Patents by Inventor Jin-won Lee

Jin-won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077417
    Abstract: The disclosure relates to a non-dispersive infrared (NDIR) gas sensor which detects the concentration of gas with a simple structure and method by manufacturing an optical waveguide with a gas-permeable polymer material instead of a conventional cavity or chamber type. An optical signal travels through the optical waveguide of gas-permeable polymer by total internal reflection, and the gas naturally penetrates the optical waveguide without the use of separate inlet and outlet openings, so that the optical signal and gas particles come into contact with each other within the optical waveguide. Since the optical signal detected by a photodetector at the other end of the optical waveguide after traveling while contacting the gas particles has properties changed according to the concentration of the gas which they have contacted in the optical waveguide, it is possible to measure the concentration of a specific gas from the detected optical signal.
    Type: Application
    Filed: July 11, 2023
    Publication date: March 7, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jin Hwa RYU, Soocheol KIM, Hyunseok KIM, So Yung PARK, Hoe-Sung YANG, Kang Bok LEE, Kwang-Soo CHO, Kyu Won HAN
  • Publication number: 20240080450
    Abstract: The present invention discloses an image decoding method, the method including generating a candidate list including motion information derived from a spatial neighboring block and a temporal neighboring block adjacent to a current block; deriving motion information of the current block using the candidate list; generating a prediction block of the current block using the derived motion information; and updating the derived motion information in a motion information list, wherein the generating of the candidate list is performed in such a manner as to include at least one information of the motion information included in the updated motion information list in a block decoded before the current block.
    Type: Application
    Filed: November 2, 2023
    Publication date: March 7, 2024
    Applicants: Electronics and Telecommunications Research Institute, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Jung Won KANG, Ha Hyun LEE, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Gwang Hoon PARK, Tae Hyun KIM, Dae Young LEE
  • Publication number: 20240080454
    Abstract: An image encoding/decoding method and apparatus for performing intra prediction mode based intra prediction are provided. An image decoding method may comprise decoding an intra prediction mode of a current block, deriving at least one intra prediction mode from the decoded intra prediction mode of the current block, generating two or more intra prediction blocks using the intra prediction mode of the current block and the derived intra prediction mode, and generating an intra prediction block of the current block based on the two or more intra prediction blocks.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 7, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Sung Chang LIM, Hyun Suk KO, Jung Won KANG, Jin Ho Lee, Ha Hyun LEE, Dong San Jun, Hui Yong KIM
  • Publication number: 20240080455
    Abstract: An image encoding/decoding method and apparatus for performing intra prediction mode based intra prediction are provided. An image decoding method may comprise decoding an intra prediction mode of a current block, deriving at least one intra prediction mode from the decoded intra prediction mode of the current block, generating two or more intra prediction blocks using the intra prediction mode of the current block and the derived intra prediction mode, and generating an intra prediction block of the current block based on the two or more intra prediction blocks.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 7, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Sung Chang LIM, Hyun Suk KO, Jung Won KANG, Jin Ho Lee, Ha Hyun LEE, Dong San Jun, Hui Yong KIM
  • Patent number: 11923562
    Abstract: A battery module includes: a battery cell assembly having a plurality of battery cells; a top plate configured to cover an upper side of the battery cell assembly; a bottom plate configured to cover a lower side of the battery cell assembly; a sensing assembly disposed to cover a front side and a rear side of the battery cell assembly; a pair of side plates disposed at side surfaces, respectively, of the battery cell assembly; and a pair of compression pads disposed between the pair of side plates and the battery cell assembly, respectively.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: March 5, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Sung-Won Seo, Dong Yeon Kim, Ho-June Chi, Dal-Mo Kang, Jin-Hak Kong, Jeong-O Mun, Yoon-Koo Lee, Yong-Seok Choi, Alexander Eichhorn, Andreas Track
  • Patent number: 11924412
    Abstract: An image encoding/decoding method and apparatus for performing representative sample-based intra prediction are provided. An image decoding method may comprise deriving an intra prediction mode of a current block, configuring a reference sample of the current block, and performing intra prediction for the current block based on the intra prediction mode and the reference sample, wherein the intra prediction is representative sample-based prediction.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: March 5, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jin Ho Lee, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Ha Hyun Lee, Dong San Jun, Hui Yong Kim
  • Publication number: 20240073413
    Abstract: An image encoding/decoding method and apparatus for performing intra prediction using a plurality of reference sample lines are provided. An image decoding method may comprise configuring a plurality of reference sample lines, reconstructing an intra prediction mode of a current block, and performing intra prediction for the current block based on the intra prediction mode and the plurality of reference sample lines.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 29, 2024
    Inventors: Jin Ho LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Ha Hyun LEE, Dong San JUN, Hui Yong KIM
  • Publication number: 20240074296
    Abstract: A display panel includes a first substrate including a display area, in which a plurality of pixel areas is arranged, and a non-display area around the display area, a second substrate disposed opposite to the first substrate, a light emitting array disposed on the first substrate and including a plurality of light emitting elements corresponding to the plurality of pixel areas, a sealing layer disposed in the non-display area between the first substrate and the second substrate and bonding the first substrate and the second substrate to each other, a vacuum layer sealed by the sealing layer and defined between the light emitting array and the second substrate, and a reflection adjustment layer disposed on the second substrate and absorbing a portion of external light, where the reflection adjustment layer includes a plurality of protrusions protruding toward the light emitting array and exposed to the vacuum layer.
    Type: Application
    Filed: April 12, 2023
    Publication date: February 29, 2024
    Inventors: Jong Ho SON, Dae Won KIM, Hye Beom SHIN, Jin Hyeong LEE, Sun Young CHANG
  • Publication number: 20240071313
    Abstract: A display device for performing a sensing operation according to an embodiment of the present inventive concept includes a pixel unit including pixel circuits each including a light emitting element, a driving transistor, a switching transistor, and a sensing control transistor connected between an anode electrode and an initialization power source; a scan driver connected to the pixel circuits through horizontal lines and sequentially outputting scan signals and sensing control signals; and a sensing unit configured to sense voltages or current of first nodes each disposed between an anode electrode and a driving transistor. The scan driver simultaneously outputs the sensing control signals to the horizontal lines at every predetermined discharge cycle.
    Type: Application
    Filed: February 23, 2023
    Publication date: February 29, 2024
    Inventors: Ki Hyun PYUN, Jin Won LEE
  • Publication number: 20240073448
    Abstract: Disclosed herein is a method of decoding an image including determining whether a current block is in a bi-directional optical flow (BIO) mode, calculating gradient information of prediction samples of the current block when the current block is in the BIO mode, and generating a prediction block of the current block using the calculated gradient information, wherein the calculating of the gradient information of the prediction samples of the current block includes calculating the gradient information using at least one neighbor sample adjacent to the prediction samples.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 29, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ha Hyun LEE, Jung Won KANG, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM
  • Publication number: 20240073445
    Abstract: Disclosed is a method of decoding an image and a method of encoding an image. The method of decoding an image includes: obtaining motion-constrained tile set information; determining, on the basis of the motion-constrained tile set information, a first boundary region of a collocated tile set within a reference picture, which corresponds to a motion-constrained tile set; padding a second boundary region corresponding to the first boundary region; and performing inter prediction on the motion-constrained tile set by using a collocated tile set that includes the padded second boundary region.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, CHIPS&MEDIA, INC
    Inventors: Ha Hyun LEE, Jung Won KANG, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Dae Yeon KIM, Dong Jin PARK
  • Patent number: 11917148
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: February 27, 2024
    Assignees: Electronics And Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Hanbat National University Industry-Academic Cooperation Foundation
    Inventors: Jin-Ho Lee, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Dong-San Jun, Ha-Hyun Lee, Seung-Hyun Cho, Hui-Yong Kim, Hae-Chul Choi, Dae-Hyeok Gwon, Jae-Gon Kim, A-Ram Back
  • Patent number: 11917170
    Abstract: The present invention relates to an image information decoding method. The decoding method includes receiving a bit stream including a Network Abstraction Layer (NAL) unit that includes information related to encoded image, and parsing a NAL unit header of the NAL unit. The NAL unit header may not include 1 bit flag information that represents whether a picture is a non-reference picture or a reference picture in the entire bit stream during encoding.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: February 27, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jung Won Kang, Ha Hyun Lee, Jin Soo Choi, Jin Woong Kim
  • Patent number: 11910604
    Abstract: Provided herein are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes an etch stop pattern having a top surface and a sidewall disposed over a gate stack having interlayer insulating layers alternately stacked with conductive patterns. The semiconductor device also includes a plurality of channel structures passing through the etch stop pattern and the gate stack. The semiconductor device further includes an insulating layer extending to cover the top surface and the sidewall of the etch stop pattern, wherein a depression is included in a sidewall of the insulating layer. The semiconductor device additionally includes a contact plug passing through the insulating layer so that the contact plug is coupled to a channel structure of the plurality of channel structures.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: February 20, 2024
    Assignee: SK hynix Inc.
    Inventor: Jin Won Lee
  • Publication number: 20240057254
    Abstract: A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.
    Type: Application
    Filed: January 20, 2023
    Publication date: February 15, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Youn Gyu Han, Jin Won Lee, Da Yeon Lee, Yong Duk Lee
  • Patent number: 11901359
    Abstract: A semiconductor device including a plurality of active regions extending in a first direction on a substrate; a device isolation layer between the plurality of active regions such that upper portions of the plurality of active regions protrude from the device isolation layer; a first gate electrode and a second gate electrode extending in a second direction crossing the first direction and intersecting the plurality of active regions, respectively, on the substrate, the first gate electrode being spaced apart from the second gate electrode in the second direction; a first gate separation layer between the first gate electrode and the second gate electrode; and a second gate separation layer under the first gate separation layer and between the first gate electrode and the second gate electrode, the second gate separation layer extending into the device isolation layer in a third direction crossing the first direction and the second direction.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seung Soo Hong, Jeong Yun Lee, Geum Jung Seong, Jin Won Lee, Hyun Ho Jung
  • Publication number: 20240019500
    Abstract: The present invention relates to a method for detecting a leakage current during use of a biometric data measuring device, and more particularly, a method is provided whereby it is possible to detect whether there is a leakage in a current applied to a sensor in a state of measuring biometric data while a part of the sensor is inserted into the user's skin, by comparing the difference in magnitude between an applied current applied via one terminal of the sensor, which is comprised in the biometric data measuring device, and an output current output via the other terminal of the sensor.
    Type: Application
    Filed: July 28, 2021
    Publication date: January 18, 2024
    Inventors: Young Jae KANG, Jung Uk HA, Jin Won LEE
  • Patent number: 11871570
    Abstract: Provided herein are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes an etch stop pattern having a top surface and a sidewall disposed over a gate stack having interlayer insulating layers alternately stacked with conductive patterns. The semiconductor device also includes a plurality of channel structures passing through the etch stop pattern and the gate stack. The semiconductor device further includes an insulating layer extending to cover the top surface and the sidewall of the etch stop pattern, wherein a depression is included in a sidewall of the insulating layer. The semiconductor device additionally includes a contact plug passing through the insulating layer so that the contact plug is coupled to a channel structure of the plurality of channel structures.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: January 9, 2024
    Assignee: SK hynix Inc.
    Inventor: Jin Won Lee
  • Patent number: 11871568
    Abstract: A semiconductor device includes a source structure penetrated by a first penetrating portion, a first stack structure disposed on the source structure and penetrated by a second penetrating portion overlapping the first penetrating portion.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: January 9, 2024
    Assignee: SK hynix Inc.
    Inventors: Jin Won Lee, Nam Jae Lee
  • Patent number: 11864307
    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Tae Hong Min, Jin Won Lee