Patents by Inventor Jing-Cheng Lin

Jing-Cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981990
    Abstract: The invention provides a deposition equipment with a shielding mechanism, which includes a reaction chamber, a carrier, a cover ring and a shielding mechanism. The shielding mechanism includes a first bearing arm, a second bearing arm, a first shielding plate and a second shielding plate. The first and second shielding plates are respectively placed on the first and second bearing arms. There are corresponding alignment units between the lower surface of the first and second shielding plates and the upper surface the carrier, so that the first and second shielding plates can be aligned with the carrier. There is also a corresponding alignment unit between the upper surface of the first and second shielding plates and the lower surface the cover ring, so that the cover ring can be aligned with the first and second shielding plates to define a cleaning space in the reaction chamber.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: May 14, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Yu-Te Shen
  • Publication number: 20240148999
    Abstract: A patient interface including a plenum chamber, a first seal-forming structure for forming a seal around the patient's mouth, and a second seal-forming structure for forming a seal around the patient's nares. The patient interface further includes at least one stopper rib disposed in the cavity of the plenum chamber spaced apart from the first seal-forming structure in a rest position. The first seal-forming structure configured to contact the at least one stopper rib in an operational position. The at least one stopper rib configured to oppose compression of the first seal-forming structure in an anterior direction. The second seal-forming structure is not configured to contact the at least one stopper rib.
    Type: Application
    Filed: March 9, 2022
    Publication date: May 9, 2024
    Inventors: Marvin Sugi HARTONO, Kyi Thu MAUNG, Lik Tze SEET, Jing CHEN, Beng Hai TAN, Han Cheng LIN, Chuan Foong LEE, Xiang Yu ONG, Shiva Kumar SHANMUGA SUNDARA, Hugh Francis Stewart THOMAS, Sebastien DEUBEL, Chee Keong ONG, Andrew James BATE, Matthew Robin WELLS, Paul Derrick WATSON, Shannon William PRIOR
  • Patent number: 11972936
    Abstract: A thin-film-deposition equipment with shielding device, which includes a reaction chamber, a carrier, a shielding device and two optical sensors. The carrier and a portion of the shielding device are disposed within the reaction chamber. The shielding device includes two shield members, and at least one driver interconnecting to drive the two shield members to sway in opposite directions and switch between an open state and a shielding state. Each of the two shield members is disposed with a shield protrusion and a sensing region adjacent to each other. The shield protrusion is for shielding the sensing region from contaminants, thereby the optical sensors can accurately detect locations of the shield members.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 30, 2024
    Assignee: SKY TECH INC.
    Inventor: Jing-Cheng Lin
  • Publication number: 20240136298
    Abstract: A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
  • Patent number: 11961724
    Abstract: The present disclosure provides a thin-film-deposition equipment with shielding device, which includes a reaction chamber, a carrier and a shielding device, wherein a portion of the shielding device and the carrier are disposed within the reaction chamber. The shielding device includes a first-shield member, a second-shield member and a driver. The driver interconnects the first-shield member and the second-shield member, for driving the first-shield member and the second-shield member to move in opposite directions. During a deposition process, the driver swings the shield members away from each other into an open state. During a cleaning process, the driver swings the shield members toward each other into a shielding state for covering the carrier, such that to prevent polluting the carrier during the process of cleaning the thin-film-deposition equipment.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 16, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Yu-Te Shen
  • Patent number: 11961753
    Abstract: A substrate-bonding device includes a carrier, three first aligning units, three second aligning units, a pressing plate, and two flat-edge aligners. A carrying surface of the carrier is provided with a placement area for placing a first substrate provided with a flat edge thereon. The first aligning units, the second aligning units and the flat edge aligners are disposed around the placement area. The first aligning units are configured to align the first substrate and to support a second substrate provided with a second flat edge. The second aligning units are configured to align the second substrate. The flat edge aligners are configured to contact the first and the second flat edges, to position and align the first and the second substrates. The pressing plate is disposed to face the placement area for pressing the first and second substrates. The flat edge aligners move along with the pressing plate.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: April 16, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Jung-Hua Chang, Mao-Chan Chang
  • Patent number: 11952662
    Abstract: Disclosed is a powder atomic layer deposition equipment with a quick release function, comprising a vacuum chamber, a shaft sealing device, and a driving unit connected to the shaft sealing device. The vacuum chamber is connected to the shaft sealing device, and an enclosed space is formed between the vacuum chamber and the shaft sealing device. At least one air extraction line is located in the shaft sealing device and fluidly connected to the enclosed space, the air extraction line being used in pumping gas out from the enclosed space to fix the vacuum chamber to the shaft sealing device so that the drive unit rotates the vacuum chamber via the shaft sealing device to facilitate the formation of a uniform thin film on powder surface. When the pumping stops, the vacuum chamber can be quickly released from the shaft sealing device to improve the process efficiency and convenience of use.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 9, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Jung-Hua Chang, Chia-Cheng Ku
  • Patent number: 11955459
    Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20240105632
    Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun Ren Lai, Yung-Chi Lin
  • Publication number: 20240096816
    Abstract: A semiconductor device has a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or else have a overlap count of less than two. In another embodiment the mark is formed using a wobble scan methodology. By forming marks as described, defects from the marking process may be reduced or eliminated.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
  • Publication number: 20240096642
    Abstract: Some embodiment structures and methods are described. A structure includes an integrated circuit die at least laterally encapsulated by an encapsulant, and a redistribution structure on the integrated circuit die and encapsulant. The redistribution structure is electrically coupled to the integrated circuit die. The redistribution structure includes a first dielectric layer on at least the encapsulant, a metallization pattern on the first dielectric layer, a metal oxide layered structure on the metallization pattern, and a second dielectric layer on the first dielectric layer and the metallization pattern. The metal oxide layered structure includes a metal oxide layer having a ratio of metal atoms to oxygen atoms that is substantially 1:1, and a thickness of the metal oxide layered structure is at least 50 ?. The second dielectric layer is a photo-sensitive material. The metal oxide layered structure is disposed between the metallization pattern and the second dielectric layer.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Jing-Cheng Lin, Cheng-Lin Huang
  • Patent number: 11935866
    Abstract: A semiconductor device includes a first substrate and a second substrate. The semiconductor device includes a plurality of conductive pillars between the first and second substrates. The plurality of conductive pillars includes a first conductive pillar having a first width, wherein the first width is substantially uniform along an entire first height of the first conductive pillar, a second conductive pillar having a second width, wherein the second width is substantially uniform along an entire second height of the second conductive pillar, the first width is different from the second width, and the entire first height is equal to the entire second height, and a third conductive pillar having a third width, wherein the third width is substantially uniform along an entire third height of the third conductive pillar, and the third conductive pillar is between the first conductive pillar and the second conductive pillar in the first direction.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai
  • Publication number: 20240087954
    Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: JING-CHENG LIN, YING-CHING SHIH, PU WANG, CHEN-HUA YU
  • Patent number: 11929242
    Abstract: The present disclosure provides a shielding mechanism and a thin-film-deposition equipment using the same, wherein the shielding mechanism includes two shield members and a driver. The driver includes a motor and a shaft seal. The motor interconnects the two shield members via the shaft seal, and such that to drive the two shield members to sway in opposite directions and to switch between an open state and a shielding state. Furthermore, each of the two shield members is formed with at least one cavity, for reducing weights thereof and loading of the motor and the driver.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: March 12, 2024
    Assignee: SKY TECH INC.
    Inventor: Jing-Cheng Lin
  • Publication number: 20240079381
    Abstract: A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film has a concave upper surface facing the first ground bump.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Inventors: Chen-Hua YU, An-Jhih SU, Jing-Cheng LIN, Po-Hao TSAI
  • Publication number: 20240068089
    Abstract: The invention provides a deposition equipment with a shielding mechanism, which includes a reaction chamber, a carrier, a cover ring and a shielding mechanism. The shielding mechanism includes a first bearing arm, a second bearing arm, a first shielding plate and a second shielding plate. The first and second shielding plates are respectively placed on the first and second bearing arms. There are corresponding alignment units between the lower surface of the first and second shielding plates and the upper surface the carrier, so that the first and second shielding plates can be aligned with the carrier. There is also a corresponding alignment unit between the upper surface of the first and second shielding plates and the lower surface the cover ring, so that the cover ring can be aligned with the first and second shielding plates to define a cleaning space in the reaction chamber.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: JING-CHENG LIN, YU-TE SHEN
  • Publication number: 20240060182
    Abstract: The present invention is a wafer carrier with adjustable aligning devices, which is suitable for a deposition machine. The wafer carrier comprises a tray and a plurality of adjustable aligning devices. The adjustable alignment devices are located around the tray, and include a base and an alignment pin. The adjustable alignment devices are configured to align a clamp ring of the deposition machine. The alignment pin is connected to the tray through the base, wherein the alignment pins and the bases are able to move relative to the tray to adjust the position of the alignment pins. Further, an alignment fixture can be placed on the wafer carrier to position the adjustable alignment devices around the tray, and adjust the alignment pins to preset positions, which is beneficial to improve the accuracy of alignment of the clamp ring.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 22, 2024
    Inventors: JING-CHENG LIN, YU-TE SHEN
  • Patent number: 11901302
    Abstract: A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
  • Patent number: 11898238
    Abstract: The present disclosure provides a thin-film-deposition equipment with shielding device, which includes a reaction chamber, a carrier and a shielding device. The shielding device includes a first-shield member, a second-shield member and a driver. The first-shield member has a first-inner-edge surface disposed with a protrusion. The second-shield member has a second-inner-edge surface disposed with a cavity. The driver interconnects and drives the first-shield member and the second-shield member to sway in opposite directions. During a cleaning process, the driver swings the shield members toward each other into a shielding state for covering the carrier, such that to prevent polluting the carrier during the process of cleaning the thin-film-deposition equipment.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: February 13, 2024
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Yu-Te Shen
  • Patent number: 11891694
    Abstract: An atomic-layer-deposition equipment, includes a reaction chamber, a carrier, a coverage mechanism and a dispensing unit. The carrier and the dispensing unit are disposed within a containing space of the reaction chamber. The coverage mechanism includes a connecting shaft and a cover plate, wherein the cover plate is disposed within the containing space and faces the carrier, the connecting shaft is connected to the cover plate and extends through the reaction chamber. The carrier is configured to carry a substrate assembly and move the substrate assembly with respect to the coverage mechanism, so as to allow the cover plate contacting a top surface of the substrate assembly. When the cover plate contacts the top surface of the substrate assembly, the dispensing unit surrounds the substrate assembly and dispenses a precursor to a lateral surface of the substrate assembly, so as to form a protective layer thereon.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: February 6, 2024
    Assignee: SKY TECH INC.
    Inventor: Jing-Cheng Lin