Patents by Inventor Jin-Woo Park

Jin-Woo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CORRECTION METHOD OF NOx PURIFYING EFFICIENCY OF SDPF
    Publication number: 20190360377
    Abstract: A correction method of NOx purifying efficiency of SDPF includes: measuring a temperature change per unit time inside the SDPF, determining whether the temperature change per unit time inside the SDPF is below a first predetermined value, determining whether a difference between a maximum value and a minimum value of temperature of respective parts inside the SDPF is below a second predetermined value if the temperature change per unit time inside the SDPF is below the first predetermined value, determining whether a temperature inside the SDPF is in a low temperature region if the difference between the maximum value and the minimum value of temperature of the respective parts inside the SDPF is below the second predetermined value, and performing a low temperature region correction if the temperature inside the SDPF is in the low temperature region.
    Type: Application
    Filed: October 24, 2018
    Publication date: November 28, 2019
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, FEV Europe GmbH
    Inventors: Ki Hyung JOO, Myung Jong LEE, Jin Woo PARK, Arun Palaniappan Muthukaruppan, Waldemar Josef Kansy
  • Organic light emitting diode display
    Patent number: 10483342
    Abstract: An organic light emitting diode display includes a substrate, a scan line on the substrate for transferring a scan signal, a data line crossing the scan line and for transferring a data signal, a driving voltage line crossing the scan line and for transferring a driving voltage, a switching thin film transistor coupled to the scan line and the data line, a driving thin film transistor coupled to a switching drain electrode of the switching thin film transistor, and an organic light emitting diode (OLED) coupled to a driving drain electrode of the driving thin film transistor, wherein a driving semiconductor layer of the driving thin film transistor is bent and in a plane substantially parallel to the substrate.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: November 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Se-Ho Kim, Jin-Woo Park, Won-Se Lee
  • Display device and method of manufacturing the same
    Patent number: 10474263
    Abstract: A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a display area and a non-display area adjacent to the display area, a first substrate including a touch sensor in the display area and a touch sensor pad in the non-display area, and a second substrate opposing the first substrate, the second substrate including a pixel in the display area and a connection pad in the non-display area. An interlayer in the display area is provided between the first substrate and the second substrate, a plurality of conductive balls electrically connects the touch sensor pad and the connection pad, and an inter-bar in the non-display area is provided between the first substrate and the second substrate. The inter-bar is disposed adjacent to the connection pad, and the conductive balls have an average diameter that is greater than the height of the inter-bar.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: November 12, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Soo Jung, Jin Woo Park, Ho Youn Kim, Hyun Chul Oh, Ung Soo Lee, Jun Young Lee, Su Hyuk Choi
  • STACK PACKAGES INCLUDING THROUGH MOLD VIA STRUCTURES
    Publication number: 20190333899
    Abstract: A stack package includes a first sub-package and a second sub-package stacked on the first sub-package. The first sub-package includes a first through mold via (TMV) for connection spaced apart from a first semiconductor chip in an X-axis direction, a first TMV for bypass spaced apart from the first semiconductor chip in a Y-axis direction, and a first redistribution line (RDL) pattern connecting the first semiconductor chip to the first TMV for connection. The second sub-package includes a second TMV for connection spaced apart from a second semiconductor chip in the Y-axis direction and another RDL pattern connecting the second semiconductor chip to the second TMV for connection. the second sub-package is stacked on the first sub-package such that the second TMV for connection is connected to the first TMV for bypass.
    Type: Application
    Filed: November 8, 2018
    Publication date: October 31, 2019
    Applicant: SK hynix Inc.
    Inventors: Juil EOM, Bok Kyu CHOI, Jae Hoon LEE, Jin Woo PARK
  • WIRELESS FORCE SENSOR
    Publication number: 20190328245
    Abstract: Aspects of the instant disclosure relate to an electrophysiological catheter system for performing diagnostics and therapies within a cardiac muscle; more specifically, to a wireless force sensor, mounted to an external surface of a catheter shaft, that detects force exerted on a catheter tip and wirelessly transmits a signal indicative of the sensed force to a wireless transceiver in proximity thereto.
    Type: Application
    Filed: December 14, 2017
    Publication date: October 31, 2019
    Inventors: Ryan M. Albu, Bruce Ebner, Gregory K. Olson, Troy T. Tegg, Jin Woo Park, Edward E. Parsonage
  • Liquid crystal display panel and method of manufacturing the same
    Patent number: 10451909
    Abstract: A liquid crystal display panel including a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a thin film transistor disposed on the first base substrate, a color filter disposed on the first base substrate, and a first alignment layer disposed on the thin film transistor and the color filter. The second substrate includes a second base substrate, a second alignment layer disposed on a first surface of the second base substrate, a touch electrode disposed on a second surface of the second base substrate, a connecting electrode disposed on the second surface, and a connecting line disposed on the second surface. The first surface faces the first substrate, and the second surface is opposite to the first surface. The touch electrode includes a crystallized indium tin oxide.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 22, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seong Mo Hwang, Jin Woo Park
  • Chip-on-film package and display device including the same
    Patent number: 10446465
    Abstract: Provided are chip-on-film package and display device including the same. The chip-on-film package comprises: a base film; a driving chip which is disposed on a surface of the base film; and a heat radiating member which is disposed on the driving chip and comprises a first heat radiating pad portion, a second heat radiating pad portion separated from the first heat radiating pad portion in a first direction, a connecting portion disposed between the first heat radiating pad portion and the second heat radiating pad portion, and one or more protrusions extending from the first heat radiating pad portion or the second heat radiating pad portion along an oblique direction in the first direction, wherein the connecting portion at least partially overlaps the driving chip.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: October 15, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Eun Suk Kim, Moon Ju Kim, Jin Woo Park
  • Nonvolatile memory device and an erase method thereof
    Patent number: 10438666
    Abstract: A method of erasing a memory device, the method of erasing the memory device including: performing, in a first erase period, a first erase operation on memory cells respectively connected to a plurality of word lines, wherein at least one of the memory cells, which is included in a memory block, is not erase-passed; determining, after the first erase period, an erase operation speed by applying a verify voltage to at least one of the plurality of word lines, and determining an effective erasing time for each word line based on the determined erase operation speed; and performing, in a second erase period, a second erase operation on the memory cells respectively connected to the plurality of word lines based on the determined effective erasing times.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-yoon Park, Wan-dong Kim, Seung-bum Kim, Deok-woo Lee, You-se Kim, Se-hwan Park, Jin-woo Park
  • DISPLAY DEVICE
    Publication number: 20190304374
    Abstract: A display device may include a first pixel coupled to an emission control line, and an emission control stage for selectively coupling the emission control line to a first or second supply voltage line. The emission control stage may include: a first emission control transistor including a first electrode coupled to the first supply voltage line, a second electrode coupled to the emission control line, and a main gate electrode coupled to a first node; a second emission control transistor including a first electrode coupled to the emission control line, a second electrode coupled to the second supply voltage line, and a main gate electrode coupled to a second node; and a third emission control transistor including a first electrode coupled to the first supply voltage line, a second electrode coupled to the first node, a main gate electrode coupled to the second node, and a sub-gate electrode.
    Type: Application
    Filed: February 19, 2019
    Publication date: October 3, 2019
    Inventors: Seong Min WANG, Young In HWANG, Jin Woo PARK, Yong Ho YANG
  • Thermal interface material layer and package-on-package device including the same
    Patent number: 10431522
    Abstract: Provided are a thermal interface material layer and a package-on-package device including the same. The package-on-package device may include a thermal interface material layer interposed between lower and upper semiconductor packages and configured to have a specific physical property. Accordingly, it is possible to prevent a crack from occurring in a lower semiconductor chip, when a solder ball joint process is performed to mount the upper semiconductor package on the lower semiconductor package.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 1, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-woo Park, BongJin Son, Jangwoo Lee
  • Wire transfer apparatus of tabbing apparatus
    Patent number: 10424688
    Abstract: Provided is a wire transfer apparatus of a tabbing apparatus. A wire transfer apparatus of a tabbing apparatus according to the present invention includes: a first transfer gripper unit configured to grip a wire; a second transfer gripper unit disposed in parallel to the first transfer gripper unit and configured to grip the wire at a location spaced apart from the first transfer gripper unit together with the first transfer gripper unit; and a gripper transfer unit configured to transfer the wire while moving the first transfer gripper unit and the second transfer gripper unit.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: September 24, 2019
    Assignee: ZEUS CO., LTD.
    Inventors: Young Ik Park, Jin Woo Park, Dong Jin Chung
  • DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190273123
    Abstract: A display device includes a first substrate, a second substrate comprising a pixel portion configured to display an image, and a dummy portion spaced from the pixel portion, a side of the dummy portion being exposed to the outside, and an interlayer between the first substrate and the second substrate, wherein the pixel portion and the dummy portion each include multiple layers, and at least one layer of the pixel portion and at least one layer of the dummy portion include a same material.
    Type: Application
    Filed: May 17, 2019
    Publication date: September 5, 2019
    Inventors: Ung Soo Lee, Ho Youn Kim, Jin Woo Park, Hyun Chul Oh, Jun Young Lee, Hyun Soo Jung, Su Hyuk Choi
  • METHOD OF PREPARING HIGH SOLIDS CONTENT POLYMER POLYOLS HAVING LOW VISCOSITY
    Publication number: 20190270836
    Abstract: Provided is a method of preparing a polymer polyol, including steps of: (a) polymerizing a polyol and a monomer in presence of a diluent to prepare a primary particle dispersed liquid; and (b) feeding an additional polyol and monomer into the primary particle dispersed liquid and polymerizing to prepare a secondary particle dispersed liquid.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 5, 2019
    Inventors: Gi Jung KIM, Seul Gi KIM, Seung Moo HUH, Jin Woo PARK
  • Method for compensating image information
    Patent number: 10388229
    Abstract: A method for controlling a display panel includes calculating an on-pixel ratio based on gamma information corresponding to image information, providing maximum current information based on a dimming level, calculating an average current of the display panel based on the on-pixel ratio and the maximum current information, and providing pixel average current information for each of a plurality of pixels in the display panel. The on-pixel ratio is based on the turned-on pixels of the pixels in the display panel. The pixel average current information is determined based on the average current of the display panel.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jin-Woo Park, Sung-Hoon Bang
  • Method for processing audio signal and electronic device for supporting the same
    Patent number: 10388301
    Abstract: An electronic device for processing an audio signal is provided. The electronic device includes a communication circuit, a microphone, a connector and a processor. The processor identifies whether the external cable connected with a first external electronic device and including a resistor having a resistance value equal to or greater than a designated resistance value is connected to the connector, and in response to identifying that the external cable is connected to the connector, transmit a first audio signal to the first external electronic device through the external cable, and receive a second audio signal including an echo signal and a voice signal through the microphone, and cancel the echo signal corresponding to the first audio signal, based at least partly on a delay time corresponding to the external cable and a parameter related with a filter corresponding to the external cable.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: August 20, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Choon-Ho Kim, Kyuhan Kang, Gangyoul Kim, Kiwon Kim, Minseok Kim, Jin-Woo Park, Gunhyuk Yoon, Sangphil Hong
  • X-ray detector and X-ray imaging apparatus having the same
    Patent number: 10379437
    Abstract: Disclosed herein is an X-ray imaging apparatus having an improved structure which is configured for preventing an entrance of foreign materials. The X-ray imaging apparatus includes: an X-ray source configured to generate X-rays, and to irradiate the generated X-rays; an X-ray detector configured to detect the irradiated X-rays; and a first frame and a second frame coupled with each other to form an outer appearance of the X-ray detector. The first frame is tightly coupled with the second frame so that no gap exists between the first frame and the second frame in order to prevent a foreign material from entering the inside of the X-ray detector.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: August 13, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Ik Kim, Jin-Woo Park, Eun Jeong Jo
  • Organic light emitting diode display device and display system including the same
    Patent number: 10373566
    Abstract: An organic light emitting diode (OLED) display device includes a display panel including a plurality of pixel rows; a driving circuit configured to: provide a first display data to the plurality of pixel rows in a normal mode; provide a second display data including black data to the plurality of pixel rows in a dimming mode, in response to a mode signal; and decrease a second luminance of the display panel in the dimming mode to a level lower than a first luminance of the display panel in the normal mode; and a power supply configured to apply a lower power supply voltage and a high power supply voltage to the display panel, the power supply providing the mode signal.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: August 6, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Sic Lee, Jin-Woo Park
  • Semiconductor packages relating to thermal transfer plate and methods of manufacturing the same
    Patent number: 10361141
    Abstract: A semiconductor package and a method of manufacturing the semiconductor package may be provided. The semiconductor package may include a first semiconductor chip disposed on a first surface of an interconnection layer, a second and a third semiconductor chips disposed on a second surface of the interconnection layer. The semiconductor package may include a thermal transfer plate disposed between the second and third semiconductor chips, contacting the second surface of the interconnection layer, and overlapping with the first semiconductor chip. The thermal transfer plate may be configured to provide a heat radiation path.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 23, 2019
    Assignee: SK hynix Inc.
    Inventors: Yeon Seung Jung, Jong Hoon Kim, Jin Woo Park
  • PLASMA SOURCE AND PLASMA GENERATION APPARATUS USING THE SAME
    Publication number: 20190221404
    Abstract: A plasma source device includes a pair of divided electrodes including a first divided electrode and a second divided electrode spaced apart from each other and electrically coupled to each other; and a ferrite structure comprising a portion interposed between the first divided electrode and the second divided electrode.
    Type: Application
    Filed: December 14, 2018
    Publication date: July 18, 2019
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Geun Young YEOM, Ki Hyun KIM, Ki Seok KIM, You Jin JI, Jin Woo PARK, Doo San KIM, Won Oh LEE, Chang Hoon Song, Ji Young Byun, Ji Soo Oh, Hyun Woo Tak
  • Connection terminal device and electronic device having the same
    Patent number: 10355429
    Abstract: A connection terminal device and an electronic device having the same are provided. The connection terminal device includes a connection terminal device body, and a connection terminal connected to the connection terminal device body. The connection terminal device also has a front unit disposed on a front surface of the connection terminal device body, a rear unit disposed on a rear surface of the connection terminal device body, and a support disposed on the rear surface of the connection terminal device body. When force is applied to the connection terminal, supporting force is transferred to the rear unit of the connection terminal device body.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: July 16, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., HYUPJINCONNECTOR CO., LTD.
    Inventors: Myeong-Hwa Kim, Yang-Jean Park, Yeon-Kwan Moon, Jin-Woo Park, Myung-Suk Bae, Jung-Hyun Cho, Jin-Hyuk Choi, Jae-Ryong Han, Jang-Won Hur