Abstract: A display device includes a display panel including a first pixel that emits light with a first luminance that is lower than target luminance and a second pixel that emits light with a second luminance that is higher than the target luminance, a sensor configured to measure a first characteristic of a first light emitting element in the first pixel and a second characteristic of a second light emitting element in the second pixel, and a data compensator configured to calculate a degradation amount of the second pixel based on the first characteristic and the second characteristic.

Abstract: A display device includes a first substrate, a second substrate comprising a pixel portion configured to display an image, and a dummy portion spaced from the pixel portion, a side of the dummy portion being exposed to the outside, and an interlayer between the first substrate and the second substrate, wherein the pixel portion and the dummy portion each include multiple layers, and at least one layer of the pixel portion and at least one layer of the dummy portion include a same material.

Abstract: A liquid crystal display panel including a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a thin film transistor disposed on the first base substrate, a color filter disposed on the first base substrate, and a first alignment layer disposed on the thin film transistor and the color filter. The second substrate includes a second base substrate, a second alignment layer disposed on a first surface of the second base substrate, a touch electrode disposed on a second surface of the second base substrate, a connecting electrode disposed on the second surface, and a connecting line disposed on the second surface. The first surface faces the first substrate, and the second surface is opposite to the first surface. The touch electrode includes a crystallized indium tin oxide.

Abstract: The present specification relates to a conductive structure body, a manufacturing method thereof, a touch panel including the same, and a display device including the same.

Abstract: In some embodiments, 3-dimensional semiconductor memory device includes a semiconductor substrate extending horizontally in a first direction and a second direction crossing the first direction. A stacked memory cell array is formed on the semiconductor substrate. The memory device further includes a separation pattern including a plurality of separation lines extending in the first direction and arranged in the second direction, and dividing the stacked memory cell array into a plurality of memory cell structures extending in the first direction and arranged in the second direction. An upper insulating layer is formed above the plurality of memory cell structures and separation lines, and a passivation layer is formed above the upper insulating layer. The passivation layer includes a plurality of first regions having a first vertical thickness. A plurality of gap regions in the passivation layer are formed between the plurality of first regions.

Abstract: Provided are a thermal interface material layer and a package-on-package device including the same. The package-on-package device may include a thermal interface material layer interposed between lower and upper semiconductor packages and configured to have a specific physical property. Accordingly, it is possible to prevent a crack from occurring in a lower semiconductor chip, when a solder ball joint process is performed to mount the upper semiconductor package on the lower semiconductor package.

Abstract: A method of erasing a memory device, the method of erasing the memory device including: performing, in a first erase period, a first erase operation on memory cells respectively connected to a plurality of word lines, wherein at least one of the memory cells, which is included in a memory block, is not erase-passed; determining, after the first erase period, an erase operation speed by applying a verify voltage to at least one of the plurality of word lines, and determining an effective erasing time for each word line based on the determined erase operation speed; and performing, in a second erase period, a second erase operation on the memory cells respectively connected to the plurality of word lines based on the determined effective erasing times.

Abstract: The present specification relates to a conductive structure body and a method for manufacturing the same.

Abstract: A semiconductor device package includes a buffer layer having an upper surface perpendicular to a first direction, a plurality of semiconductor chips stacked on the buffer layer one by one in the first direction, and a chip sealing material surrounding sidewalls of the semiconductor chips. The semiconductor chips include an upper semiconductor chip at a farthest position from the buffer layer and a remaining plurality of intermediate semiconductor chips. Each of the intermediate semiconductor chips includes through silicon vias (TSVs) passing through each of the intermediate semiconductor chips. The upper semiconductor chip includes a trench formed in at least a portion of a periphery of the upper semiconductor chip and covered by the chip sealing material. Accordingly, the semiconductor device package provides increased device reliability.

Abstract: A touch screen panel includes a substrate including an effective area and an opaque layer disposed outside the effective area, sensing electrodes disposed in the effective area, pads disposed on the opaque layer, and wirings connecting the sensing electrodes to the pads, respectively, in which the wirings each have different lengths, and a first wiring having the shortest length among the wirings includes an extension, the extension covering a side of the opaque layer.

Abstract: The present application relates to an electrochromic element and a method for manufacturing the same. A method for manufacturing an electrochromic element according to an exemplary embodiment of the present application comprises: forming a first electrode on a first substrate, and then forming a first electrochromic unit on the first electrode; forming a second electrode on a second substrate, and then forming a second electrochromic unit on the second electrode; and forming an electrolyte layer between the first electrochromic unit and the second electrochromic unit, in which the forming of the first electrochromic unit is carried out by an E-beam deposition method (E-beam evaporation) using a carrier gas.

Abstract: An exhaust gas purification system, which includes an engine and an exhaust pipe that is connected to an exhaust manifold of the engine, includes: a catalyst converter disposed at a rear side the engine on the exhaust pipe; a selective catalytic reduction on diesel particulate filter (SDPF) disposed at a rear side of the catalyst converter on the exhaust pipe; a reducing agent injector disposed between the catalyst converter and the SDPF on the exhaust pipe and injecting a reducing agent; and a controller controlling an amount of the reducing agent injected from the reducing agent injector.

Abstract: A correction method of NOx purifying efficiency of SDPF includes: measuring a temperature change per unit time inside the SDPF, determining whether the temperature change per unit time inside the SDPF is below a first predetermined value, determining whether a difference between a maximum value and a minimum value of temperature of respective parts inside the SDPF is below a second predetermined value if the temperature change per unit time inside the SDPF is below the first predetermined value, determining whether a temperature inside the SDPF is in a low temperature region if the difference between the maximum value and the minimum value of temperature of the respective parts inside the SDPF is below the second predetermined value, and performing a low temperature region correction if the temperature inside the SDPF is in the low temperature region.

Abstract: An organic light emitting diode display includes a substrate, a scan line on the substrate for transferring a scan signal, a data line crossing the scan line and for transferring a data signal, a driving voltage line crossing the scan line and for transferring a driving voltage, a switching thin film transistor coupled to the scan line and the data line, a driving thin film transistor coupled to a switching drain electrode of the switching thin film transistor, and an organic light emitting diode (OLED) coupled to a driving drain electrode of the driving thin film transistor, wherein a driving semiconductor layer of the driving thin film transistor is bent and in a plane substantially parallel to the substrate.

Abstract: A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a display area and a non-display area adjacent to the display area, a first substrate including a touch sensor in the display area and a touch sensor pad in the non-display area, and a second substrate opposing the first substrate, the second substrate including a pixel in the display area and a connection pad in the non-display area. An interlayer in the display area is provided between the first substrate and the second substrate, a plurality of conductive balls electrically connects the touch sensor pad and the connection pad, and an inter-bar in the non-display area is provided between the first substrate and the second substrate. The inter-bar is disposed adjacent to the connection pad, and the conductive balls have an average diameter that is greater than the height of the inter-bar.

Abstract: A stack package includes a first sub-package and a second sub-package stacked on the first sub-package. The first sub-package includes a first through mold via (TMV) for connection spaced apart from a first semiconductor chip in an X-axis direction, a first TMV for bypass spaced apart from the first semiconductor chip in a Y-axis direction, and a first redistribution line (RDL) pattern connecting the first semiconductor chip to the first TMV for connection. The second sub-package includes a second TMV for connection spaced apart from a second semiconductor chip in the Y-axis direction and another RDL pattern connecting the second semiconductor chip to the second TMV for connection. the second sub-package is stacked on the first sub-package such that the second TMV for connection is connected to the first TMV for bypass.

Abstract: Aspects of the instant disclosure relate to an electrophysiological catheter system for performing diagnostics and therapies within a cardiac muscle; more specifically, to a wireless force sensor, mounted to an external surface of a catheter shaft, that detects force exerted on a catheter tip and wirelessly transmits a signal indicative of the sensed force to a wireless transceiver in proximity thereto.

Abstract: A liquid crystal display panel including a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a thin film transistor disposed on the first base substrate, a color filter disposed on the first base substrate, and a first alignment layer disposed on the thin film transistor and the color filter. The second substrate includes a second base substrate, a second alignment layer disposed on a first surface of the second base substrate, a touch electrode disposed on a second surface of the second base substrate, a connecting electrode disposed on the second surface, and a connecting line disposed on the second surface. The first surface faces the first substrate, and the second surface is opposite to the first surface. The touch electrode includes a crystallized indium tin oxide.

Abstract: Provided are chip-on-film package and display device including the same. The chip-on-film package comprises: a base film; a driving chip which is disposed on a surface of the base film; and a heat radiating member which is disposed on the driving chip and comprises a first heat radiating pad portion, a second heat radiating pad portion separated from the first heat radiating pad portion in a first direction, a connecting portion disposed between the first heat radiating pad portion and the second heat radiating pad portion, and one or more protrusions extending from the first heat radiating pad portion or the second heat radiating pad portion along an oblique direction in the first direction, wherein the connecting portion at least partially overlaps the driving chip.

Abstract: An organic electro luminescent display with auxiliary layers on a cathode contact and an encapsulating junction region to easily remove polymer organic layers of the junction and a method for fabricating the same. The organic electro luminescent display has the first electrode formed on a lower insulating substrate, a pixel defining layer formed to make some portions of the first electrode opened over the entire surface of the lower insulating substrate, an organic emission layer formed on an opening of the first electrode, the second electrode formed on the organic emission layer, an upper substrate for encapsulating the first electrode, the organic emission layer and the second electrode, and auxiliary layers formed on the cathode contact and the encapsulating junction region of the lower insulating substrate.