Abstract: An image sensor package without a frame layer. The image sensor package includes a substrate, a photosensitive chip, a transparent layer, a plurality of wires, and a glue layer. The substrate has an upper surface formed with signal input terminals, and a lower surface formed with signal output terminals electrically connected to a printed circuit board. The photosensitive chip includes a photosensitive region and bonding pads formed on a periphery of the photosensitive region. The transparent layer is adhered to the photosensitive region by an adhesive. Each of the wires has a first terminal and a second terminal. The first terminals are electrically connected to the bonding pads, respectively, and the second terminals are electrically connected to the signal input terminals, respectively, so as to electrically connect the photosensitive chip to the substrate. The glue layer covers over the substrate for sealing the plurality of wires.

Abstract: A photosensitive assembly with a transparent layer and a method for manufacturing the same. The method includes the steps of: providing a wafer having a plurality of photosensitive chips, each photosensitive chip having a photosensitive region and a plurality of bonding pads formed at a periphery of the photosensitive region; providing a plurality of transparent layers on the photosensitive regions of the photosensitive chips, respectively; and cutting the wafer into photosensitive assemblies using a cutter. Thus, each photosensitive chip may receive optical signals passing through the transparent layer.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board, a third board, and a fourth board. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

Abstract: An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a second board. A chamber is defined under the substrate to accommodate the chip. Each pad is arranged between first boards. The frame layer is formed on a periphery and the bottom surface to encapsulate the chip. The bottom faces of the second boards are electrically connected to a printed circuit board. Each wire has a first terminal and a second terminal. The first terminals are electrically connected to the pads, and the second terminals are electrically connected to the first boards, respectively.

Abstract: A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

Abstract: An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

Abstract: The invention provides an image sensor including a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate includes plural metal sheets, which are spaced apart and arranged in an alternating manner. Each of the metal sheets includes a first board and a second board positioned at different heights. The frame layer is formed around and under the substrate to form a cavity with the substrate. Each of the first boards has a top surface exposed from the frame layer while each of the second boards has a bottom surface, which is exposed from the frame layer and serves as contact points for signal outputs. The photosensitive chip is positioned within the cavity. The wires electrically connect the top surfaces of the first boards to the photosensitive chip. The transparent layer is placed on the frame layer to cover the photosensitive chip. According to the invention, the manufacturing cost can be effectively lowered and the production yield can be improved.

Abstract: A method for packaging image sensors of the invention includes the steps of: providing a substrate formed with a plurality of zones, traces, and first long-holes penetrating through the substrate at a periphery of each zone, the zones being separated by the first long-holes; providing a frame layer placed on the substrate, the frame layer being formed with slots at positions corresponding to the zones of the substrate, and with second long-holes at positions corresponding to the first long-holes of the substrate; placing a plurality of photosensitive chips in each of the zones of the substrate and within the slots, respectively; electrically connecting the plurality of photosensitive chips to the substrate; placing a plurality of transparent layers above the slots of the frame layer to cover the photosensitive chips, respectively; and cutting along the first long-holes of the substrate and the second long-holes of the frame layer to form a plurality of image sensors.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board.

Abstract: A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The second surface is formed with a plurality of signal output terminals for electrically connecting to the circuit board. The integrated circuit has a lower surface and an upper surface. Recesses are formed at two sides of the lower surface, and a plurality of bonding pads are formed on the upper surface. The adhesive layer is used for adhering the lower surface of the integrated circuit to the first surface of the substrate. The wirings are electrically connecting to the bonding pads of the integrated circuit and to the signal input terminals of the substrate. The glue layer is used for sealing the plurality of wirings and the integrated circuits.

Abstract: A probe structure for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

Abstract: A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

Abstract: A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate.

Abstract: A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

Abstract: The invention provides a socket for testing a semiconductor package device having a plurality of to-be-tested points. The socket includes a pin board unit, a plurality of resilient members, a plurality of probe bodies, and a plurality of electroconductive elements. The pin board unit is formed with pin holes at positions corresponding to the to-be-tested points. The pin board unit is formed with a cavity for receiving the semiconductor package device. The resilient members are arranged within the pin holes, respectively. The probe bodies are inserted into the pin holes and in contact with the resilient members, respectively. Each electroconductive element has an upper section and a lower section. The upper sections are electrically connected to the resilient members, and the lower sections are exposed from the pin holes, respectively.

Abstract: A probe structure for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.

Abstract: The invention provides a reusable test jig including a pin board unit, a plurality of resilient members, a plurality of electroconductive members, a holding plate unit and a plurality of probes. The pin board unit is formed with predetermined pin holes. The electroconductive resilient members are received with the pin holes of the pin board unit, respectively. The electroconductive members are electrically connected to the corresponding resilient members, respectively. The holding plate unit is formed with predetermined holding holes corresponding to the pin holes. At least one holding hole is properly inclined. The probes are inserted into and held by the holding holes of the holding plate unit and electrically contact the resilient members, respectively. Thus, the at least one probe may be properly inclined and contact the to-be-tested device. Accordingly, the signals can be directly transferred from the probes to the electroconductive members via the resilient members, respectively.