Abstract: A bump includes a metal pillar formed over a structural body; and a diffusion barrier member formed to cover at least a portion of a side surface of the metal pillar.

Abstract: A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.

Abstract: A semiconductor package may include a substrate with a first surface over which bond fingers are formed. At least two semiconductor chips may be stacked on the first surface of the substrate and each chip may have via holes. The semiconductor chips may be stacked such that the respective via holes expose the respective bond fingers of the substrate. Through electrodes may be formed in the via holes. The through electrodes may comprise carbon nanotubes grown from the exposed bond fingers of the substrate, where the through electrodes may be electrically connected with the semiconductor chips.

Abstract: A semiconductor package includes a semiconductor chip having a first surface, on which an electrode pad is arranged, and a second surface which is the other side of the semiconductor chip, an insulation member formed on the second surface of the semiconductor chip, and comprising a via hole at a position spaced apart from the semiconductor chip, and a conductive filler filling the via hole.

Abstract: A semiconductor device includes a semiconductor substrate having an upper surface, a lower surface, a first side and a second side, wherein the lower surface has a slope so that the first side is thicker than the second side, and a circuit pattern including a bonding pad on the upper surface of the semiconductor substrate.

Abstract: A stack package includes a core layer having a first surface and a second surface, and including first circuit wiring lines; a first semiconductor device disposed on the second surface of the core layer; a first resin layer formed on the second surface of the core layer to cover the first semiconductor device; second circuit wiring lines formed on the first resin layer and electrically connected with the first semiconductor device; a second semiconductor device disposed over the first resin layer including the second circuit wiring lines and electrically connected with the second circuit wiring lines; a second resin layer formed on the second circuit wiring lines and the first resin layer to cover the second semiconductor device; and a plurality of via patterns formed to pass through the first resin layer and the core layer and electrically connecting the first circuit wiring lines and the second circuit wiring lines.

Abstract: A module substrate may include a substrate body on which a plurality of chip mounting regions having connection pads are defined. Repair structures may be respectively formed, or placed, in the chip mounting regions. Each repair structure includes conductive layer patterns formed over the connection pads in each chip mounting region, an insulation layer pattern formed over the substrate body in each chip mounting region in such a way as to expose the conductive layer patterns, plastic conductive members formed between the connection pads and the conductive layer patterns, and a plastic insulation member formed between the substrate body and the insulation layer pattern in each chip mounting region.

Abstract: The present invention provides an automatic control device of foldable tent connecting to several roof strut sets wherein, said control device is of a central standing base containing a sliding hub, a spring and a tappet roller at inside. Cooperating to an extra force exerting on the central standing base to press it down relative to the roof strut sets, the sliding hub brings the tappet roller continuously to go down and up, by means of the special design between the spring and all the pushing lugs and hook slots of the tappet roller, positioning the sliding hub with the locking pin of the central standing base can be carried out, so that the tent can be opened and kept in open configuration automatically; when repeatedly press down the central standing base relative to the roof strut sets, the tent can be closed.

Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.

Abstract: A semiconductor package includes a semiconductor chip having a first region defined at a center portion of a first surface of the semiconductor chip, and having second and third regions defined on both sides of the first region, respectively. Bonding pads are disposed in the first region and a substrate having a substrate body is disposed in the second region of the semiconductor chip. The substrate includes an extension portion projecting away from the semiconductor chip. The substrate also includes circuit patterns disposed on the substrate body having a first ends placed adjacent to the bonding pads and second ends placed on the extension portion. Connection members electrically connect the first ends of the circuit patterns and the bonding pads.

Abstract: The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.

Abstract: The present invention provides an automatic control device of foldable tent connecting to several roof strut sets consisting of several segments serially connected in radial; wherein, said control device is typically comprised of a central standing base containing a sliding hub, a spring and a tappet roller at inside; said tappet roller is fit in the inside of the sliding hub, and is touched against with one end of said spring axially, another end of said spring is touched against the top inside surface of said central standing base; said sliding hub is connected to connectors in radial respectively and pivotally; said connectors are respectively pivoted on the rim of said central standing base at the middle points, another ends of said connectors are individually connected to the roof strut sets; on the other hand, there are several locking pins built upon the inside of the central standing base for engaging with said tappet roller, coordinating to those said tappet roller has proper number of beveled surfac

Abstract: The present invention provides a bell folding tent typically comprised of awnings and framework consisted of poles, wherein the framework includes a top static rib-hub built upon the top end of a main stick setting on the center vertically, and hanged on with radial ribs, which is combined of several segments and connectors connecting said adjacent segments together, a low sliding rib-hub put on the main stick in sliding fitting for hanging up one ends of braces, the another ends of said braces pivoted on the first segments of the ribs respectively; an elastic piece is set upon the main stick between said low sliding rib-hub with the top end and the bottom end of the main stick with the low end.