Patents by Inventor Jin-Woo Park

Jin-Woo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210030200
    Abstract: A cooker control device and a cooker control method are disclosed. The cooker control method includes: recognizing a cooking ingredient based on vision recognition, inputting cooking information, and transmitting a cooking instruction corresponding to a detected recipe. According to the present disclosure, a cooker which cooks the recognized cooking ingredient may be controlled using an artificial intelligence (AI) model which performs machine learning (ML) through a 5G network.
    Type: Application
    Filed: January 3, 2020
    Publication date: February 4, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Cherylyn CHUNG, Pil Suk Kang, Young Tak Kim, Jin Woo Park, Jung Hyun Lee
  • Publication number: 20210020608
    Abstract: A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.
    Type: Application
    Filed: January 16, 2020
    Publication date: January 21, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong Youn KIM, Dong Kyu Kim, Jin-Woo Park, Min Jun Bae, Gwang Jae Jeon
  • Patent number: 10894144
    Abstract: A delivery system for an intracorporeal device includes a sheath defining one or more lumens shaped to receive a delivery catheter or shaft and a guidewire. The system may include a delivery shaft having a distal coupling feature adapted to releasably couple with a proximal coupling feature of the intracorporeal device. The delivery system may further include a hub through which the delivery shaft and guidewire are passed. The delivery shaft may be coupled to a feature, such as a knob, that enables manipulation of the delivery shaft to decouple the distal fixation feature from the proximal fixation feature of the intracorporeal device in order to deploy the intracorporeal device within a patient.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: January 19, 2021
    Assignee: PACESETTER, INC.
    Inventors: Tracee Eidenschink, Jin Woo Park, Jason A. White
  • Patent number: 10896917
    Abstract: In some embodiments, 3-dimensional semiconductor memory device includes a semiconductor substrate extending horizontally in a first direction and a second direction crossing the first direction. A stacked memory cell array is formed on the semiconductor substrate. The memory device further includes a separation pattern including a plurality of separation lines extending in the first direction and arranged in the second direction, and dividing the stacked memory cell array into a plurality of memory cell structures extending in the first direction and arranged in the second direction. An upper insulating layer is formed above the plurality of memory cell structures and separation lines, and a passivation layer is formed above the upper insulating layer. The passivation layer includes a plurality of first regions having a first vertical thickness. A plurality of gap regions in the passivation layer are formed between the plurality of first regions.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: January 19, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Sung Song, Heung Jin Joo, Kwan Yong Kim, Jin Woo Park, Du Heon Song, He Jueng Lee, Myung Ho Jung
  • Publication number: 20200405149
    Abstract: A computer implemented method, system and device are provided. The method transmits an energizing signal from an external antenna, coupled to a local external device (LED), to an implanted antenna of a passive implanted medical device (PIMD). The energizing signal is transmitted while the external antenna is at first and second positions. The method receives, at the external antenna, first and second energy transfer characteristic (ETC) values associated with the first and second positions, respectively. The method is under control of one or more processors configured with program instructions. The method analyzes the first and second ETC values to determine a difference therebetween. The method provides an energy transfer level (ETL) indicator based on the difference between the first and second ETC values. The ETL indicator provides feedback regarding a degree of energy transfer associated with at least one of the first and second positions.
    Type: Application
    Filed: June 25, 2019
    Publication date: December 31, 2020
    Inventors: Jin Woo Park, Michael Fonseca, William D. Barrett, Philip M. FitzSimons
  • Publication number: 20200365678
    Abstract: An organic light emitting diode display includes a substrate, a scan line on the substrate for transferring a scan signal, a data line crossing the scan line and for transferring a data signal, a driving voltage line crossing the scan line and for transferring a driving voltage, a switching thin film transistor coupled to the scan line and the data line, a driving thin film transistor coupled to a switching drain electrode of the switching thin film transistor, and an organic light emitting diode (OLED) coupled to a driving drain electrode of the driving thin film transistor, wherein a driving semiconductor layer of the driving thin film transistor is bent and in a plane substantially parallel to the substrate.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Se-Ho Kim, Jin-Woo Park, Won-Se Lee
  • Publication number: 20200365555
    Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 19, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji-seok HONG, Jin-woo PARK
  • Patent number: 10839806
    Abstract: An electronic device and method are disclosed herein. The electronic device includes a network interface and processor. The processor implements the method, including receiving a voice input through a network interface as transmitted from a first external device, including a request to execute a function using at least one application which is not indicated in the voice input, extracting a first text from the voice input by executing automatic speech recognition (ASR), when the at least one application is identified based on the first text, transmitting, through the network interface to the first external device, second data associated with the identified at least one application for display by the first external device, and when the at least one application is not identified based at least in part on the first text, reattempting identification of the at least one application by executing natural language understanding (NLU) on the first text.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Hyuk Jeon, Woo Up Kwon, Jin Woo Park, Kyoung Gu Woo, Eun Taek Lim, Kyung Hak Hyun, Dong Ho Jang
  • Patent number: 10811008
    Abstract: A system for processing a user utterance is provided. The system includes at least one network interface; at least one processor operatively connected to the at least one network interface; and at least one memory operatively connected to the at least one processor, wherein the at least one memory stores a plurality of specified sequences of states of at least one external electronic device, wherein each of the specified sequences is associated with a respective one of domains, wherein the at least one memory further stores instructions that, when executed, cause the at least one processor to receive first data associated with the user utterance provided via a first of the at least one external electronic device, wherein the user utterance includes a request for performing a task using the first of the at least one external device.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: October 20, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Kyoung Gu Woo, Woo Up Kwon, Jin Woo Park, Eun Taek Lim, Joo Hyuk Jeon, Ji Hyun Kim, Dong Ho Jang
  • Patent number: 10809557
    Abstract: A liquid crystal display panel including a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a thin film transistor disposed on the first base substrate, a color filter disposed on the first base substrate, and a first alignment layer disposed on the thin film transistor and the color filter. The second substrate includes a second base substrate, a second alignment layer disposed on a first surface of the second base substrate, a touch electrode disposed on a second surface of the second base substrate, a connecting electrode disposed on the second surface, and a connecting line disposed on the second surface. The first surface faces the first substrate, and the second surface is opposite to the first surface. The touch electrode includes a crystallized indium tin oxide.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: October 20, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seong Mo Hwang, Jin Woo Park
  • Publication number: 20200310525
    Abstract: Provided are a method for managing usage time of an IoT device, and an apparatus therefor. According to the disclosure, a method for managing usage time of an IoT device which flexibly controls a standby mode of an IoT device according to a user's selection, and which enables a user to select an operation method of a standby mode by using an application for minimizing power consumption of an IoT device, and an apparatus therefor are provided.
    Type: Application
    Filed: December 4, 2019
    Publication date: October 1, 2020
    Applicant: FCI Inc.
    Inventors: Sang Hak CHUNG, Jin Woo PARK, Seung Ho SHIN, Sung Ho KIM
  • Publication number: 20200305457
    Abstract: The present disclosure relates to emulsified oil composition including an oil containing a polyunsaturated fatty acid which is applicable to food, a rosemary extract, and a non-ionic surfactant, wherein the product quality of the food using the oil containing the polyunsaturated fatty acid is maintained during the processing and storage of the food, by preventing the oxidation of the oil containing the polyunsaturated fatty acid to suppress the production of a rancid flavor and an off-flavor.
    Type: Application
    Filed: September 3, 2019
    Publication date: October 1, 2020
    Inventors: Jin Woo PARK, Hye Jin KIM, Hye Young KIM, Jee Ho PARK, Gi Tae CHOE
  • Patent number: 10790264
    Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 29, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-seok Hong, Jin-woo Park
  • Patent number: 10777920
    Abstract: According to an embodiment of the present disclosure, a connecting device included in an electronic device may comprise a movable part including at least one contacting part, an elastic part extending from the movable part and including a plurality of bends alternately arranged to allow the movable part to move in a first direction, and a support extending from the elastic part. Other various embodiments are also possible.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: September 15, 2020
    Assignees: Samsung Electronics Co., Ltd., HYUPJINCONNECTOR Co., Ltd.
    Inventors: Sung-Won Park, Jae-Woon Lee, Yang-Jean Park, Jong-Sun Kim, Jin-Woo Park, Myung-Suk Bae, Seung-Yup Lee, Jae-Ryong Han, Jang-Won Hur
  • Patent number: 10770446
    Abstract: Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a substrate, a semiconductor chip on the substrate, an interconnect substrate spaced apart from the semiconductor chip on the substrate and including a conductive member therein, a solder ball on the interconnect substrate and electrically connected to the conductive member, a polymer layer on the interconnect substrate and the semiconductor chip and including an opening through which the solder ball is exposed, and polymer particles in the solder ball and including the same material as the polymer layer.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Lyong Kim, Jin-woo Park, Choongbin Yim, Younji Min
  • Publication number: 20200276750
    Abstract: A substrate and a method for producing the same are disclosed herein. In some embodiments, a substrate includes a base layer, a black layer formed on the base layer, and column spacers formed on the black layer, wherein a loss rate of spacers measured by a peel test is 15% or less. The substrate can have excellent adhesiveness of the spacer to the base layer or the black layer and ensuring appropriate darkening properties. The method can effectively produce such a substrate without adverse effects such as occurrence of foreign materials without separate treatment such as heat treatment.
    Type: Application
    Filed: February 3, 2020
    Publication date: September 3, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Cheol Ock Song, Seung Heon Lee, Ji Young Hwang, Han Min Seo, Nam Seok Bae, Jin Woo Park, Jung Sun You
  • Patent number: 10738678
    Abstract: A correction method of NOx purifying efficiency of SDPF includes: measuring a temperature change per unit time inside the SDPF, determining whether the temperature change per unit time inside the SDPF is below a first predetermined value, determining whether a difference between a maximum value and a minimum value of temperature of respective parts inside the SDPF is below a second predetermined value if the temperature change per unit time inside the SDPF is below the first predetermined value, determining whether a temperature inside the SDPF is in a low temperature region if the difference between the maximum value and the minimum value of temperature of the respective parts inside the SDPF is below the second predetermined value, and performing a low temperature region correction if the temperature inside the SDPF is in the low temperature region.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: August 11, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, FEV EUROPE GMBH
    Inventors: Ki Hyung Joo, Myung Jong Lee, Jin Woo Park, Arun Palaniappan Muthukaruppan, Waldemar Josef Kansy
  • Patent number: 10734470
    Abstract: An organic light emitting diode display includes a substrate, a scan line on the substrate for transferring a scan signal, a data line crossing the scan line and for transferring a data signal, a driving voltage line crossing the scan line and for transferring a driving voltage, a switching thin film transistor coupled to the scan line and the data line, a driving thin film transistor coupled to a switching drain electrode of the switching thin film transistor, and an organic light emitting diode (OLED) coupled to a driving drain electrode of the driving thin film transistor, wherein a driving semiconductor layer of the driving thin film transistor is bent and in a plane substantially parallel to the substrate.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: August 4, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Se-Ho Kim, Jin-Woo Park, Won-Se Lee
  • Patent number: 10727548
    Abstract: An energy storage device for uniformly controlling internal temperature of a container by controlling a flow of a cooling air current includes: racks for accommodating a plurality of battery packs; a container for accommodating the racks; an access floor provided at a lower part of the container for supplying a cooling air current to the racks through supply openings; and a distribution plate provided under the access floor to distribute an amount of the cooling air current that is supplied from under the access floor.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: July 28, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jin-Woo Park, Yong-Suk Choi
  • Publication number: 20200233252
    Abstract: A substrate having a spacer thereon and an optical device including the same are disclosed herein. In some embodiments, a substrate includes a base layer, a transparent column spacer formed on the base layer, and a black layer present between the transparent column spacer and the base layer. In some embodiments, an alignment film is present on the spacer.
    Type: Application
    Filed: January 24, 2020
    Publication date: July 23, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Nam Seok Bae, Seung Heon Lee, Song Ho Jang, Dong Hyun Oh, Jin Woo Park, Ji Young Hwang, Jung Sun You, Han Min Seo, Cheol Ock Song