Abstract: A battery pack including a plurality of battery cells; and a rigid printed circuit board (PCB) electrically connected to each battery cell and extending across the plurality of battery cells, wherein the rigid PCB includes a bus to electrically connect the plurality of battery cells to each other, and a battery management system (BMS) to control a charge/discharge operation of the plurality of battery cells.

Abstract: An apparatus enables a high-bandwidth 4-way data serializing (4:1 serializer) digital-to-analog converter. The apparatus uses active inductor-based bandwidth extension technique for two-stage driver enabling design of quarter-rate 4-way data serializing transmitter. The 4:1 serializer output bandwidth is extended by gate-resistor-peaked n-type transistor load working as an active inductor. A current steering switch with current source is used as the final driver. The 4:1 serializer includes a pulse width tuning technique with tunable ground voltage on the ground terminal of a pulse generator to tune an effective threshold voltage of the pulse generator. A Bessel-like LC filter is coupled to an output of the 4:1 serializer. The filter includes shunt peaking paths that provide zeros, which natively cancel large parasitic capacitance at a shunt peaking node. As such, active and passive devices including driver circuitry, ESD diodes, and any other sensing circuitry are flexibly added on any LC filter nodes.

Abstract: The disclosure relates to an electronic device comprising a metal mesh touch electrode. The electronic device may include: a display panel comprising an active area in which data is displayed, and an edge area formed along the outer peripheral surface of the active area; a substrate positioned on the display panel, the substrate comprising a first area corresponding to the active area and a second area corresponding to the edge area; a metal mesh electrode pattern formed in the first area and the second area; and multiple trace wires positioned on the substrate and electrically connected to the metal mesh electrode pattern. The metal mesh electrode pattern may comprise a first electrode pattern having a lattice structure, and a second electrode pattern having a lattice structure, the second electrode pattern being positioned on top of the first electrode pattern and disposed so as to crisscross the first electrode pattern.

Abstract: A light-emitting device and an electronic apparatus including the same are provided. The light-emitting device includes: a first electrode; a second electrode facing the first electrode; m emission units stacked between the first electrode and the second electrode and including an emission layer; and m?1 charge generation layers each between two neighboring emission units from among the m emission units, wherein m is an integer of 2 or more, at least one of the m emission units includes an inorganic mixed layer between the first electrode and the emission layer, and the inorganic mixed layer includes an inorganic insulating material and an inorganic semiconductor material.

Abstract: Proposed in various embodiments of the present disclosure are a device and a method for image processing, whereby image conversion by dilation is carried out in a multimedia system. To this end, an electronic device for image processing may identify between a first unused area in a first picture and a second unused area in a second picture, the first unused area and the second unused area having the same time information. The electronic device may acquire fill values for replacing the first unused area and the second unused area, on the basis of a value acquired from the first unused area and a value acquired from the second unused area. The electronic device may acquire a first converted picture and a second converted picture by replacing the first unused area and the second unused area by using the acquired fill values.

Abstract: A method of manufacturing a thin film transistor includes: removing an oxide film on a surface of an amorphous silicon layer by performing a surface cleaning; and forming an active layer by performing a heat treatment on the amorphous silicon layer, where the amorphous silicon layer is changed into crystalline silicon by the heat treatment.

Abstract: A semiconductor device includes a pattern structure; a stack structure including gate layers stacked in a first region on the pattern structure and extending into a second region; a memory vertical structure penetrating the stack structure in the first region; gate contact plugs electrically connected to the gate layers in the second region; and a first peripheral contact plug spaced apart from the gate layers, the gate layers including a first gate layer, the gate contact plugs including a first gate contact plug electrically connected to the first gate layer, side surfaces of the first gate contact plug and the first peripheral contact plug having different numbers of upper bending portions, and the number of upper bending portions of the side surface of the first gate contact plug being greater than the number of upper bending portions of the side surface of the first peripheral contact plug.

Abstract: A URL processing method includes a response data determining step in which a URL processing apparatus determines whether to exclude one or more URLs included in a first web page from a valid URL list using header information for the first web page of a first web site and a similarity based valid URL calculating step of estimating a similarity between web pages corresponding to respective URLs according to a predetermined criterion with respect to one or more URLs included in the first web page and selecting some of URLs of a similar web page calculated according to the similarity and adding the selected URLs in the valid URL list.

Abstract: Provided is a semiconductor package including a semiconductor stack including a first lower chip, a second lower chip, a gap filler disposed between the first lower chip and the second lower chip, and a first upper chip disposed on an upper surface of the first lower chip, an upper surface of the second lower chip, and an upper surface of the gap filler, the first lower chip includes first upper surface pads and a first upper surface dielectric layer, the second lower chip includes second upper surface pads and a second upper surface dielectric layer, the first upper chip includes lower surface pads and a lower surface dielectric layer, and an area of an upper surface of each of the second upper surface pads is greater than an area of a lower surface of each of the lower surface pads.

Abstract: A method for transmitting data for a three-dimensional image is provided. The method comprises the steps of: generating a plurality of voxelized points corresponding to a plurality of voxels, respectively, from a plurality of points constituting a three-dimensional image; grouping the plurality of voxelized points into a plurality of segments, wherein each of the plurality of segments includes at least one of the plurality of voxelized points; for each segment, projecting the plurality of points and generating a plurality of two-dimensional images; generating a packed two-dimensional image from the generated plurality of two-dimensional images; decoding data for the packed two-dimensional image, and encapsulating same; and transmitting the decoded and encapsulated data.

Abstract: Disclosed according to various embodiments is an electronic device comprising: a first communication circuit configured to provide first wireless communication within a first frequency range; a second communication circuit configured to provide second wireless communication within a second frequency range; a processor operably connected to the first communication circuit and the second communication circuit; and a memory operably connected to the processor, wherein the memory has instructions stored therein which cause, when executed, the processor to: establish a channel for communication with a first base station, by using the first communication circuit; receive, from the first base station, a first message containing information about at least one frequency at which to assess a communication status by using the second communication circuit; assess statuses for communication with one or more second base stations, by using the second communication circuit on the basis of the first message; transmit a second

Abstract: According to certain embodiments, an electronic device comprises at least one processor; and a memory operatively connected with the at least one processor and storing a plurality of identifiers related to attributes of a communication bearer.

Abstract: A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.

Abstract: Devices and techniques are generally described for using user feedback to determine routing decisions in a speech processing system. In various examples, first data representing a first utterance may be received. Second data representing a first semantic interpretation of the first utterance may be determined. A first intent data processing application may be selected for processing the second data. Feedback data may be determined related to the first intent data processing application processing the second data. Third data representing a semantic interpretation of a second utterance may be received, wherein the first semantic interpretation is the same as the second semantic interpretation. A second intent data processing application may be determined for processing the third data based at least in part on the feedback data.

Abstract: According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.

Abstract: A light-emitting device is provided. The light-emitting device includes: a plurality of first electrodes positioned on a first sub-pixel, a second sub-pixel, and a third sub-pixel, respectively; a second electrode facing the plurality of first electrodes; a first emission layer on the first sub-pixel to emit a first color light; a second emission layer on the second sub-pixel to emit a second color light; a first layer integrated with the first sub-pixel, the second sub-pixel, and the third sub-pixel; a first auxiliary layer between the first layer and the first emission layer; and a first interlayer between the first auxiliary layer and the first emission layer. The absolute value of the highest occupied molecular orbital (HOMO) energy level of the first interlayer is greater than the absolute value of the HOMO energy level of the first auxiliary layer, and is smaller than the absolute value of the HOMO energy level of the first emission layer.

Abstract: Provided is a method of processing and transmitting three-dimensional data represented as a point cloud. The method of encoding three-dimensional (3D) data includes: generating a geometry image indicating position information of points, a texture image indicating color information of the points, and an occupancy map indicating occupancy information of the position information of the points in the geometry image, by projecting the points included in the 3D data onto a two-dimensional (2D) plane; generating a filtered occupancy map by performing filtering on the occupancy map; performing image padding on the geometry image and the texture image, based on the filtered occupancy map; and generating and outputting a bitstream including a padded geometry image, a padded texture image, a downsampled occupancy map, and information about the filtering performed on the occupancy map.

Abstract: Provided is a three-dimensional (3D) data processing method for effectively removing noise occurring in a procedure of compressing and restoring 3D data. A 3D data compressing method according to an embodiment may include: generating a geometry image indicating position information of points, by projecting the points onto a two-dimensional (2D) plane, the points being included in 3D original data; compressing the geometry image; generating 3D reconstructed data by decompressing and reconstructing the compressed geometry image; compensating the 3D reconstructed data, based on the 3D original data; generating and compressing a texture image, based on the compensated 3D reconstructed data and color information of the points included in the 3D original data; and outputting the compressed geometry image, the compressed texture image, and compensation information related to the compensating of the 3D reconstructed data.

Abstract: A semiconductor package includes a first semiconductor chip having a through-electrode and an upper connection pad on an upper surface of the first semiconductor chip that is connected to the through-electrode; a second semiconductor chip stacked on the first semiconductor chip, and having a lower connection pad on a lower surface of the second semiconductor chip; a non- conductive film between the first semiconductor chip and the second semiconductor chip, with the non-conductive film including voids having an average diameter of 1?m to 100 um, the voids having a volume fraction of 0.1 to 5 vol %; and a connection conductor that penetrates the non- conductive film and connects the upper connection pad and the lower connection pad.

Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.