Abstract: A liquid crystal display (LCD) and fabricating method thereof. The fabricating method includes providing a double-layered substrate structure having a first seal pattern, inserted along the periphery thereof, wherein the first seal pattern has a notch for liquid crystal injection, facing an injecting direction of the liquid crystals, forming a second seal pattern near the notch, parallel to the injecting direction, injecting the liquid crystals via the notch along the injecting direction, and sealing the notch with a third seal pattern. According to the invention, the permeating rate of the third seal pattern is accelerated, enhancing the sealing of the liquid crystal display, and increasing productivity. Further, the second seal pattern enhances the adhesion between the substrate and the third seal pattern, protecting the cured third seal pattern from peeling and bubble formation.

Abstract: The present invention provides conductive carbon nanotube (CNT) electrode materials comprising aligned CNT substrates coated with an electrically conducting polymer, and the fabrication of electrodes for use in high performance electrical energy storage devices. In particular, the present invention provides conductive CNTs electrode material whose electrical properties render them especially suitable for use in high efficiency rechargeable batteries. The present invention also provides methods for obtaining surface modified conductive CNT electrode materials comprising an array of individual linear, aligned CNTs having a uniform surface coating of an electrically conductive polymer such as polypyrrole, and their use in electrical energy storage devices.

Abstract: A method of making a wire connection in a semiconductor device, the method comprising: (a) forming an under bump metallurgy (UBM) over a chip including the bonding pad formed thereon; (b) forming a gold bump on the UBM at a location corresponding to the bonding pad; (c) etching the UBM with the gold bump as a mask; and (d) connecting one end of a bonding wire to a conductive lead by ball bonding and the other end thereof to the gold bump on the bonding pad of the chip by stitch bonding. The conductive lead is located external to the chip as a part of a lead frame or a substrate. Alternatively, the semiconductor chip having bumps may be formed by electroless plating a nickel layer on the bonding pads of the chip, and followed by electroless plating a gold layer on the nickel layer. It is noted that the semiconductor chip having metal bumps is formed by wafer bumping process.

Abstract: An imaging system including a plurality of developing stations for developing an image on a sheet, a releasably removable image receiving module having at least one exposing unit and an image receiving substrate and a support structure for receiving the releasably removable image receiving module. The releasably removable image receiving module is configured to engage the support structure of the system such that the image receiving substrate of the module can be disposed in an operative relationship with the developing stations when the removable module is engaged with the support structure. This imaging system provides a method for upgrading, downgrading or modifying the imaging system that could be substantially performed by an end user. This imaging system may be embodied in a monocolor or multicolor printer, copier, facsimile machine or other electrophotographic based apparatus.

Abstract: A stacked chip scale package. The stacked chip scale package has a substrate having mounting pads arranged to lie close to the rectangular sides. A smaller silicon chip is stacked on the active surface of a larger silicon chip and the larger silicon chip rest on the substrate. The mounting pads on the substrate are distributed around the periphery of the lower silicon chip. Both the upper silicon chip and the lower silicon chip have only one pair of opposite sides having bonding pads. The pair of edges of the upper silicon chip with bonding pads nearby is parallel to the pair of edges of the lower silicon chip without bonding pads. The bonding pads on the upper chip and the lower chip are electrically connected to their neighboring mounting pads through conductive wires. The conductive wires, the upper silicon chip, the lower silicon chip and a portion of the substrate are enclosed by packaging material.

Abstract: The invention in the simplest form is a system for managing distributed power sources connected to a power grid. The present invention manages power flow to/from the power grid whether for a stand-alone power sourece or for local area utility grid or microgrid. When two or more power sources are interconnected by the local grid, each source has a power conditioning unit and a circuit breaker manager for controlling and regulating the electric flow to/from the grid. The individual power sources are able to independently draw power from the grid when required without extensive master control schemes. In a preferred embodiment the power sources are reformer equipped fuel cells and the heat from the fuel cell is used as a heat source for efficiency.

Abstract: A multichip module has at least two semiconductor chips wherein each has a row of bonding pads formed on the active surface thereof and disposed along one side edge thereof. In some embodiments, the semiconductor chips may have a plurality of bonding pads along only two mutually perpendicular side edges thereof. The semiconductor chips are mounted to a substrate in a stacking arrangement wherein the upper chip is attached to the active surface of the lower chip in a manner that no portion of the upper chip interferes with a vertical line of sight of each bonding pad of the lower chip to permit wire bonding thereof. Therefore, all semiconductor chips can be wire bonded simultaneously after stacking the chips on the substrate. This allows wire bonding of all chips to be completed in a single step so as to increase UPH (unit per hour), thereby reducing cost for manufacturing the MCM.

Abstract: In the embodiment disclosed in the specification, an electrophotographic exposure and development arrangement has a flexible transparent photoreceptor belt driven between two support rollers and along four printing stations at each of which the photosensitive surface of the photoreceptor is charged, exposed to a light image corresponding to a selected color, and developed with toner of the corresponding color to produce a composite multicolor image which is transferred to a substrate and subsequently fixed on the substrate. At each printing station an exposure unit has a curved belt support surface which is engaged by the photoreceptor belt passing through the printing station between the exposure location and a development location with a curvature and length selected to minimize the effect of ripples or irregularities in the position of the photosensitive surface of the photoreceptive belt resulting from a set taken by the photoreceptor belt when held stationery against a supporting number.

Abstract: This invention moves at least one outer via outwardly to a location under the edge of the chip so as to form an offset via. Since the via is made of copper, the offset via provides sufficient supporting strength for the chip edge during molding process. Further, this invention also disposes a copper mesh on the substrate at the area without vias and traces so as to enhance the substrate strength for supporting the chip. According to another aspect of this invention, dummy via holes are provided for the substrate at the area under the chip edge for supporting the chip. Since the copper mesh, offset via, the dummy via hole are made of copper having sufficient supporting strength for the chip, the crack problem during molding process can be eliminated.

Abstract: A 100% solids polyurethane adhesive composition for bonding polymeric roofing materials to roof-deck substrates is provided which includes two components. The first component comprises a monomeric or polymeric diisocyanate, or a polyurethane prepolymer formed by the reaction of the monomeric or polymeric diisocyanate with a polyol. The second component comprises a polyol selected from the group consisting of a polyether or polyester polyol, an alkanolamine diol, a hydroxyl-terminated homopolymer of polybutadiene, and mixtures thereof. The first and second components are combined such that the ratio of isocyanate groups in the first component to the ratio of hydroxyl groups in the second component is from about 0.5:1 to 1.5:1.

Abstract: The present invention resides in a method for transferring images from an image-bearing surface, to a moving web or sheet. The image-bearing surface is advanced in a predetermined direction, and the receptor area of the image-bearing surface is exposed to successive images. The successive images are developed using a liquid toner comprising charged pigmented particles, in a liquid hydrocarbon carrier. A porous web is transported in synchronism with movement of said image-bearing surface into position for transfer of said developed images on said receptor area successively onto said web. In one embodiment, the web is an uncoated, non-conductive porous material. The web is treated with a fluorinated or partially fluorinated hydrocarbon surfactant hold-out material in an amount effective to reduce the penetration rate of the toner carrier into the web so as to ensure that sufficient carrier is available for complete and void-free transfer.