Abstract: A motor-driven steering column device for a vehicle, the motor-driven steering column device may include a housing fixed to a vehicle body and having a pipe through one side portion of which a slot is formed; a telescopic pipe inserted into an internal diameter portion of the housing to be movable back and forth and locked and fastened to a steering shaft; a telescopic bracket disposed on an internal diameter portion of the telescopic pipe; and a driving device coupling the telescopic pipe and the telescopic bracket through the slot and providing power of moving back and forth to the telescopic pipe and the telescopic bracket.

Abstract: A method for deploying an external air bag, including searching region of a front of vehicle, updating a physical amount of a searched object within the searching region each measurement period of a front sensor, determining a predicted physical amount each unit time during each measurement period, and predicting the physical amount by assuming that a specific searched object is moved at a constant speed when a capture of the specific searched object which was searched by the front sensor is stopped, selecting a target object among searched objects based on a relative speed or an overlap of the searched object obtained by the updating step or (Time To External Airbag) TTE and deploying the external air bag in a case in which each of a relative speed and an overlap predicted when the target object collides are a predetermined level or more.

Abstract: A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

Abstract: Disclosed herein is an external airbag deployment method. The method includes setting, by a controller, a detection area located in front. In addition, the method includes setting, by the controller, a target object from objects detected in the detection area, when an object has a relative velocity greater than a first reference, an overlap greater than a second reference, and a TTE less than a third reference, wherein TTE is a remaining time until the object collides with an airbag cushion when the external airbag is predicted to be deployed. Furthermore, the method includes determining, by the controller, whether a relative velocity and an overlap, predicted at a time when the target object is predicted to collide with the vehicle, are greater than predetermined levels and deploying the external airbag when the predicted relative velocity and overlap are greater than the predetermined levels.

Abstract: A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors.

Abstract: A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors.

Abstract: A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors.

Abstract: A method for deploying an external air bag, including searching region of a front of vehicle, updating a physical amount of a searched object within the searching region each measurement period of a front sensor, determining a predicted physical amount each unit time during each measurement period, and predicting the physical amount by assuming that a specific searched object is moved at a constant speed when a capture of the specific searched object which was searched by the front sensor is stopped, selecting a target object among searched objects based on a relative speed or an overlap of the searched object obtained by the updating step or (Time To External Airbag) TTE and deploying the external air bag in a case in which each of a relative speed and an overlap predicted when the target object collides are a predetermined level or more.

Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.

Abstract: A steering system of an automobile may include a mounting bracket having a flange portion supporting a steering column and contacting with an automobile body, and an opening hole formed at the flange portion and opening toward one side of the flange portion, a capsule slidably coupled to the opening hole and adapted to be decoupled from the opening hole when an impact is given thereto, and at least one molded supporter fixing the capsule and the flange portion and adapted to be sheared off from the capsule or the flange portion when the impact is given thereto.

Abstract: In an external airbag deployment method, a detection area located in front of a vehicle is set. A target object is selected from among objects detected in the detection area by comparing relative velocities, overlaps, and Time To External Airbag (TTE) values of the detected objects. It is determined whether the vehicle is stable or unstable by comparing a predicted yaw rate of the vehicle with a measured yaw rate. It is determined whether a relative velocity and an overlap of the target object, predicted at a time when the target object is assumed to collide with the vehicle, are greater than predetermined levels. The external airbag is deployed if it is determined that the vehicle is stable and the predicted relative velocity and overlap of the target object are greater than predetermined levels.

Abstract: Disclosed herein is an external airbag deployment method of determining whether to deploy an external airbag. The method includes setting, by a controller, a detection area that has a predetermined range and tracking physical characteristics of objects entering the detection area. The detection area is a predetermined area located in front of a vehicle and is set by the controller based on a full deployment time of the external airbag and a relative velocity upon colliding with another object.

Abstract: In an external airbag deployment method, a detection area located in front of a vehicle is set. A target object is selected from among objects detected in the detection area by comparing relative velocities, overlaps, and Time To External Airbag (TTE) values of the detected objects. It is determined whether the vehicle is stable or unstable by comparing a predicted yaw rate of the vehicle with a measured yaw rate. It is determined whether a relative velocity and an overlap of the target object, predicted at a time when the target object is assumed to collide with the vehicle, are greater than predetermined levels. The external airbag is deployed if it is determined that the vehicle is stable and the predicted relative velocity and overlap of the target object are greater than predetermined levels.

Abstract: A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

Abstract: A horn switch device for a steering wheel may include an airbag module mounted in an inner region of the steering wheel to perform pressing and restoring operations while being elastically supported by a plurality of horn springs, a link plate assembly mounted on a lower surface of the airbag module and including a plurality of link plates to facilitate a seesaw movement, a module-side horn contact point positioned at the fixed end portion of each link plate and toward the outside of the airbag module, and a wheel-side horn contact point positioned below the module-side horn contact point. A horn operation is produced when the wheel-side horn contact point contacts with the module-side horn contact point.

Abstract: Disclosed is an external airbag apparatus. The apparatus includes, a back beam disposed on one surface directed toward a bumper on which an airbag module is disposed. The apparatus additionally includes a deployment guide disposed between the bumper and the back beam, both ends of which are coupled to the back beam, and a middle end of which is supported on the bumper. Furthermore, the apparatus includes a sensor disposed between the deployment guide and the back beam to sense impact when pressed by the deployment guide during impact to the bumper.

Abstract: A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors.

Abstract: A horn switch device for a steering wheel may include an airbag module mounted in an inner region of the steering wheel to perform pressing and restoring operations while being elastically supported by a plurality of horn springs, a link plate assembly mounted on a lower surface of the airbag module and including a plurality of link plates to facilitate a seesaw movement, a module-side horn contact point positioned at the fixed end portion of each link plate and toward the outside of the airbag module, and a wheel-side horn contact point positioned below the module-side horn contact point. A horn operation is produced when the wheel-side horn contact point contacts with the module-side horn contact point.

Abstract: A steering system of an automobile may include a mounting bracket having a flange portion supporting a steering column and contacting with an automobile body, and an opening hole formed at the flange portion and opening toward one side of the flange portion, a capsule slidably coupled to the opening hole and adapted to be decoupled from the opening hole when an impact is given thereto, and at least one molded supporter fixing the capsule and the flange portion and adapted to be sheared off from the capsule or the flange portion when the impact is given thereto.

Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.