
    Abstract: This application discloses a video recording method and apparatus of a mobile terminal. The video recording method includes obtaining a target video that is played online, controlling to display a video recording page in which the target video is played, and receiving, via the video recording page that is displayed, a recording instruction for recording the target video. The video recording method further includes entering a recording mode to record the target video, in response to the recording instruction being received, to obtain a first video clip corresponding to video data of the target video, and generating a recorded video of the target video, based on the first video clip.
    Type: Application
    Filed: February 10, 2017
    Publication date: September 20, 2018
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jian hong CHEN, Jia chun KE, Ning JIANG
  • Patent number: 8595861
    Abstract: A thermal probe includes a support element, a conductive pattern and a tip. The conductive pattern is disposed at the support element and has plural bending portions. The tip has a base and a pinpoint. The base has a first surface and a second surface which is opposite to the first surface. The pinpoint is disposed at the first surface. The second surface is connected with the conductive pattern. The bending portions are contacted with the first surface. The tip of the thermal probe is replaceable, and the user can choose the optimum combination of the tip, conductive pattern and support element according to their needs.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: November 26, 2013
    Assignee: National Cheng Kung University
    Inventors: Bernard HaoChih Liu, Fang-Yi Liao, Jian-Hong Chen
  • Patent number: 8578511
    Abstract: A thermal probe includes a support element, a conductive pattern and a tip. The support element has a slit or a through hole and has a first surface and a second surface which is opposite to the first surface. The conductive pattern is disposed at the first surface. The tip has a base and a pinpoint. The pinpoint is disposed at the base and passes through the slit or the through hole and highlights from the first surface. The base is connected with the second surface. The tip of the thermal probe of the invention can be replaced, and user can choose the best combination of the tip, conductive pattern and support element according to their needs.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: November 5, 2013
    Assignee: National Cheng Kung University
    Inventors: Bernard HaoChih Liu, Fang-Yi Liao, Jian-Hong Chen
  • Patent number: 8460856
    Abstract: A photosensitive material for use in semiconductor manufacture comprises a copolymer that includes a plurality of photoresist chains and a plurality of hydrophobic chains, each hydrophobic chain attached to the end of one of the photoresist chains. The copolymer in response to externally applied energy will self-assemble to a photoresist layer and a hydrophobic layer.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: June 11, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Wei Yeh, Jen-Chieh Shih, Jian-Hong Chen
  • Patent number: 8450052
    Abstract: A method of lithography patterning includes forming a first resist pattern on a substrate, the first resist pattern including a plurality of openings therein on the substrate; forming a second resist pattern on the substrate and within the plurality of openings of the first resist pattern, the second resist pattern including at least one opening therein on the substrate; and removing the first resist pattern to uncover the substrate underlying the first resist pattern.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: May 28, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Feng-Cheng Hsu, Jian-Hong Chen
  • Publication number: 20130019353
    Abstract: A thermal probe includes a support element, a conductive pattern and a tip. The support element has a slit or a through hole and has a first surface and a second surface which is opposite to the first surface. The conductive pattern is disposed at the first surface. The tip has a base and a pinpoint. The pinpoint is disposed at the base and passes through the slit or the through hole and highlights from the first surface. The base is connected with the second surface. The tip of the thermal probe of the invention can be replaced, and user can choose the best combination of the tip, conductive pattern and support element according to their needs.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 17, 2013
    Inventors: Bernard HaoChih LIU, Fang-Yi Liao, Jian-Hong Chen
  • Publication number: 20130019352
    Abstract: A thermal probe includes a support element, a conductive pattern and a tip. The conductive pattern is disposed at the support element and has plural bending portions. The tip has a base and a pinpoint. The base has a first surface and a second surface which is opposite to the first surface. The pinpoint is disposed at the first surface. The second surface is connected with the conductive pattern. The bending portions are contacted with the first surface. The tip of the thermal probe is replaceable, and the user can choose the optimum combination of the tip, conductive pattern and support element according to their needs.
    Type: Application
    Filed: May 18, 2012
    Publication date: January 17, 2013
    Inventors: Bernard HaoChih LIU, Fang-Yi LIAO, Jian-Hong CHEN
  • Patent number: 8296634
    Abstract: An error correction decoder includes a syndrome generator and an error correction value generator. The syndrome generator is operable to generate a plurality of syndromes based upon a received signal generated according to a generator polynomial. The error correction value generator is operable to generate a plurality of product values. Each of the product values is generated for one of the syndromes based upon a respective power of the roots of the generator polynomial. The respective power is determined based upon a respective index corresponding to one of the syndromes to be considered and unit positions of the received signal. The error correction value generator is further operable to generate an error correction value according to the product values, and to provide an error correcting device coupled thereto with the error correction value for correcting an error of the received signal.
    Type: Grant
    Filed: February 27, 2010
    Date of Patent: October 23, 2012
    Assignee: I Shou University
    Inventors: Yao-Tsu Chang, Ming-Haw Jing, Chong-Dao Lee, Jian-Hong Chen, Zih-Heng Chen