Patents by Inventor Jihwan An

Jihwan An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11825742
    Abstract: An organic light-emitting device and a heterocyclic compound, the device including a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode and including an emission layer, wherein the emission layer includes a compound represented by Formula 1A or a compound represented by Formula 1B:
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 21, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jimyoung Ye, Myeongsuk Kim, Byeongwook Yoo, Soobyung Ko, Jihwan Yoon, Jaehoon Hwang
  • Patent number: 11817861
    Abstract: A receiver includes a differential signal generator receiving a single-ended signal, and generating differential signals having a positive signal and a negative signal based on the single-ended signal, a reference signal, and a pair of compensation signals, a pair of charging circuits charging first and second nodes to a power level in a logic low period of a clock signal, a pair of discharging circuits discharging the first and second nodes according to a level of the positive signal and a level of the negative signal, respectively, in a logic high period of the clock signal, a comparator comparing signal levels of the first and second nodes and outputting an offset detection signal of the differential signals, and an offset compensator outputting the reference signal and the pair of compensation signals, each adjusted based on the offset detection signal, to the differential signal generator.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: November 14, 2023
    Assignees: SAMSUNG ELECTRONICS CO., LTD., NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Jueon Kim, Taehyoung Kim, Seungjin Park, Jihwan Hyun, Myoungbo Kwak, Junghwan Choi
  • Publication number: 20230357495
    Abstract: The present disclosure relates to a monomer composition for synthesizing recycled plastic which is extremely reduced in the content of organic impurities such as formic acid and acetic acid while recovering from a (co)polymer synthesized from monomers containing terephthalic acid, a method for preparing the same, and a recycled plastic, molded product, and plasticizer composition using the same.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 9, 2023
    Inventors: Jeongnam KIM, Tae Seung PARK, Jihwan HWANG, Kang Geun LEE, Byoung Hyoun KIM, Mooho HONG
  • Publication number: 20230354635
    Abstract: A light-emitting device and an apparatus including the same include a first electrode, a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer includes m emission units and (m?1) charge generating units, each of the charge generating units being between the emission units that are adjacent to each other, m is a natural number of 2 or greater, at least one of the (m?1) charge generating units includes an n-type charge generating layer, a p-type charge generating layer, and a p-type hole injection layer, wherein the n-type charge generating layer includes an n-type organic compound and a metal material, and wherein the p-type charge generating layer and the p-type hole injection layer each independently include an inorganic semiconductor material.
    Type: Application
    Filed: July 5, 2023
    Publication date: November 2, 2023
    Inventors: Dongchan Kim, Jiyoung Moon, Heechang Yoon, Jihye Lee, Hakchoong Lee, Haemyeong Lee, Myungsuk Han, Jihwan Yoon, Jonghyuk Lee, Yoonhyeung Cho
  • Publication number: 20230353496
    Abstract: Disclosed is a user plane function (UPF) packet processing control apparatus including: a processor, and a memory storing instructions, wherein the processor is configured to execute the instructions to analyze a state in which UPF packets are processed by a plurality of packet processing pipelines, determine a size of a packet vector for each of the plurality of packet processing pipelines based on a result of the analyzing, and allocate a number of processing cores to each of the plurality of packet processing pipelines based on the result of the analyzing.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 2, 2023
    Inventors: Jihwan SEO, Seonjun PARK, Beomseok OH, Sewon OH
  • Publication number: 20230344140
    Abstract: An electronic device is provided. The electronic device includes a housing including a front surface plate, a rear surface plate, and a side surface portion providing a side surface, a first support positioned between the front surface plate and the rear surface plate and connected to the side surface portion, a display, a wireless communication circuit configured to transmit or receive a signal through an antenna radiator, camera circuitry positioned between the first support and the rear surface plate, and a conductive pattern positioned between the first support and the rear surface plate and at least partially overlapping with the camera circuitry when viewed from a top of the rear surface plate, and electrically connected to a ground of the electronic device, some electromagnetic waves, which travel toward the camera circuitry, among electromagnetic waves radiating from the antenna radiator, flow to the ground through the conductive pattern.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 26, 2023
    Inventors: Eunbae KWON, Changrim YU, Jongmin KIM, Joseph KANG, Kwonsik MIN, Jihwan OH, Kyonghwan CHO
  • Patent number: 11799143
    Abstract: A battery pack including at least one battery cell including a first surface and a second surface forming opposite ends along a height direction thereof, and an outer circumferential surface connecting the first surface and the second surface; and a flexible circuit board configured to obtain state information of the at least one battery cell, the flexible circuit board including a corrugated main body at least partially surrounding the outer circumferential surface of the at least one battery cell, and branch portions extending from the main body onto the first surface or the second surface of the at least one battery cell.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventor: Jihwan Seol
  • Patent number: 11791308
    Abstract: A semiconductor package includes a base chip and at least one semiconductor chip disposed on the base chip. An adhesive film is disposed between the base chip and the at least one semiconductor chip and is configured to fix the at least one semiconductor chip on the base chip. The adhesive film includes an inner film portion that overlaps the at least one semiconductor chip in a thickness direction of the base chip, and an outer film portion that does not overlap the at least one semiconductor chip in the thickness direction of the base chip. A width of the outer film portion in a direction perpendicular to a lateral edge of the at least one semiconductor chip is substantially uniform within a deviation range of 20% of an average width of the outer film portion.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jihwan Hwang, Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee
  • Patent number: 11791262
    Abstract: A semiconductor device includes a pattern structure; a stack structure including gate layers stacked in a first region on the pattern structure and extending into a second region; a memory vertical structure penetrating the stack structure in the first region; gate contact plugs electrically connected to the gate layers in the second region; and a first peripheral contact plug spaced apart from the gate layers, the gate layers including a first gate layer, the gate contact plugs including a first gate contact plug electrically connected to the first gate layer, side surfaces of the first gate contact plug and the first peripheral contact plug having different numbers of upper bending portions, and the number of upper bending portions of the side surface of the first gate contact plug being greater than the number of upper bending portions of the side surface of the first peripheral contact plug.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungyoon Kim, Jeongyong Sung, Sanghun Chun, Jihwan Kim, Sunghee Chung, Jeehoon Han
  • Publication number: 20230329047
    Abstract: A thin film transistor substrate can include a first thin film transistor on a substrate, the first thin film transistor including a first active layer and a first gate electrode; and a second thin film transistor on the substrate, the second thin film transistor including a second active layer and a second gate electrode, each of the second active layer and the second gate electrode being located farther away from the substrate than the first active layer and the first gate electrode. Also, the thin film transistor substrate can include a first insulating layer disposed between the first gate electrode and the second active layer; and a first connection electrode connecting the first gate electrode with the second active layer, in which the first connection electrode extends through a first contact hole in the first insulating layer and contacts both of the first gate electrode and the second active layer.
    Type: Application
    Filed: April 10, 2023
    Publication date: October 12, 2023
    Applicant: LG Display Co., Ltd.
    Inventors: YounGyoung CHANG, WonSang RYU, Youngjin YI, Hanseok LEE, SungSoo SHIN, Jungyul YANG, JungJune KIM, Jihwan JUNG, Soyang CHOI, Yubeen LIM
  • Publication number: 20230327350
    Abstract: In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first side. The assembly also includes a plurality of semiconductor die disposed on the first side of the substrate and at least one signal pin. The at least one signal pin includes a proximal end portion coupled with the first side of the substrate, a distal end portion, and a medial portion disposed between the proximal end portion and the distal end portion. The medial portion is pre-molded in a molding compound, the proximal end portion and the distal end portion exclude the molding compound. The at least one signal pin is arranged along a longitudinal axis that is orthogonal to the plane of the substrate.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 12, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Seungwon IM, Oseob JEON, Dongwook KANG, Youngsun KO, Jeungdae KIM, Changsun YUN, Jihwan KIM
  • Publication number: 20230326447
    Abstract: An example electronic device and an example control method thereof are provided.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 12, 2023
    Inventors: Jihwan LEE, Jounyeop LEE, Heejin CHOI, Seongkyu MUN
  • Patent number: 11783617
    Abstract: Disclosed are a pixel circuit comprising an optical fingerprint sensing circuit, a method of driving a pixel circuit comprising an optical fingerprint sensing circuit, and a display device comprising a pixel circuit comprising an optical fingerprint sensing circuit. According to the present disclosure, the pixel circuit comprising an optical fingerprint sensing circuit comprises a pixel control circuit, the pixel control circuit comprising: a first photodetector which receives a light and generates a first signal; a second photodetector which receives a light and generates a second signal; and a self-illuminator which receives differential signals of the first signal and second signal and outputs an output signal, includes at least one transistor component and at least one capacitor component, and outputs a light on the basis of a data signal.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 10, 2023
    Assignees: LG Display Co., Ltd., Industry-University Cooperation Foundation Hanyang University
    Inventors: Byong Deok Choi, Yong Sang Yoo, Yong Duck Kim, Jeongmin Moon, Soonshin Jung, Moonbong Song, Kiseok Chang, Jihwan Jung
  • Publication number: 20230318551
    Abstract: An adaptive continuous-time linear equalizer (CTLE) includes a CTLE cell including input terminals and output terminals, a low-pass filter configured to respectively output low-band differential signals obtained by respectively low-pass filtering differential output signals, and an error amplifier configured to amplify a difference between the low-band differential signals and output the difference as a control voltage. The CTLE cell includes first and second transistors each including an input terminal and an output terminal and an offset compensator configured to adjust a potential difference between a supply voltage source and the output terminal according to the control voltage.
    Type: Application
    Filed: November 25, 2022
    Publication date: October 5, 2023
    Applicant: UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION
    Inventors: SOOHWAN YOO, YOHAN KIM, HYEONWOO AHN, JAEGEOL LEE, YONGSAM MOON, JIHWAN HYUN, JUNGHWAN CHOI
  • Publication number: 20230305111
    Abstract: Embodiments of systems and methods for estimating direction of arrival are disclosed. A device includes a signal processing unit that includes processing circuitry and memory coupled to the processing circuitry, where the processing circuitry includes multiple vector processing units, each vector processing unit configured to receive an antenna input vector, receive an angular spectrum vector, retrieve a first and second weighting vectors from the memory, generate a processed antenna input vector by performing a circular convolution of the antenna input vector with the first weighting vector, generate a processed angular spectrum vector by performing a circular convolution of the angular spectrum vector with the second weighting vector, and generate a refined angular spectrum vector, which indicates angular position of one or more radar targets, by applying a non-linear activation function to a sum of the processed antenna input vector and the processed angular spectrum vector.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 28, 2023
    Inventors: Jihwan Youn, Satish Ravindran, Ruud van Sloun, Ryan Haoyun Wu, Jun Li
  • Patent number: 11769450
    Abstract: The present disclosure relates to a pixel circuit including an optical fingerprint sensing circuit, a method for driving a pixel circuit including the optical fingerprint sensing circuit, and a display device including the pixel circuit including the optical fingerprint sensing circuit. The pixel circuit includes: a self-light emitting element which displays images by a driving current controlled by a driving transistor; and a light-receiving element which receives light emitted from the self-light emitting element and reflected through a fingerprint of a user and converts it into a photocurrent. The driving transistor functions as a buffer which transmits an output voltage of the light-receiving element to an output line of the pixel circuit.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: September 26, 2023
    Assignees: LG Display Co., Ltd., Industry-University Cooperation Foundation Hanyang University
    Inventors: Byong Deok Choi, Yong Sang Yoo, Yong Duck Kim, Jeongmin Moon, Soonshin Jung, Moonbong Song, Jihwan Jung, Kiseok Chang
  • Patent number: 11764192
    Abstract: A semiconductor package and a method of forming the same are provided. The semiconductor package includes one or a plurality of chips on a substrate, bumps disposed below each of the one or plurality of chips, an underfill material layer on the substrate, on a side surface of each of the bumps, and extending to side surfaces of the one or plurality of chips, and a mold layer on the substrate and contacting the underfill material layer. The underfill material layer includes a first side portion, a second side portion on the first side portion and having a slope, steeper than a slope of the first side portion, and a third side portion on the second side portion and having a slope that is less steep than a slope of the second side portion.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: September 19, 2023
    Inventors: Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee, Jiseok Hong
  • Publication number: 20230288706
    Abstract: A diffractive waveguide device includes an optical waveguide and a diffractive element optically coupled to the optical waveguide. The diffractive element is configured to alter a polarization and propagation direction of light of a first polarization, and is configured to transmit light of a second polarization without substantially altering a polarization or propagation direction thereof. A polarizing film assembly is configured to provide the light of the second polarization to the optical waveguide, and/or is configured to block the light of the second polarization from the optical waveguide. The polarizing film assembly includes a polarizer and an optical retarder that is positioned between the polarizer and the optical waveguide. Related devices and methods of operation are also discussed.
    Type: Application
    Filed: June 22, 2021
    Publication date: September 14, 2023
    Inventors: Steven John Robbins, Michael James Escuti, Jihwan Kim
  • Publication number: 20230274783
    Abstract: A nonvolatile memory device includes a memory cell array in a first semiconductor layer and including a first memory cell connected to a first word line and a first bit line and a second memory cell connected to the first word line and a second bit line; a page buffer circuit in a second semiconductor layer and including a first page buffer connected to the first bit line, and a second page buffer connected to the second bit line; and a page buffer controller in the second semiconductor layer. The page buffer controller controls the first and second page buffers so that a develop timing of a first sensing node of the first page buffer is different from a develop timing of a second sensing node of the second page buffer. The first page buffer is closer to a through electrode region than the second page buffer.
    Type: Application
    Filed: May 5, 2023
    Publication date: August 31, 2023
    Inventors: Myeongwoo Lee, Chaehoon Kim, Jihwan Kim, Jungho Song
  • Patent number: 11744100
    Abstract: A light-emitting device and an apparatus including the same include a first electrode, a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer includes m emission units and (m?1) charge generating units, each of the charge generating units being between the emission units that are adjacent to each other, m is a natural number of 2 or greater, at least one of the (m?1) charge generating units includes an n-type charge generating layer, a p-type charge generating layer, and a p-type hole injection layer, wherein the n-type charge generating layer includes an n-type organic compound and a metal material, and wherein the p-type charge generating layer and the p-type hole injection layer each independently include an inorganic semiconductor material.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: August 29, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dongchan Kim, Jiyoung Moon, Heechang Yoon, Jihye Lee, Hakchoong Lee, Haemyeong Lee, Myungsuk Han, Jihwan Yoon, Jonghyuk Lee, Yoonhyeung Cho