Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages.

Abstract: A base station apparatus adaptive for antenna arrays including at least one radio frequency (RF) header module, at least one data processing apparatus, and transceiving apparatus for transceiving data between the at least one radio frequency (RF) header module and the at least one data processing apparatus. The transceiving apparatus includes an uplink module to group data received by the RF header module according to grouping configuration information, and to transfer the grouped data to the data processing apparatus; and a downlink module to degroup the data from the data processing apparatus according to the grouping configuration information, and to transfer the degrouped data to the RF header module. Also provided are methods of receiving and sending data, and a computer readable article of manufacture tangibly embodying computer readable instructions for executing a computer implemented method of sending and receiving data for a base station.

Abstract: A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set between the first and second sections and engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set between the first and second base plates and engage with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates between the first and second sections of the second heat pipe and engaging with the first and second base plates.

Abstract: A grab bar for attachment to a wall mount surface includes a mount assembly having a sleeve, a base flange, and a set screw. The sleeve is attached to a wall facing side of the grab bar. The base flange has a base portion to be associated with the wall mount surface and a wall portion extending outwardly from the base portion. Once the sleeve is attached to the grab bar and the base flange is attached to the wall mount surface, the sleeve is received over the wall portion in an overlapping relationship. The set screw is then used to secure the sleeve to the base flange.

Abstract: A triangle wave generator with function of spreading frequency spectrum is provided. The triangle wave generator includes a switch control circuit, a current generator, an integrator, and a spread spectrum control circuit. The switch control circuit provides an internal clock and a switch control signal. The current generator is coupled to the switch control circuit and provides charge current according to the switch control signal. The integrator is coupled to the current generator and provides a triangle wave signal. The spread spectrum control circuit is coupled to the switch control circuit and the current generator for providing a current control signal according to the internal clock.

Abstract: The present application is directed to methods of operating a multi-color image forming device in a mono-color mode. The methods may include performing three basic loops during the printing in the mono-color mode. A first loop may include printing mono-color pages up to an initial preset maximum. The preset maximum may prevent a wear mark from forming on the non-operational PC members due to rubbing against the moving ITM. A second loop may occur when the mono-color pages exceeds the initial preset maximum. The second loop may include rotating the non-operational imaging stations to prevent wear. A third loop may occur when the number of mono-color images exceeds an overall maximum number. The third loop may include resetting the non-operational image forming stations to allow for continuing printing in the mono-color mode.

Abstract: A three-dimensional package and a method of making the same including providing a wafer; forming at least one blind hole in the wafer; forming an isolation layer on the side wall of the blind hole; forming a conductive layer on the isolation layer; forming a dry film on the conductive layer; filling the blind hole with metal; removing the dry film, and patterning the conductive layer; removing a part of the metal in the blind hole to form a space; removing a part of the second surface of the wafer and a part of the isolation layer, to expose a part of the conductive layer; forming a solder on the lower end of the conductive layer, the melting point of the solder is lower than the metal; stacking a plurality of the wafers, and performing a reflow process; and cutting the stacked wafers, to form three-dimensional packages.

Abstract: A small size permanent magnet direct current motor has a housing accommodating a permanent magnet stator and a wound rotor. The rotor has a rotor core with a diameter of 23 mm±3 mm and 12 poles and a cylindrical commutator. The motor has an output power of more than 25 watts.

Abstract: A cord winding mechanism for an electrically powered device such as a vacuum cleaner. The cord winding mechanism may be used with a device having an electric motor. The mechanism may include a cord receiving member for receiving a cord. The cord receiving member may define an interior space and have an axis. The mechanism may include a biasing member that may transmit a rotational force to the cord receiving member to rotate the cord receiving member about the axis. The mechanism may include a retention member that may selectively prevent the cord receiving member from rotating under the rotational force of the biasing member. The cord receiving member may be adapted to receive at least part of the motor inside the interior space of the cord receiving member. The mechanism may include ventilation openings for providing ventilation An electric motor assembly may include the mechanism and a motor. An electric appliance may include a housing and the assembly.

Abstract: The present invention relates to the fabrication of a grafted, UV photo-polymerized silica-based monolithic column and the use of such column for the extraction of DNA. In one embodiment, a method is provided for fabricating a silica-based monolithic column, wherein a vessel is filled with a polymerization mixture that is formed into monolithic solid phase for DNA extraction through in situ photo-polymerization.

Abstract: A method for forming solder bumps (or solder balls after reflow) of improved height and reliability is provided. In one embodiment, a semiconductor substrate having at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad is provided. A layer of under bump metal (UBM) is formed above the passivation layer and the contact pad. A first patterned and etched photoresist layer is provided above the UBM layer, the first patterned and etched photoresist layer defining at least one first opening therein. A second patterned and etched photoresist layer is provided above the first patterned and etched photoresist layer, the second patterned and etched photoresist layer defining at least one second opening therein, the second opening being wider than the first opening. A solder material is filled in the at least one first opening and substantially filled in the at least one second opening.

Abstract: A three-dimensional package including a first wafer having at least one first pad and a first protection layer exposing the first pad. A first hole penetrates the first wafer. A first isolation layer is disposed on the side wall of the first hole. The lower end of a first conductive layer extends below the surface of the first wafer. A first metal is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. A first solder is disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal. A second wafer is configured similarly as the first wafer. A lower end of a second conductive layer of the second wafer extends below the surface of the second wafer and contacts the upper end of the first solder.

Abstract: The present invention provides conductive carbon nanotube (CNT) electrode materials comprising aligned CNT substrates coated with an electrically conducting polymer, and the fabrication of electrodes for use in high performance electrical energy storage devices. In particular, the present invention provides conductive CNTs electrode material whose electrical properties render them especially suitable for use in high efficiency rechargeable batteries. The present invention also provides methods for obtaining surface modified conductive CNT electrode materials comprising an array of individual linear, aligned CNTs having a uniform surface coating of an electrically conductive polymer such as polypyrrole, and their use in electrical energy storage devices.

Abstract: A decoding method of CABAC is proposed. A CABAC decoder comprises an arithmetic engine performing two arithmetic decodings for a coefficient or reading contexts at the same time in a clock cycle. The arithmetic decoding for a coefficient comprises the steps of: (1) providing a residual block comprising Significant_flags, Last_significant_flags, coefficients and the corresponding contexts; (2) sequentially resolving the Significant_flag and the Last_significant_flag of a non-zero coefficient; and (3) decoding the non-zero coefficient to obtain regular bins and bypass bins, wherein the arithmetic decoding is conducted twice in a clock cycle.

Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).

Abstract: The present invention relates to a color-coated fouling-resistant conductive cloth and a manufacturing method thereof. The method includes the steps of providing a conductive cloth interwoven by natural fibers or artificial fibers and containing a metal layer, and forming at least one colored resin-coating layer on the metal layer of the conductive cloth by means of blade coating, wherein the surface of the resin-coating layer does not exceed the intersections of warp yarns and weft yarns of the conductive cloth. The conductive cloth of the present invention has the characteristics of colored appearance, artificial or environmental contamination resistance, and low surface resistance.

Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages.

Abstract: The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, and a second solder. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first solder is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole.

Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a wafer; (b) forming at least one blind hole in the wafer; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) forming a dry film on the conductive layer; (f) filling the blind hole with a solder; (g) removing the dry film; (h) patterning the conductive layer; (i) removing a part of the lower surface of the wafer and a part of the isolation layer, so as to expose a part of the conductive layer; (j) stacking a plurality of the wafers, and performing a reflow process; and (k) cutting the stacked wafers, so as to form a plurality of three-dimensional packages.