Patents by Inventor Jian Xu

Jian Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240414183
    Abstract: The invention belongs to the technical field of defense of new energy centralized control station networks, and particularly relates to a dynamic defense system and method of a new energy centralized control station network based on dynamic IP. By monitoring and statistics of the abnormal traffic, the present invention can determine the occurrence frequency and the occurrence interval of the abnormal traffic, further analyze and determine the defense state of a new energy centralized control station based on this, and execute the corresponding dynamic optimization solution according to different defense states, so that the IP address and the firewall of the new energy centralized control station can be dynamically adjusted to ensure the security performance of the new energy centralized control station, reduce the risk of external intrusion, effectively resist malicious network reconnaissance such as scanning attacks and ensure the stable operation of a new energy power generation system.
    Type: Application
    Filed: August 19, 2024
    Publication date: December 12, 2024
    Inventors: Hao Yang, Jian Xu, Yongcai Xiao, Lingling Zhang, Shuhui Pan
  • Publication number: 20240403276
    Abstract: Described herein are techniques for data quality monitoring in a network-based data system. A data metric function used to evaluate data quality can be stored, where the data metric function is defined as schema level object. The data metric function can be attached to a table associated with an account and is evaluated on data associates with the table to generate evaluation results. The evaluation results can be stored in an account-specific central database, from which access is provided to the evaluation results to a user for the account.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 5, 2024
    Inventors: Hossein Ahmadi, Raja Suresh Krishna Balakrishnan, David Schultz, Jian Xu, Yunqiao Zhang
  • Publication number: 20240404930
    Abstract: The present disclosure provides a package structure and a related manufacturing method thereof, wherein a heat dissipation structure surrounding a chip is arranged, and an electrical connection structure is arranged on the outer side of the heat dissipation structure, so that other laminated package components can be electrically connected through a second electrical connection surface of the electrical connection structure to achieve lamination; the heat dissipation structure, the molding layer and the electrical connection structure are fastened through molding the electrical connection structure and the heat dissipation structure by the molding layer, and the molding layer and the electrical connection structure are prevented from warpage by the heat dissipation structure; finally, the package structure has the functions of heat dissipation, lamination and warpage prevention.
    Type: Application
    Filed: May 30, 2024
    Publication date: December 5, 2024
    Applicant: STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
    Inventors: Jiade Liao, Jian Xu, Soo Won Lee
  • Patent number: 12160731
    Abstract: A method and apparatus supporting UP security for MO-EDT in CU-DU split in a wireless communication system. A central unit (CU) receives, from a distributed unit (DU), a first message including a PDCP Data PDU, wherein the PDCP Data PDU is configured by a wireless device. A CU calculates a HASHDATA from the PDCP Data PDU. A CU verifies a Short MAC-I of the wireless device based on the HASHDATA. A CU transmits, to the DU, a second message to setup a UE context for the wireless device in the DU based on the verification.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 3, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Seokjung Kim, Jian Xu, Daewook Byun
  • Patent number: 12147473
    Abstract: Graph data processing methods and system are disclosed. One example method comprises obtaining, by a master node, graph data, wherein the graph data comprises M vertexes and a plurality of directional edges, each edge connects two vertexes, a direction of each edge is from a source to a destination vertex in the two vertexes, and M is an integer greater than two. The node divides the graph data into P non-overlapping shards, where each shard comprises at least one incoming edge directed to at least one vertex in the corresponding shard. The node schedules at least two edge sets comprised in a first shard of the P shards and an associate edge set comprised in a second shard of the P shards for processing by at least two worker nodes.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: November 19, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yinglong Xia, Jian Xu, Mingzhen Xia
  • Patent number: 12147047
    Abstract: Methods and systems for propagating light into a waveguide are provided. The system may include a light source configured to generate light. The system may include at least one mirror configured to direct the light into one or more rays of light. The system may include a Surface Relief Grating disposed on a Volume Bragg Grating. The Surface Relief Grating may receive the one or more rays of light and may diffract the one or more rays of light. The Volume Bragg Grating may be disposed on the waveguide in which the waveguide may be configured to receive the one or more rays of light from the Volume Bragg Grating and propagate the one or more rays of light throughout the waveguide such that an off-Bragg condition is exhibited by the one or more rays of light propagating through the waveguide.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: November 19, 2024
    Assignee: Meta Platforms, Inc.
    Inventor: Jian Xu
  • Publication number: 20240379701
    Abstract: A sensor package structure includes: a substrate; a sensor chip, displayed on the substrate and electrically connected to the substrate, where a light-receiving region is displayed on a surface, facing away from the substrate, of the sensor chip; a first package body, covering the substrate and having a chamber therein, where the light-receiving region of the sensor chip is exposed in the first chamber, and the first package body has a first opening, the first opening being in communication with the first chamber and corresponding to the light-receiving region of the sensor chip; a transparent cover plate, displayed within the first opening, where the transparent cover plate includes a first surface facing towards the first chamber and a second surface facing away from the first surface; and a second package body, displayed on the first package body.
    Type: Application
    Filed: April 10, 2024
    Publication date: November 14, 2024
    Applicant: STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
    Inventors: Jeonghan KIM, Soo Won LEE, Jian XU, Hyoungill MIN, Chuanming TANG
  • Publication number: 20240381199
    Abstract: A method and apparatus for performing handover based on AI model in a wireless communication system is provided. The source node acquire a mobility information for a specific UE. The source node transmits, to the specific UE, a measurement configuration including a request for a location information. The source node receives, from the specific UE, the location information. The source node determine a target RAN node for the specific UE by using an AI model, based on the mobility information and the location information. The source node performs a handover procedure for the specific UE with the determined target RAN node.
    Type: Application
    Filed: December 22, 2021
    Publication date: November 14, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Jian XU, Daewook BYUN, Seokjung KIM
  • Publication number: 20240373300
    Abstract: A method of operating a central unit (CU) in a wireless communication system may comprise obtaining, by the CU, a first slice group identifier (ID) of a first terminal and slice mapping related information from a distributed unit (DU), transferring the first slice group ID and the slice mapping related information to an access and mobility management function (AMF) supporting the first slice group ID, obtaining mapping information related to a slice list supported by the first slice group for the first terminal from the AMF, and transferring the mapping information related to the slice list supported by the first slice group for the first terminal obtained from the AMF to the DU.
    Type: Application
    Filed: August 4, 2022
    Publication date: November 7, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Seokjung KIM, Jian XU, Daewook BYUN
  • Patent number: 12135815
    Abstract: Row-level security (RLS) may provide fine-grained access control based on flexible, user-defined access policies to databases, tables, objects, and other data structures. A RLS policy may be an entity or object that defines rules for row access. A RLS policy may be decoupled or independent from any specific table. This allows more robust and flexible control. A RLS policy may then be attached to one or more tables. The RLS policy may include a Boolean-valued expression.
    Type: Grant
    Filed: November 28, 2023
    Date of Patent: November 5, 2024
    Assignee: Snowflake Inc.
    Inventors: Artin Avanes, Khalid Zaman Bijon, Zheng Mi, Subramanian Muralidhar, David Schultz, Jian Xu
  • Publication number: 20240365212
    Abstract: A core network device receives, from a wireless device, a first message indicating a request for network slice group information. The core network device sends, to the wireless device, a second message comprising the network slice group information. The network slice group information sent by the core network device by the second message to the wireless device indicating that a first network slice group comprises at least one first network slice.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 31, 2024
    Applicant: Ofinno, LLC
    Inventors: Kyungmin Park, Taehun Kim, Esmael Hejazi Dinan, Peyman Talebi Fard, Weihua Qiao, SungDuck Chun, Jian Xu
  • Publication number: 20240363515
    Abstract: A semiconductor package structure and a forming method therefor are disclosed. The package structure includes: an encapsulant including a first and a second surfaces that are opposite and peripheral side surfaces, wherein the first surface is provided with protruding connection terminals, and junction between the first surface and the peripheral side surfaces are provided with four top corners; a substrate including a flip-chip area, wherein the flip-chip area is provided with four corner areas corresponding to four top corners of the encapsulant; trenches positioned in the substrate in the corner areas or around the corner areas or in the four corner areas and around the four corner areas at the same time; a high-modulus first underfill layer filling four trenches and spaces between the four trenches and the first surface of the encapsulant; and a low-modulus second underfill layer filling a remaining space between the encapsulant and the substrate.
    Type: Application
    Filed: April 26, 2024
    Publication date: October 31, 2024
    Applicant: STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
    Inventors: Jeonghan Kim, Soo Won Lee, Jian Xu, Hyoungill Min, Ruifeng Jiang
  • Publication number: 20240363601
    Abstract: The present disclosure discloses a chip package structure and a preparation method thereof. The chip package structure includes: a metal wiring layer; a first chip, wherein a front surface of the first chip is flip-chipped on a first surface of the metal wiring layer; a first molding layer coating the first chip; a second chip, wherein a front surface of the second chip is flip-chipped on a second surface of the metal wiring layer; a first metal pillar formed on the second surface of the metal wiring layer; a second molding layer coating the second chip and the first metal pillar; and a second metal pillar formed on one side that is of the second molding layer and that is far away from the metal wiring layer, wherein the second metal pillar is at least partially connected to the corresponding first metal pillar.
    Type: Application
    Filed: April 26, 2024
    Publication date: October 31, 2024
    Applicant: STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
    Inventors: Zelong Yu, Huanhuan Yuan, Jian Xu, Soo Won Lee
  • Publication number: 20240363814
    Abstract: A display device includes a display panel and a light-emission board which includes a base substrate and light-emission units, and a maximum size of the light-emission unit in a direction parallel to the base substrate is not greater than 3 mm; connecting lines of centers of four immediately adjacent light-emission units define a quadrangle; a connecting line of centers of two light-emission units that define the quadrangle and have a largest distance therebetween passes through two first points in edges, close to each other, of the two light-emission units; a distance between the two first points is a first distance D1; an included angle between an outermost light ray of light rays emitted by the light-emission unit and a plane parallel to the base substrate is ?; and a minimum distance between surfaces, close to each other, of the display panel and the base substrate is not less than D1*tan?/2.
    Type: Application
    Filed: March 3, 2022
    Publication date: October 31, 2024
    Inventors: Qi QI, Jian XU, Wanzhi CHEN, Xinxin ZHAO
  • Publication number: 20240364605
    Abstract: A method and apparatus for performing QoE management based on AI model in a wireless communication system is provided. A RAN node transmits a Quality of Experience (QoE) configuration including one or more of QoE parameters. A RAN node receives a QoE report for the one or more of QoE parameters. A RAN node trains an AI model using the one or more QoE parameters as inputs.
    Type: Application
    Filed: January 17, 2022
    Publication date: October 31, 2024
    Inventors: Jian XU, Daewook BYUN, Seokjung KIM
  • Publication number: 20240356794
    Abstract: Embodiments of this disclosure provide a method and an apparatus for determining a fault cause, to quickly determine a fault cause of a link between a control device and a radio frequency device, so that a fault can be quickly rectified. The method may include: A first radio frequency device receives first information from a second radio frequency device, where the first information is for determining a fault cause of the second radio frequency device and/or a fault cause of a link between the second radio frequency device and a control device. The first radio frequency device sends the first information to the control device or a management device.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Qingjiang Wang, Jian Xu, Xin Chen
  • Publication number: 20240356823
    Abstract: A method may include sending, by a master base station of a wireless device to a secondary base station of the wireless device, a request message that includes one or more available radio access network (RAN) visible quality-of-experience (QoE) metrics that can be collected by the secondary base station from the wireless device. The wireless device may be connected to the master base station and the secondary base station. In response to the request message, receiving, by the master base station from the secondary base station, a message comprising at least one first RAN visible QoE metric that can be collected by the secondary base station from the wireless device. The method may further include sending, by the master base station to the wireless device, a radio resource control (RRC) message, after receiving the request message, to reconfigure the wireless device.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Ofinno, LLC
    Inventors: Jian Xu, Kyungmin Park, Esmael Hejazi Dinan, SungDuck Chun, Peyman Talebi Fard, Weihua Qiao, Stanislav Filin
  • Patent number: 12125406
    Abstract: Disclosed are a semantic reasoning method and a terminal for a learning target in an education metaverse. The method includes receiving a description text of a learning target, segmenting the description text into a lexical item sequence, extracting an entry from the lexical item sequence, extracting a semantic lexical item based on the entry, and mapping the semantic lexical item into a first word vector. By capturing the semantic feature vector in the word vector, the subject and knowledge points in the learning target are obtained by reasoning, the target knowledge points of the learning target are determined and positioned, and the association relationship between the target knowledge points is obtained, so that the semantic information of the learning target can be fully mined, and the accuracy of the learning target extraction can be improved. It matches with the corresponding teaching scene based on the learning targets.
    Type: Grant
    Filed: March 19, 2024
    Date of Patent: October 22, 2024
    Assignees: FUJIAN TQ DIGITAL INC., CENTRAL CHINA NORMAL UNIVERSITY
    Inventors: Dejian Liu, Ronghua Wu, Zheng Zhong, Jian Xu
  • Patent number: D1051174
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 12, 2024
    Assignee: Fresenius Kabi (Nanchang) Co., Ltd.
    Inventors: Qing Hu, Zhenzhong Zou, Jian Xu, Fat Kit Lau
  • Patent number: D1053239
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: December 3, 2024
    Assignee: Shenzhen Wanzhi Innovation Technology Co., Ltd
    Inventor: Jian Xu