Abstract: An image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract: An image sensor module includes an image sensor, and a lens holder and a lens barrel on the image sensor. The image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract: An image sensor includes a lower metal sheet set, an upper metal sheet set, an encapsulant, a photosensitive chip, plural wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a lower middle board arranged among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets and an upper middle board arranged among and flush with the upper metal sheets. The encapsulant encapsulates the lower metal sheets, lower middle board, upper metal sheets and upper middle board with the upper metal sheets, lower metal sheets, lower middle board, and upper middle board exposed from the encapsulant, and with a frame layer formed around the upper metal sheets to define a chamber. The photosensitive chip is arranged on the upper surface of the upper middle board and located within the chamber.

Abstract: A package structure of an image sensor module for electrically connecting to a printed circuit board includes a transparent layer, an image sensing chip, a lens holder and a lens barrel. A plurality of signal input terminals and signal output terminals are formed on the transparent layer. The electrical circuits are formed on the image sensing chip, each of the electrical circuits is formed with bonding pads and is electrically connected to the transparent layer by way of flip chip bonding. A lens holder is formed with a through hole, an internal thread is formed on an inner wall of the through hole. The lens holder is mounted to the upper surface of the transparent layer. A lens barrel is arranged within the through hole of the lens holder and is formed with an external thread, which is screwed to the internal thread of the lens holder, the lens barrel is formed with a chamber and an opening communicating with the chamber.

Abstract: An image sensor package includes a plurality of leadframes, a molded resin, a photosensitive, a plurality of wires and a transparent layer. Each of the leadframes have a first board and a second board located on a height different from that of the first board, and a chamber is defined upper a central of the plurality of leadframes. The molded resin is for encapsulating the leadframes, and is forming an upper surface and a lower surface, wherein the first boards of the leadframes are exposed from the upper surface of the molded resin. The photosensitive chip is mounted onto the upper surface of the molded resin and arranged within the chamber. Each of wires are electrically connected the photosensitive chip to the each second board of the plurality of leadframes. And the transparent resin is covered onto the each first board of the plurality of leadframes.

Abstract: A memory card for being electrically connected to an electrical device. The memory card includes a substrate, and at least one memory chip. The substrate is formed with a plurality of contact leads, which is electrically connected to the electrical device when the substrate is inserted into the electrical device. The plurality of contact leads includes a long contact lead and a short contact lead to indicate an inserting direction of the substrate into the electrical device. The memory chip is mounted to the substrate and electrically connected to the plurality of contact leads.

Abstract: A substrate structure for a photosensitive chip package includes a plurality of leadframes, which are arranged in a matrix, and a molded resin. Each of the leadframes have a first board and a second board located on a height different from that of the first board, and a chamber is defined upper a central of the plurality of leadframes. And the molded resin is for encapsulating the leadframes, and forming an upper surface and a lower surface, wherein the first boards of the leadframes are exposed from the upper surface of the molded resin.

Abstract: A wire bonding capillary includes a first column having a first end and a second end, a second column extending from the second end of the first column and having a circular cross-section with a diameter smaller than that of the first column, and a third column extending from the second column and formed with a funnel structure and a pointed wire-bonding end. The third column is positioned between a frame layer and a photosensitive chip of an image sensor to bond a plurality of wires to a photosensitive chip and a substrate of the image sensor.

Abstract: An image sensor includes a substrate, a frame layer, a photosensitive chip, and a transparent layer. The substrate has an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points. The frame layer has a first surface and a second surface and is mounted to the upper surface of the substrate with the first surface of the frame layer contacting the upper surface of the substrate so as to form a cavity together with the substrate. The second surface is formed with a rough contact surface. The photosensitive chip is mounted to the upper surface of the substrate and located within the cavity and is electrically connected to the first connection points of the substrate. The transparent layer is adhered to the rough contact surface.

Abstract: A simplified image sensor module includes a substrate, a photosensitive chip, a plurality of wires, and transparent glue. The substrate has an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points. The photosensitive chip has a plurality of bonding pads and is mounted to the upper surface of the substrate. The wires electrically connect the bonding pads of the photosensitive chip to the first connection points of the substrate, respectively. The transparent glue is arranged on the upper surface of the substrate to encapsulate the photosensitive chip and is formed with a convex portion corresponding to the photosensitive chip. The photosensitive chip may receive focused optical signals focused by the convex portion of the transparent glue.

Abstract: A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip, which is formed with a plurality of bonding pads, to the upper surface of the substrate, the photosensitive chip being located within the cavity; providing a plurality of wires to electrically connect the bonding pads of the photosensitive chip to the substrate; supplying an adhesive medium to the cavity; placing a transparent layer on the frame layer to cover the photosensitive chip so as to form the image sensor; and rotating the image sensor to make the adhesive medium uniformly distributed over the upper surface of the substrate so that particles within the cavity may fall to the adhesive medium.

Abstract: A simplified image sensor module includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and transparent glue. The substrate has an upper surface and a lower surface. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is mounted to the upper surface of the substrate and is located within the cavity. The wires electrically connect bonding pads of the photosensitive chip to the substrate. The transparent glue is filled in the cavity to encapsulate the photosensitive chip and is formed with a convex portion corresponding to the photosensitive chip. Therefore, the photosensitive chip may receive focused optical signals focused by the convex portion of the transparent glue.

Abstract: An image sensor having improved functions. The image sensor includes a plurality of metal sheets arranged in a matrix, an insulation layer, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. Each metal sheet has a first board and a second board. The insulation layer is adhered to the first boards to fix the first boards. The photosensitive chip is arranged on the first boards. The wires electrically connect the photosensitive chip to the first boards. The glue layer encapsulates the metal sheets with the first boards and second boards exposed from the glue layer, and the glue layer is formed with a projection edge. The transparent layer is placed on the projection edge to cover the photosensitive chip.

Abstract: An injection-molded structure of an image sensor to be electrically connected to a printed circuit board. The image sensor includes metal sheets arranged in a matrix, a U-shaped injection molding structure encapsulating the metal sheets by way of injection molding, a photosensitive chip having a plurality of bonding pads, wires, and a transparent layer. Each metal sheet includes a first board. The injection molding structure has a first molded body, a second molded body, and a cavity. The first boards are exposed from the injection molding structure to form signal input and output terminals, respectively. The chip is arranged within the cavity. The wires electrically connect the bonding pads to the signal input terminals, respectively. The transparent layer is arranged on a top of the first molded body to cover over the chip. The invention also discloses a method for manufacturing the image sensor.

Abstract: An improved structure of an image sensor includes a substrate, a frame layer on the substrate to form a chamber together with the substrate, a photosensitive chip arranged on the substrate and within the chamber, a plurality of wires, a transparent layer placed on the frame layer, and a filling medium. The frame layer is formed with at least one venthole communicating with the chamber. The wires electrically connect the chip to the substrate. The filling medium is filled into the venthole of the frame layer to seal the chamber. Accordingly, the air pressure within the chamber generated when the transparent layer is fixed to the frame layer may be released through the venthole, and the transparent layer may be firmly fixed to the frame layer.

Abstract: A method for packaging an injection-molded image sensor includes the steps of: providing metal sheets arranged in a matrix, each of the metal sheets having a first board, a second board and a third board to form a -shaped structure; performing a first injection molding process to encapsulate the metal sheets and to form a first molded body with the first to third boards exposed; performing a second injection molding process to form a second molded body and a cavity on the first molded body, wherein the first boards are located within the cavity; arranging a photosensitive chip having bonding pads within the cavity; providing wires for electrically connecting the bonding pads to the first boards, respectively; and arranging a transparent layer on a top of the second molded body to cover over the photosensitive chip.

Abstract: A simplified image sensor module of the invention includes a substrate, a frame layer, a photosensitive chip, wires, and a transparent layer. The substrate has an upper surface and a lower surface. The frame layer has a first surface and a second surface. The first surface is arranged on the upper surface of the substrate, and a cavity is formed between the substrate and the frame layer. The photosensitive chip has bonding pads and is mounted to the upper surface of the substrate and located within the cavity. The wires electrically connect the bonding pads of the photosensitive chip to the substrate. The transparent layer is arranged on the second surface of the frame layer and is formed with a convex portion at a position corresponding to the photosensitive chip. Accordingly, the photosensitive chip may receive focused optical signals passing through the convex portion.

Abstract: An image sensor with improved sensor effects includes a substrate, a frame layer, a photosensitive chip, wires, and a transparent layer. The substrate has an upper surface and a lower surface. Signal input terminals are formed at a periphery of the upper surface, and projections with the same height are formed at a central portion of the upper surface. The frame layer is arranged at a periphery of the substrate to form a U-shaped structure and a cavity together with the substrate. The signal input terminals and projections are inside the cavity. The photosensitive chip is arranged on the projections. The wires electrically connect the photosensitive chip to the signal input terminals of the substrate. The transparent layer is placed on the frame layer to cover the photosensitive chip. By placing the photosensitive chip on the projections, better flatness and thus better sensor effects may be obtained.

Abstract: An image sensor includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate consists of a middle board and a plurality of spaced, symmetrical metal sheets arranged at two sides of the middle board. Each metal sheet includes a first board and a second board positioned at different heights. The horizontal height of the middle board is lower than that of the first board. The frame layer encapsulates the metal sheets and the middle board with the first boards, second boards and middle board of the metal sheets exposed from the frame layer. The second board is electrically connected to the printed circuit board. The photosensitive chip is positioned on the middle board of the substrate. The wires electrically connect the first boards to the photosensitive chip. The transparent layer is positioned on the frame layer to cover the photosensitive chip.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board, a third board, and a fourth board. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.