Abstract: A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained.

Abstract: A packaging structure of an image sensor includes a plurality of metal sheets, a photosensitive chip, and transparent glue. Each of the metal sheets has a first surface and a second surface. The photosensitive chip is electrically connecting to the plurality of first surfaces of the metal sheets. The transparent glue is for covering the metal sheets and the photosensitive chip is capable of receiving optical signals. The second surfaces of the metal sheets bonded by the transparent glue are exposed to the outside so as to form signal output terminals for the image sensor. A method for packaging the structure is also disclosed.

Abstract: A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure the image sensing chip and the integrated circuit can be integrally stacked easily.

Abstract: A method for manufacturing films used in semiconductor package, comprising the steps of: providing a frame having an upper surface and a lower surface opposite to the upper surface, a through-hole being formed in the frame; mounting a first covering layer onto the lower surface of the frame in order to covering the through-hole; placing a film into the through-hole of the frame, the film being adhered onto the first covering layer; providing a second covering layer for covering the frame and packing the film, the film being located between the first covering layer and the second covering layer; and cutting the film into a plurality of films each having a predetermined size by a cutting tool. The films after being cut may be placed between the lower semiconductor chip and the upper semiconductor chip, so that the plurality of wirings and the lower semiconductor chip are free from being short-circuited, and the bad signal transmission can be avoided.

Abstract: A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The second surface is formed with a plurality of signal output terminals for electrically connecting to the circuit board. The integrated circuit has a lower surface and an upper surface. Recesses are formed at two sides of the lower surface, and a plurality of bonding pads are formed on the upper surface. The adhesive layer is used for adhering the lower surface of the integrated circuit to the first surface of the substrate. The wirings are electrically connecting to the bonding pads of the integrated circuit and to the signal input terminals of the substrate. The glue layer is used for sealing the plurality of wirings and the integrated circuits.

Abstract: The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements.

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board.

Abstract: A stacked package structure of an image sensor is used for electrically connecting to an printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transparent to the substrate.

Abstract: An integrated circuit structure having an adhesive agent for adhering to a substrate includes a first surface and a second surface opposite to the first surface. The first surface is formed with a plurality of bonding pads for electrically connecting to the substrate and transmitting signals from the integrated circuit to the substrate. An adhesive agent, which is non-adhesive at the room temperature, is applied onto the second surface. The adhesive agent becomes adhesive under pressing/heating so as to adhere onto the substrate. According to the structure, the problems caused by the overflowed glue can be avoided, the manufacturing processes can be facilitated, and the yield can be improved.

Abstract: The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate.

Abstract: A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained.

Abstract: A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The second surface is formed with a plurality of signal output terminals for electrically connecting to the circuit board. The integrated circuit has a lower surface and an upper surface. Recesses are formed at two sides of the lower surface, and a plurality of bonding pads are formed on the upper surface. The adhesive layer is used for adhering the lower surface of the integrated circuit to the first surface of the substrate. The wirings are electrically connecting to the bonding pads of the integrated circuit and to the signal input terminals of the substrate. The glue layer is used for sealing the plurality of wirings and the integrated circuits.

Abstract: A stacked structure of integrated circuits for electrically connecting to a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, and an upper integrated circuit. The lower integrated circuit has a lower surface and an upper surface. The lower surface is adhered onto the first surface of the substrate. A plurality of bonding pads are formed on the upper surface. The wirings each has a first end and a second end. The first ends of the wirings are electrically connected to the bonding pads of the lower integrated circuit. The second ends of the wirings are electrically connected to the signal input terminals of the substrate. The upper integrated circuit has a lower surface and an upper surface. Two recesses are formed at two sides of the lower surface. The upper integrated circuit is adhered to the upper surface of the lower integrated circuit so as to stack above the lower integrated circuit.

Abstract: A packaging structure of an image sensor includes a plurality of metal sheets, an image sensing chip, and transparent glue. Each of the metal sheets has a first surface and a second surface. The image sensing chip is electrically connecting to the plurality of first surfaces of the metal sheets. The transparent glue is for covering the metal sheets and the image sensing chip is capable of receiving optical signals. The second surfaces of the metal sheets bonded by the transparent glue are exposed to the outside so as to form signal output terminals for the image sensor. A method for packaging the structure is also disclosed.

Abstract: A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

Abstract: A package structure of an image sensor for electrically connecting to a printed circuit board includes a transparent layer and an image sensing chip. A plurality of signal input terminals and signal output terminals are formed on the transparent layer. The signal output terminals are used for electrically connecting the transparent layer to the printed circuit board. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads and is electrically connected to the transparent layer by way of flip chip bonding. The bonding pads are electrically connected to the signal input terminals of the transparent layer. The image sensing chip receives image signals via the transparent layer, converts the image signals into electrical signals, and transmits the electrical signals from the signal output terminals of the transparent layer to the printed circuit board.

Abstract: An stacked structure of semiconductor means and method for manufacturing the same, comprises a substrate, a lower semiconductor chip, an adhered glue layer, a plurality of wires and an upper semiconductor chip. The adhered glue layer located between the substrate and the lower semiconductor to adhere the lower semiconductor to the substrate. The overflow glue of the adhered glue layer covered above the periphery of the lower semiconductor chip. The plurality of wires each being electrically connected to the lower semiconductor chip and the substrate, so that each wires are located above the overflow glue. The upper semiconductor chip is located above lower semiconductor chip and electrically connected to the substrate.

Abstract: A structure of a photosensor for receiving optical signals and converting the optical signals into electrical signals to be transmitted to a circuit board, the structure of the photosensor includes a substrate, a photosensitive chip, and a transparent layer. The substrate has a first surface formed with signal input terminals, and a second surface opposite to the first surface and formed with signal output terminals for electrically connecting the substrate to the circuit board. The photosensitive chip is mounted on the first surface of the substrate and electrically connecting to the substrate. The transparent layer is adhered onto the first surface of the substrate. A cavity is formed at a central portion of the transparent layer. The photosensitive chip on the substrate is located within the cavity of the transparent layer, and the photosensitive chip is capable of receiving the optical signals via the transparent layer.

Abstract: A stackable integrated circuit for electrically connecting to a circuit board and for a second integrated circuit body to be stacked on. The stackable integrated circuit includes an integrated circuit body, a plurality of first contacts, a projecting layer, and a plurality of second contacts. The integrated circuit body has a first surface and a second surface opposite to the first surface. The first contacts are formed on the first surface of the integrated circuit body for electrically connecting the integrated circuit body to the circuit board. The projecting layer is arranged on the second surface of the integrated circuit body. The second contacts are formed on the projecting layer for electrically connecting the integrated circuit body to a second integrated circuit body.