Abstract: A method for detecting semiconductor-manufacturing conditions includes providing a photomask with a plurality of pattern areas each having a plurality of test lines with different pitches, exposing a plurality of wafer with the photomask in different manufacturing conditions, measuring the critical dimensions of the plurality of pattern areas, generating a library of relationships between the pitches and the critical dimension of the pattern areas, exposing a test wafer in an unknown manufacturing condition, finding out a relationships between the pitches and the critical dimension of the pattern areas of the test wafer, searching for a most similar relationship in the library, and detecting a set of manufacturing parameters used to expose the test wafer.

Abstract: An OPC method includes providing a primary mask having a primary pattern, forming an assist mask having a correction pattern substantially complementary to the primary pattern, and forming a reticle by overlapping the primary mask and the assist mask. The light transmittance of the correction pattern is adjustable so as to equalize the light intensity distribution of the primary mask.

Abstract: Automated extensible user interface testing supports testing of a user interface of a program. Test data is accessed, the test data including multiple test steps. Each test step describes at least a part of a test to be performed on the user interface. For each of the multiple test steps, one or more application program interface (API) methods to invoke to carry out the part of the test is determined. This determination is based at least in part on the test data and on an identification from the API of methods supported by the API. Each of the one or more API methods is then invoked to carry out the part of the test. Verification can be performed to ensure, for example, that specified files were created, or registry values were changed, or user interface elements appear and exist.

Abstract: An airpot beverage has a receptacle with an interior space capable of holding a liquid and a top opening near an upper edge of the receptacle. A lid assembly covers the top opening and has a lid cover, an actuator on the lid cover, and a lid bottom. The lid cover and the lid bottom together define an interior cavity within the lid assembly. A bellows housing is defined within the interior cavity and forms a chamber therein. A bellows is housed within the chamber and has a flexible sidewall substantially and closely surrounded by the bellows housing. The bellows is capable of being expanded and compressed. The bellows chamber can change in size to accommodate compression and expansion of the bellows.

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.

Abstract: The present invention relates to the field of communications, in particular, to a server for solving the problem related to the incompatibility between normal blades and multi-processing blades in a conventional server. The server according to an embodiment of the invention includes a backboard, on which backboard wiring and a first slot are disposed. At least two second slots are further disposed on the backboard. Both a first interface configured to be connected to a normal blade and a second interface configured to be connected to a multi-processing blade are disposed on each of the second slots, the first interface being connected to a corresponding Cluster Switch interface disposed on the first slot via the backboard wiring, and the second interface being interconnected directly via the backboard wiring or being connected to a corresponding Symmetrical Multi-Processing Switch interface disposed on the first slot via the backboard wiring.

Abstract: Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved.

Abstract: Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.

Abstract: Disclosed herein is a method of bonding solder pads of a flip-chip package. This invention relates to a method of bonding solder pads having different sizes to each other, when a bonding operation is executed between a chip and a PCB, between chips, or between PCBs. On a side having a larger solder pad, a general solder ball is used. Conversely, on a side having a smaller solder pad, a solder ball having a core is used. The core serves to maintain a predetermined interval between the chip and the PCB or between the chips, after the bonding operation has been completed. The solder bonded parts are aligned with each other so as to perform a final bonding operation. In a conventional flip-chip package, solder pads provided on a bonded part must have the same or similar size. According to this invention, even if the size difference between the solder pads is large, bonding is possible, thus ensuring electrical and mechanical reliability.

Abstract: A plasma source is designed with a starting rod to reduce target vapor shielding. A curve ion duct has reverse thorns on its inner wall to filter macroparticles in plasma. The curve ion duct has duct segments and each duct segment has an individual electricity. The present invention increases ion amount, acquires a film through high energy ions, and obtains enhanced film adhesion and film quality.

Abstract: An optical device. A lens module is movably disposed in a lens housing. A drive mechanism is connected to the lens module, driving the lens module along an optical axis of the lens module. A brake mechanism is disposed between the lens housing and the lens module and moves perpendicular to the optical axis, fixing and releasing the lens module. When the brake mechanism releases the lens module, the lens module moves along the optical axis.

Abstract: The invention discloses a data organization method for a change oriented spreadsheet application. In one embodiment, the valid updates to cells and the update times are stored with the cell positions as the primary index, and the valid updates to the same cell are arranged in the order of time. In another embodiment, the valid updates to cells are stored with the update time points of the valid updates of the cells as the primary index, and all the valid updates at the same valid update time point are arranged into an update table, the update table having the same cell structure as the spreadsheet file. In yet another embodiment, data structures organized in both manners are maintained at the same time.

Abstract: An actuator including at least one moving body, at least one fixed body and a connecting member is provided. The moving body is suitable for moving along a direction, and includes at least one coil. In addition, the fixed body includes a permanent magnet and a yoke, wherein the coil is disposed between the permanent magnet and the yoke, and the polarity direction of the permanent magnet is parallel to the moving direction of the moving body. Furthermore, the connecting member is used for connecting the moving body and the fixed body. The actuator meets the requirements of miniaturization, low power consumption and low cost.

Abstract: An optical device. A drive moving assembly includes a lens module and a drive coil. The drive coil surrounds the lens module and provides a central axis parallel to an optical axis of the lens module. A drive stator includes a housing, a magnetic member, and a yoke. The lens module is movably disposed in the housing. The magnetic member surrounds the drive coil and includes an opening. The yoke interacts with the magnetic member, generating a magnetic field. The magnetic member, yoke, and drive coil interact to move the drive moving assembly parallel to the optical axis. A brake coil is disposed in the opening. A braking resilient member is connected between the drive stator and the brake coil and disposed in the opening. The brake coil interacts with the magnetic member, yoke, and braking resilient member and detachably abuts the drive moving assembly.

Abstract: A storage structure for a microelectronic device including a chip which has completed all back-end-of-line (BEOL) processes and a solvent dissolvable polymer layer covering the surface of the chip. Since the surface of the chip is isolated from the external environment by the solvent dissolvable polymer layer, corrosion, discoloring or delamination of the chip can be avoided.

Abstract: Disclosed is a Fe-based bulk amorphous alloy composition which forms a bulk amorphous substance due to its excellent amorphous formability when it is cooled to a temperature lower than its glass transition temperature from the liquid state at a relatively low cooling rate of 1000 K/s or less, has high warm processability in a low temperature range owing to its supercooled liquid region of 20K or higher and has excellent fluidity in the liquid state and thereby good castability.

Abstract: Automated extensible user interface testing supports testing of a user interface of a program. Test data is accessed, the test data including multiple test steps. Each test step describes at least a part of a test to be performed on the user interface. For each of the multiple test steps, one or more application program interface (API) methods to invoke to carry out the part of the test is determined. This determination is based at least in part on the test data and on an identification from the API of methods supported by the API. Each of the one or more API methods is then invoked to carry out the part of the test. Verification can be performed to ensure, for example, that specified files were created, or registry values were changed, or user interface elements appear and exist.

Abstract: An optical receiver for enhanced optical power sensitivity for optical signal at 10 Gbps includes an optical package and a supporting electrical circuitry. The optical package includes a semiconductor optical amplifier to pre-amplify the incoming weak signal, a tunable optical filter to suppress the spontaneous noise of the amplifier and a PIN diode as an optical detector. A supporting electrical circuitry includes a control loop for the filter to track the peak of the optical signal. By optimizing the parameters of all the elements, the final sensitivity of the optical receiver can be increased significantly. The device may be realized in a single package.

Abstract: A method for detecting semiconductor-manufacturing conditions includes providing a photomask with a plurality of pattern areas each having a plurality of test lines with different pitches, exposing a plurality of wafer with the photomask in different manufacturing conditions, measuring the critical dimensions of the plurality of pattern areas, generating a library of relationships between the pitches and the critical dimension of the pattern areas, exposing a test wafer in an unknown manufacturing condition, finding out a relationships between the pitches and the critical dimension of the pattern areas of the test wafer, searching for a most similar relationship in the library, and detecting a set of manufacturing parameters used to expose the test wafer.

Abstract: The present invention is to produce an aluminum nitride powder which is turned into a sintered body at a temperature of not more than 1600° C., thereby obtaining a sintered aluminum nitride in which the density and thermal conductivity are high and which can be properly used as a substrate material. Using a vapor phase reaction apparatus shown in FIG. 1, ammonia gas was fed from a reactor 2 heated at from 300 to 500° C. and maintained at that temperature by a heating section 1 via a feeding tube 4 while being regulated by a flow regulator 3. At the same time, while being regulated by the flow regulator 5, nitrogen gas containing an organic aluminum compound is fed via a feeding tube 6 to obtain an aluminum nitride powder. The aluminum nitride powder is subjected to a heat treatment at from 1100 to 1500° C. in a reducing gas atmosphere and/or an inert gas atmosphere to obtain an aggregate aluminum nitride powder.