Abstract: A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting with the cold plate to fins (60).

Abstract: The present invention provides conductive carbon nanotube (CNT) electrode materials comprising aligned CNT substrates coated with an electrically conducting polymer, and the fabrication of electrodes for use in high performance electrical energy storage devices. In particular, the present invention provides conductive CNTs electrode material whose electrical properties render them especially suitable for use in high efficiency rechargeable batteries. The present invention also provides methods for obtaining surface modified conductive CNT electrode materials comprising an array of individual linear, aligned CNTs having a uniform surface coating of an electrically conductive polymer such as polypyrrole, and their use in electrical energy storage devices.

Abstract: A system for controlling the air-to-fuel ratio in an internal combustion engine includes an air intake conduit coupled to an intake manifold, an EGR valve disposed in-line with an EGR conduit responsive to a valve control signal, a lambda sensor producing a lambda signal indicative of the air-to-fuel ratio of the exhaust gas and a control circuit producing the valve control signal as a function of a desired mass air flow value, a desired air-to-fuel ratio, and the lambda signal. In an alternate embodiment, the system further includes a fueling system responsive to a fueling control signal. In this embodiment, the control circuit produces the fueling control signal as a function of a desired fuel control value, a desired air-to-fuel ratio, and the lambda signal. In another alternate embodiment, the control circuit produces the valve control signal as a function of a desired air-to-fuel ratio and the lambda signal.

Abstract: A chip structure and the manufacturing process thereof are provided. The feature of the present application is that the chip structure has a first passivation layer covering a substrate of the chip and exposing each of bonding pads and a portion of the substrate surface, and a second passivation layer covering the sidewalls of the first passivation layer and the portion of substrate surface exposed by the first passivation layer, to prevent moisture infiltration from the edge of the substrate. Therefore, the reliability of the chip structure is enhanced.

Abstract: A chip structure comprising a substrate, a circuitry unit, a plurality of bonding pads, a first passivation layer and a redistribution layer is provided. The circuitry unit is disposed on the substrate, and the bonding pads are disposed on the circuitry unit. Moreover, the first passivation layer is disposed on the circuitry unit and exposes the bonding pads. The redistribution layer of a Ti/Cu/Ti multi-layered structure is disposed on the first passivation layer, and is electrically connected with the bonding pads. In addition, the redistribution layer of a Ti/Cu/Ti multi-layered structure has excellent conductivity such that electrical characteristics of the chip structure are enhanced effectively.

Abstract: A single pixel driving circuit for a transflective LCD is disclosed. It uses different digital/analog (D/A) signal converters to control the gamma correction signals of the transmissive liquid crystal capacitor and the reflective liquid crystal capacitor to improve the display quality of the transflective LCD. The driving circuit contains a first transistor and a second transistor whose gates couple together to a scan line, a first signal converter coupled to the source of the first transistor via a first data line, and a second signal converter coupled to the source of the second transistor via a second data line. The drain of the first transistor is coupled to the transmissive liquid crystal capacitor. The drain of the second transistor is coupled to the reflective liquid crystal capacitor.

Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).

Abstract: A method for forming solder bumps (or solder balls after reflow) of improved height and reliability is provided. In one embodiment, a semiconductor substrate having at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad is provided. A layer of under bump metal (UBM) is formed above the passivation layer and the contact pad. A first patterned and etched photoresist layer is provided above the UBM layer, the first patterned and etched photoresist layer defining at least one first opening therein. A second patterned and etched photoresist layer is provided above the first patterned and etched photoresist layer, the second patterned and etched photoresist layer defining at least one second opening therein, the second opening being wider than the first opening. A solder material is filled in the at least one first opening and substantially filled in the at least one second opening.

Abstract: A heat dissipation device for an electronic unit includes a heat sink and at least a heat pipe. The heat sink includes a base for contacting with the electronic unit and a plurality of fins arranged on the base to create a first heat transfer path for the electronic unit. The heat pipe is attached to the heat sink and includes an evaporating portion for contacting with the electronic unit, and a condensing portion thermally contacting with the fins to create a second heat transfer path for the electronic unit.

Abstract: The present invention relates generally to reinforced carbon nanotubes, and more particularly to reinforced carbon nanotubes having a plurality of microparticulate carbide or oxide materials formed substantially on the surface of such reinforced carbon nanotubes composite materials. In particular, the present invention provides reinforced carbon nanotubes (CNTs) having a plurality of boron carbide nanolumps formed substantially on a surface of the reinforced CNTs to reinforce the CNTs, enabling their use as effective reinforcing fillers for matrix materials to give high-strength composites. The present invention also provides methods for producing carbide reinforced CNTs.

Abstract: The present invention relates generally to reinforced carbon nanotubes, and more particularly to reinforced carbon nanotubes having a plurality of microparticulate carbide or oxide materials formed substantially on the surface of such reinforced carbon nanotubes composite materials. In particular, the present invention provides reinforced carbon nanotubes (CNTs) having a plurality of boron carbide nanolumps formed substantially on a surface of the reinforced CNTs that provide a reinforcing effect on CNTs, enabling their use as effective reinforcing fillers for matrix materials to give high-strength composites. The present invention also provides methods for producing such carbide reinforced CNTs.

Abstract: A liquid crystal display (LCD) and fabricating method thereof. The fabricating method includes providing a double-layered substrate structure having a first seal pattern, inserted along the periphery thereof, wherein the first seal pattern has a notch for liquid crystal injection, facing an injecting direction of the liquid crystals, forming a second seal pattern near the notch, parallel to the injecting direction, injecting the liquid crystals via the notch along the injecting direction, and sealing the notch with a third seal pattern. According to the invention, the permeating rate of the third seal pattern is accelerated, enhancing the sealing of the liquid crystal display, and increasing productivity. Further, the second seal pattern enhances the adhesion between the substrate and the third seal pattern, protecting the cured third seal pattern from peeling and bubble formation.

Abstract: The invention in one embodiment is an improved variable speed engine/generator set with an integrated power conditioning system and control method including load shedding to generate high quality AC power with improved fuel efficiency and reduced emissions. The variable speed generator control scheme allows for load adaptive speed control of engine and generator field. The transformerless power inverter topology and control method provides the necessary output frequency, voltage and/or current waveform regulation, harmonic distortion rejection, and provides for single phase, or unbalanced loading.

Abstract: A multi-chip package structure comprising a first chip, a patterned lamination layer, a plurality of first bumps, a second chip and second bumps is provided. The first chip has a first active surface. The patterned lamination layer is disposed on a portion area of the first active surface. The first chip has a plurality of first bonding pads disposed on the first active surface exposed by the patterned lamination layer and the patterned lamination layer has a plurality of second bonding pads disposed thereon. The second chip has a second active surface and the first bumps are disposed on the second active surface. The second chip is electrically connected to the first bonding pads through the first bumps. The second bumps are disposed on the second bonding pads. Moreover, the multi-chip package structure further comprises a component disposed on the first chip and electrically connects to the first bonding pads.

Abstract: The invention in one embodiment is an improved variable speed engine/generator set with an integrated power conditioning system and control method including load shedding to generate high quality AC power with improved fuel efficiency and reduced emissions. The variable speed generator control scheme allows for load adaptive speed control of engine and generator field. The transformerless power inverter topology and control method provides the necessary output frequency, voltage and/or current waveform regulation, harmonic distortion rejection, and provides for single phase, or unbalanced loading.

Abstract: A process for manufacturing transparent semiconductor packages is disclosed. A wafer having an active surface and a back surface is provided. A plurality of first redistribution lines are formed on the active surface of the wafer to connect the bonding pads of the chips. A transparent polymer is formed over the active surface of the wafer to cover the first redistribution lines. A plurality of first grooves are formed corresponding to the scribe lines and in the back surface of the wafer. Preferably, a back coating is then formed over the back surface to fill the first grooves. Next, a plurality of second grooves are formed corresponding to the first grooves and through the back coating such that the first redistribution lines have exposed portions. A plurality of second redistribution lines on the back coating can extend to the exposed portions of the corresponding first redistribution lines for connecting solder balls on the back surface.

Abstract: The invention in the simplest form is an improved variable speed engine/generator set with an integrated power conditioning system and control method, used to generate high quality AC power with optimum fuel efficiency and reduced emissions. The variable speed generator control scheme allows for load adaptive speed control of engine and generator field. The transformerless power inverter topology and control method provides the necessary output frequency, voltage and/or current waveform regulation, harmonic distortion rejection, and provides for single phase, or unbalanced loading.

Abstract: A liquid crystal display device that includes a first substrate, a reflector formed over the first substrate, a second substrate spaced apart from the first substrate, an electrode layer formed over the second substrate, a light source disposed on a side of the first substrate opposite the second substrate, a color filter layer, formed between the electrode layer and the second substrate, including a reflection section for transmitting ambient light incident upon the second substrate and reflected by the reflector, and a transmission section for transmitting light emitted from the light source to the second substrate through the first substrate, and an optically transparent film formed in the reflection section, wherein the color filter layer disposed at the transmission section has a thickness greater than approximately 1.5 times that of the color filter layer disposed at the reflection section.

Abstract: A single pixel driving circuit for a transflective LCD is disclosed. It uses different digital/analog (D/A) signal converters to control the gamma correction signals of the transmissive liquid crystal capacitor and the reflective liquid crystal capacitor to improve the display quality of the transflective LCD. The driving circuit contains a first transistor and a second transistor whose gates couple together to a scan line, a first signal converter coupled to the source of the first transistor via a first data line, and a second signal converter coupled to the source of the second transistor via a second data line. The drain of the first transistor is coupled to the transmissive liquid crystal capacitor. The drain of the second transistor is coupled to the reflective liquid crystal capacitor.

Abstract: A structure of a light-shielding frame and a manufacturing method thereof for a liquid crystal display panel are described. The structure includes a thin film transistor array substrate having a display region and a frame region surrounding the display region, and at least one color layer formed in the frame region. The color layer prevents the ambient light from projecting onto the frame region and serves as the spacer so that the cell gap between the thin film transistor array substrate and an opposite substrate can be uniformly controlled. By further forming a planarization layer on the color layer, the cell gap between the thin film transistor array substrate and the opposite substrate can be much more uniformly controlled.