Abstract: A semiconductor package includes a semiconductor chip having a first surface, on which an electrode pad is arranged, and a second surface which is the other side of the semiconductor chip, an insulation member formed on the second surface of the semiconductor chip, and comprising a via hole at a position spaced apart from the semiconductor chip, and a conductive filler filling the via hole.

Abstract: Disclosed herein is an external airbag deployment method. The method includes setting, by a controller, a detection area located in front. In addition, the method includes setting, by the controller, a target object from objects detected in the detection area, when an object has a relative velocity greater than a first reference, an overlap greater than a second reference, and a TTE less than a third reference, wherein TTE is a remaining time until the object collides with an airbag cushion when the external airbag is predicted to be deployed. Furthermore, the method includes determining, by the controller, whether a relative velocity and an overlap, predicted at a time when the target object is predicted to collide with the vehicle, are greater than predetermined levels and deploying the external airbag when the predicted relative velocity and overlap are greater than the predetermined levels.

Abstract: A module substrate may include a substrate body on which a plurality of chip mounting regions having connection pads are defined. Repair structures may be respectively formed, or placed, in the chip mounting regions. Each repair structure includes conductive layer patterns formed over the connection pads in each chip mounting region, an insulation layer pattern formed over the substrate body in each chip mounting region in such a way as to expose the conductive layer patterns, plastic conductive members formed between the connection pads and the conductive layer patterns, and a plastic insulation member formed between the substrate body and the insulation layer pattern in each chip mounting region.

Abstract: A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.

Abstract: A stack package includes a core layer having a first surface and a second surface, and including first circuit wiring lines; a first semiconductor device disposed on the second surface of the core layer; a first resin layer formed on the second surface of the core layer to cover the first semiconductor device; second circuit wiring lines formed on the first resin layer and electrically connected with the first semiconductor device; a second semiconductor device disposed over the first resin layer including the second circuit wiring lines and electrically connected with the second circuit wiring lines; a second resin layer formed on the second circuit wiring lines and the first resin layer to cover the second semiconductor device; and a plurality of via patterns formed to pass through the first resin layer and the core layer and electrically connecting the first circuit wiring lines and the second circuit wiring lines.

Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.

Abstract: An external airbag cushion including: an outer cover that inflates to cover the front of a bumper of a vehicle; a plurality of separation walls that are disposed inside outer cover to divide the inside into a plurality of chambers in the transverse direction of the vehicle; and low-pressure variable vents and high-pressure variable vents that are disposed for the chambers, respectively, and selectively open, depending on the internal pressure of the chambers.

Abstract: Disclosed herein is an external airbag deployment method of determining whether to deploy an external airbag. The method includes setting, by a controller, a detection area that has a predetermined range and tracking physical characteristics of objects entering the detection area. The detection area is a predetermined area located in front of a vehicle and is set by the controller based on a full deployment time of the external airbag and a relative velocity upon colliding with another object.

Abstract: Disclosed herein is an external airbag deployment method. The method includes setting, by a controller, a detection area located in front. In addition, the method includes setting, by the controller, a target object from objects detected in the detection area, when an object has a relative velocity greater than a first reference, an overlap greater than a second reference, and a TTE less than a third reference, wherein TTE is a remaining time until the object collides with an airbag cushion when the external airbag is predicted to be deployed. Furthermore, the method includes determining, by the controller, whether a relative velocity and an overlap, predicted at a time when the target object is predicted to collide with the vehicle, are greater than predetermined levels and deploying the external airbag when the predicted relative velocity and overlap are greater than the predetermined levels.

Abstract: Disclosed herein is an external airbag deployment method and system. In the method, a detection area located in front of a vehicle is set. A target object is selected from a plurality of objects detected in the detection area by comparing a relative velocity, an overlap, and a TTE, which is a remaining time until each object collides with an airbag cushion when an external airbag is predicted to be deployed. The method further includes determining whether the vehicle is stable by comparing a predicted yaw rate of the vehicle with a measured yaw rate and determining whether a relative velocity and an overlap, predicted at a time when the target object is predicted to collide with the vehicle, are greater than predetermined levels. The external airbag is deployed when the vehicle is stable, and the predicted relative velocity and overlap are greater than the predetermined levels.

Abstract: Disclosed herein is an external airbag deployment system and method. The method includes determining, by a controller, whether to deploy an external airbag. The controller may be configured to set a detection area having a predetermined range and track physical characteristics of objects entering the detection area to update the physical characteristics at intervals of a measurement period of a front sensor. In addition, the controller may be configured to calculate predicted physical characteristics at intervals of a unit time during each measurement period. Based on the calculated physical characteristics, the controller may be configured to determine whether to deploy the external airbag at intervals of the unit time.

Abstract: Disclosed is an external airbag apparatus. The apparatus includes, a back beam disposed on one surface directed toward a bumper on which an airbag module is disposed. The apparatus additionally includes a deployment guide disposed between the bumper and the back beam, both ends of which are coupled to the back beam, and a middle end of which is supported on the bumper. Furthermore, the apparatus includes a sensor disposed between the deployment guide and the back beam to sense impact when pressed by the deployment guide during impact to the bumper.

Abstract: Disclosed herein is an external airbag deployment system and method of determining whether to deploy an external airbag. The method includes setting, by a controller, a detection area that has a predetermined range and selecting an object that has a shortest Time To External Airbag (EAB) (TTE), from objects detected in the detection area, as a dangerous object, the TTE being a remaining time until the object collides with an airbag cushion when the external airbag is predicted to be deployed. When the dangerous object has a relative velocity greater than a first reference, an overlap greater than a second reference, and a TTE less than a third reference, the dangerous object may be selected as a target object, to cause the external airbag to be deployed.

Abstract: An exterior airbag cushion for a vehicle includes a cushion body which is deployed forward from a front end of the vehicle, a vent hole which is formed in the cushion body, and a variable guide which has a cover shape and covers the vent hole in such a way that a first end and opposing side edges of the variable guide are fastened to the cushion body, and a second end thereof is open to form an opening. The variable guide is folded and is brought into close contact with the cushion body and temporarily fastened to the cushion body so that the variable guide guides a direction of gas discharged from the vent hole and the opening when a temporary fastening structure is loosened by internal pressure of the cushion body.

Abstract: An external airbag cushion including: an outer cover that inflates to cover the front of a bumper of a vehicle; a plurality of separation walls that are disposed inside outer cover to divide the inside into a plurality of chambers in the transverse direction of the vehicle; and low-pressure variable vents and high-pressure variable vents that are disposed for the chambers, respectively, and selectively open, depending on the internal pressure of the chambers.

Abstract: A semiconductor device includes a semiconductor substrate having an upper surface, a lower surface, a first side and a second side, wherein the lower surface has a slope so that the first side is thicker than the second side, and a circuit pattern including a bonding pad on the upper surface of the semiconductor substrate.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract: A semiconductor device includes a semiconductor substrate having an upper surface, a lower surface, a first side and a second side, wherein the lower surface has a slope so that the first side is thicker than the second side, and a circuit pattern including a bonding pad on the upper surface of the semiconductor substrate.

Abstract: A semiconductor package includes a semiconductor chip having a first region defined at a center portion of a first surface of the semiconductor chip, and having second and third regions defined on both sides of the first region, respectively. Bonding pads are disposed in the first region and a substrate having a substrate body is disposed in the second region of the semiconductor chip. The substrate includes an extension portion projecting away from the semiconductor chip. The substrate also includes circuit patterns disposed on the substrate body having a first ends placed adjacent to the bonding pads and second ends placed on the extension portion. Connection members electrically connect the first ends of the circuit patterns and the bonding pads.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.