Patents by Inventor Jin-won Lee

Jin-won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240231117
    Abstract: An optical disc unit for an ultraviolet sterilizer, which is applied to the ultraviolet sterilizer, includes an ultraviolet light emitting diode (LED) to reflect light irradiated from the ultraviolet LED, including a body portion including a hollow and a primary optical unit fixedly coupled to an internal diameter surface in the hollow of the body portion and disposed in a direction perpendicular to an emission surface of the ultraviolet LED to reflect light irradiated from the ultraviolet LED, and according to an exemplary embodiment of the present disclosure, it is possible to enhance a sterilization ability by increasing a beam angle of light irradiated from the ultraviolet LED and uniformly irradiating the light and also reduce a risk of light leakage to the outside in a space to which the ultraviolet LED is applied.
    Type: Application
    Filed: May 31, 2023
    Publication date: July 11, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, HATBIT ILLUCOM CO., LTD
    Inventors: Han-Joo JANG, Woo-Young CHOI, Jin-Won LEE, Sang-Ki LEE, Hyeon-Seok LEE, Hong-Sik CHANG, Kwan-Woo LEE, Tae-Yoon KIM, Young-Ho CHA, Jae-Gyun SA, Heon-Cheol KIM
  • Patent number: 12020849
    Abstract: A coil component includes a body, a support substrate disposed within the body, a lead portion disposed on a first surface of the support substrate, a first insulating layer disposed on the first surface of the support substrate to cover the lead portion, a coil unit including a plurality of turns disposed on the first insulating layer, a second insulating layer covering the coil unit, and first and second external electrodes spaced apart from each other on the body, and connected to the coil unit and the lead portion, respectively.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: June 25, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Nam Cho, Jae Youn Park, Jin Won Lee, Ji Soo You
  • Patent number: 11978403
    Abstract: A display device for performing a sensing operation according to an embodiment of the present inventive concept includes a pixel unit including pixel circuits each including a light emitting element, a driving transistor, a switching transistor, and a sensing control transistor connected between an anode electrode and an initialization power source; a scan driver connected to the pixel circuits through horizontal lines and sequentially outputting scan signals and sensing control signals; and a sensing unit configured to sense voltages or current of first nodes each disposed between an anode electrode and a driving transistor. The scan driver simultaneously outputs the sensing control signals to the horizontal lines at every predetermined discharge cycle.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: May 7, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ki Hyun Pyun, Jin Won Lee
  • Patent number: 11948559
    Abstract: Various embodiments include methods and devices for implementing automatic grammar augmentation for improving voice command recognition accuracy in systems with a small footprint acoustic model. Alternative expressions that may capture acoustic model decoding variations may be added to a grammar set. An acoustic model-specific statistical pronunciation dictionary may be derived by running the acoustic model through a large general speech dataset and constructing a command-specific candidate set containing potential grammar expressions. Greedy based and cross-entropy-method (CEM) based algorithms may be utilized to search the candidate set for augmentations with improved recognition accuracy.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 2, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yang Yang, Anusha Lalitha, Jin Won Lee, Christopher Lott
  • Publication number: 20240090121
    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung BYUN, Jung Soo KIM, Sang Hyun SIM, Chang Min HA, Tae Hong MIN, Jin Won LEE
  • Publication number: 20240071313
    Abstract: A display device for performing a sensing operation according to an embodiment of the present inventive concept includes a pixel unit including pixel circuits each including a light emitting element, a driving transistor, a switching transistor, and a sensing control transistor connected between an anode electrode and an initialization power source; a scan driver connected to the pixel circuits through horizontal lines and sequentially outputting scan signals and sensing control signals; and a sensing unit configured to sense voltages or current of first nodes each disposed between an anode electrode and a driving transistor. The scan driver simultaneously outputs the sensing control signals to the horizontal lines at every predetermined discharge cycle.
    Type: Application
    Filed: February 23, 2023
    Publication date: February 29, 2024
    Inventors: Ki Hyun PYUN, Jin Won LEE
  • Patent number: 11910604
    Abstract: Provided herein are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes an etch stop pattern having a top surface and a sidewall disposed over a gate stack having interlayer insulating layers alternately stacked with conductive patterns. The semiconductor device also includes a plurality of channel structures passing through the etch stop pattern and the gate stack. The semiconductor device further includes an insulating layer extending to cover the top surface and the sidewall of the etch stop pattern, wherein a depression is included in a sidewall of the insulating layer. The semiconductor device additionally includes a contact plug passing through the insulating layer so that the contact plug is coupled to a channel structure of the plurality of channel structures.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: February 20, 2024
    Assignee: SK hynix Inc.
    Inventor: Jin Won Lee
  • Publication number: 20240057254
    Abstract: A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.
    Type: Application
    Filed: January 20, 2023
    Publication date: February 15, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Youn Gyu Han, Jin Won Lee, Da Yeon Lee, Yong Duk Lee
  • Patent number: 11901359
    Abstract: A semiconductor device including a plurality of active regions extending in a first direction on a substrate; a device isolation layer between the plurality of active regions such that upper portions of the plurality of active regions protrude from the device isolation layer; a first gate electrode and a second gate electrode extending in a second direction crossing the first direction and intersecting the plurality of active regions, respectively, on the substrate, the first gate electrode being spaced apart from the second gate electrode in the second direction; a first gate separation layer between the first gate electrode and the second gate electrode; and a second gate separation layer under the first gate separation layer and between the first gate electrode and the second gate electrode, the second gate separation layer extending into the device isolation layer in a third direction crossing the first direction and the second direction.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seung Soo Hong, Jeong Yun Lee, Geum Jung Seong, Jin Won Lee, Hyun Ho Jung
  • Publication number: 20240019500
    Abstract: The present invention relates to a method for detecting a leakage current during use of a biometric data measuring device, and more particularly, a method is provided whereby it is possible to detect whether there is a leakage in a current applied to a sensor in a state of measuring biometric data while a part of the sensor is inserted into the user's skin, by comparing the difference in magnitude between an applied current applied via one terminal of the sensor, which is comprised in the biometric data measuring device, and an output current output via the other terminal of the sensor.
    Type: Application
    Filed: July 28, 2021
    Publication date: January 18, 2024
    Inventors: Young Jae KANG, Jung Uk HA, Jin Won LEE
  • Patent number: 11871568
    Abstract: A semiconductor device includes a source structure penetrated by a first penetrating portion, a first stack structure disposed on the source structure and penetrated by a second penetrating portion overlapping the first penetrating portion.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: January 9, 2024
    Assignee: SK hynix Inc.
    Inventors: Jin Won Lee, Nam Jae Lee
  • Patent number: 11871570
    Abstract: Provided herein are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes an etch stop pattern having a top surface and a sidewall disposed over a gate stack having interlayer insulating layers alternately stacked with conductive patterns. The semiconductor device also includes a plurality of channel structures passing through the etch stop pattern and the gate stack. The semiconductor device further includes an insulating layer extending to cover the top surface and the sidewall of the etch stop pattern, wherein a depression is included in a sidewall of the insulating layer. The semiconductor device additionally includes a contact plug passing through the insulating layer so that the contact plug is coupled to a channel structure of the plurality of channel structures.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: January 9, 2024
    Assignee: SK hynix Inc.
    Inventor: Jin Won Lee
  • Patent number: 11864307
    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Tae Hong Min, Jin Won Lee
  • Publication number: 20230371173
    Abstract: An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Woong Choi, Jin Won Lee
  • Patent number: 11818841
    Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes a core layer; a through portion penetrating through the core layer; a first via disposed to be spaced apart from an inner wall of the through portion within the through portion; and a second via disposed in the first via and having a diameter different from that of the first via.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Kyo Seo, Jin Won Lee
  • Publication number: 20230356652
    Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 9, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park
  • Publication number: 20230354513
    Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung BYUN, Mi Sun HWANG, Jung Soo KIM, Jin Won LEE, Duck Young MAENG
  • Patent number: 11770898
    Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: September 26, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Eun Lee, Yong Hoon Kim, Jin Won Lee
  • Publication number: 20230298741
    Abstract: The present disclosure relates to a method for providing guidance on a use period of a sensor and, more specifically, to a method for providing guidance on a use period of a sensor, which accurately provides guidance to a user about a use period of a sensor by calculating the number of sensors possessed by the user and the total use period from the use period of each sensor so as to determine whether the remaining use period has arrived at an order guidance period or to determine whether the remaining use period of the last sensor has arrived at the order guidance period, on the basis of a sensor usage history of the user, and enable the user to order sensors on the basis of the guidance.
    Type: Application
    Filed: June 8, 2021
    Publication date: September 21, 2023
    Inventors: Bo Weol KANG, Jin Won LEE
  • Publication number: 20230298992
    Abstract: There are provided a semiconductor memory device and a manufacturing method of the semiconductor memory device. A semiconductor memory device includes a lower stack structure on the substrate and including a plurality of lower layers stacked in a vertical direction, an intermediate stack structure on the lower stack structure and including a plurality of intermediate layers stacked in the vertical direction, a plurality of grooves in the contact region and penetrating the intermediate stack structure, the plurality of grooves exposing the lower stack structure at different depths, and a plurality of steps formed along sidewalls of the grooves.
    Type: Application
    Filed: May 19, 2023
    Publication date: September 21, 2023
    Applicant: SK hynix Inc.
    Inventors: Jin Won LEE, Nam Jae LEE