Patents by Inventor Jing Cheng

Jing Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230382065
    Abstract: A method for producing embedded hydrogel contact lenses comprises at least the following steps: obtaining an insert made of a crosslinked polymeric material comprising repeating units of a free-radical photoinitiator; placing the insert in a female lens mold half; dosing an amount of a lens-forming composition to immerse the insert in the female lens mold half; closing tightly a male lens mold half onto the top of the female lens mold half halves to form a molding assembly; actinically curing both the lens-forming composition in the molding assembly to form an embedded hydrogel lens precursor which comprises a bulk hydrogel material formed the lens-forming composition and the insert that is embedded therein and covalently linked to the bulk hydrogel material.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 30, 2023
    Inventors: Jing Cheng, Michelle Plavnik, Ya-Wen Chang, Feng Jing, Steve Yun Zhang
  • Publication number: 20230376748
    Abstract: A method for a self-adaptive service function chain mapping based on a deep reinforcement learning, comprising: establishing an SFC mapping model, dividing an SFC mapping process into a three-layer structure, and representing the structure with abstract parameters; building an SFCR mapping learning neural network, and mapping the abstract parameters to a state, an action and a reward value in the SFCR mapping learning neural network; establishing an empirical playback pool and updating network parameters; summarizing request rates and utilization rates of different VNFs, a number of currently deployed VNFs and a number of unactivated VNFs based on data in the empirical playback pool; and designing a VNF redeployment strategy, and redeploying the VNFs according to the summarized data. The method has good self-adaptability, and can improve the effective service cost rate and the request mapping rate for processing service requests from users in different time periods.
    Type: Application
    Filed: September 19, 2022
    Publication date: November 23, 2023
    Applicant: Zhengzhou University of Light Industry
    Inventors: Erlin TIAN, Wanwei HUANG, Jing CHENG, Zuhe LI, Xiao ZHANG, Weide LIANG, Song LI
  • Publication number: 20230365760
    Abstract: A method for preparing a multifunctional hydrogel by yeast fermentation is provided. According to the present disclosure, graphene oxide is reduced by polydopamine to obtain a reduced graphene oxide solution first, and then a certain concentration of a gelatin-PCA-glucose mixed solution and an activated yeast liquid are prepared. The three solutions are uniformly mixed and stirred by a one pot reaction method, poured into a mold, and subjected to fermentation in a 30° C. water bath for a certain period of time, so as to obtain a Gel-PrGO-PCA-yeast multifunctional hydrogel material. The method is simple, convenient, rapid, and efficient. The obtained hydrogel has good air permeability, superior mechanical properties, electrical conductivity, and biocompatibility, and can be applied to different skin locations to achieve electrocardiograph and electromyographic detection.
    Type: Application
    Filed: August 18, 2022
    Publication date: November 16, 2023
    Applicant: FUZHOU UNIVERSITY
    Inventors: Shaoyun WANG, Jing CHENG, Lijun YOU, Caihua XIONG, Qianqian CAI, Xuan CHEN
  • Publication number: 20230366090
    Abstract: A method for a deposition apparatus is disclosed. The deposition apparatus includes a chamber, a substrate carrier, a blocker and a cover ring. The cover ring is disposed on the blocker. The substrate carrier carries a wafer and moves with respect to the blocker. A position where the substrate carrier contacts the cover ring start is defined as a contact position, and a first position below the contact position and a second position above the contact position are also defined. When the reaching the first position, a movement speed of the substrate carrier is decreased, and the substrate carrier carries the cover ring to move away from the blocker. When reaching the second position, the movement speed of the substrate carrier away from the blocker is increased. Collision between the wafer and the deposition apparatus is eliminated to prevent undesired particles from occurring and the wafer from being damaged.
    Type: Application
    Filed: May 11, 2022
    Publication date: November 16, 2023
    Inventor: JING-CHENG LIN
  • Patent number: 11817437
    Abstract: A method includes forming an under bump metallization (UBM) layer over a dielectric layer, forming a redistribution structure over the UBM layer, disposing a semiconductor device over the redistribution structure, removing a portion of the dielectric layer to form an opening to expose the UBM layer, and forming a conductive bump in the opening such that the conductive bump is coupled to the UBM layer.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: November 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jing-Cheng Lin, Po-Hao Tsai
  • Publication number: 20230362095
    Abstract: A method for intelligent traffic scheduling based on deep reinforcement learning, comprising: collecting flows in a data center network topology in real time, and dividing the flows into elephant flow or mice flow according to different types of flow features; establishing traffic scheduling models with energy saving and performance of the elephant flow and the mice flow as targets for joint optimization; establishing a DDPG intelligent routing traffic scheduling framework based on CNN improvement, and performing environment interaction; jointly inputting the three state messages as a state set into the CNN for training; setting an action as a comprehensive weight of energy saving and performance of each path under the condition of uniform transmission of flows in time and space, and selecting transmission paths for the elephant flow or the mice flow according to the weight; and designing reward value functions for the elephant flow and the mice flow.
    Type: Application
    Filed: September 14, 2022
    Publication date: November 9, 2023
    Applicant: Zhengzhou University of Light Industry
    Inventors: Erlin TIAN, Wanwei HUANG, Qiuwen ZHANG, Jing CHENG, Xiao ZHANG, Weide LIANG, Xiangyu ZHENG
  • Publication number: 20230352323
    Abstract: A parallelism-adjustable bonding machine includes a first chamber, a second chamber, a press-bonding unit, a carrier and plural parallelism-adjusting units. The first chamber is configured to connect to the second chamber, so as to define a closed space therebetween. The press-bonding unit is disposed within the first chamber, and the carrier is disposed within the second chamber. The press-bonding unit is disposed to face the carrier configured to press and bond substrates placed on the carrier. Each of the parallelism-adjusting units is disposed on the first chamber, and includes an adjustment shaft extending through the first chamber and connected to the press-bonding unit. The adjustment shaft includes an adjustment member located outside the first chamber and the closed space. A user is able to adjust a parallelism between the press-bonding unit and the carrier in an efficient and precise manner, from the adjustment member.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventors: JING-CHENG LIN, JUNG-HUA CHANG, MAO-CHAN CHANG
  • Publication number: 20230350100
    Abstract: The invention provides a method for making silicone hydrogel contact lenses in a relatively efficient and consistent manner from a lens formulation (i.e., a polymerizable composition) including a thermal initiator having a 10-hour half-life temperature (T10h?) under a controlled thermal curing scheme. A method of the invention comprises a step of curing the lens formulation in an oven according to a thermal curing profile that comprises or consists essentially of increasing the oven's temperature from room temperature or a temperature that is at least about 5° C. lower than T10h? to a temperature that is at least 30° C. higher than T10h? at a selected rate (e.g., from about 1° C./minute to about 10° C./minute). Under such a controlled thermal curing scheme, the lens diameter of the fully-hydrated silicone hydrogel contact lenses obtained according to a method of the invention does not vary significantly with the positions of the molds in the oven.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 2, 2023
    Inventors: Lisa Nicole Hutfluss, Jing Cheng, Feng Jing, Steve Yun Zhang, Michelle Plavnik
  • Publication number: 20230339149
    Abstract: A method for producing embedded hydrogel contact lenses comprises at least the following steps: obtaining an insert made of a crosslinked polymeric material comprising iniferter moieties covalently attached thereto; placing the insert in a female lens mold half; dosing an amount of a lens-forming composition to immerse the insert in the female lens mold half; closing tightly a male lens mold half onto the top of the female lens mold half halves to form a molding assembly; curing the lens-forming composition in the molding assembly to form an embedded hydrogel lens precursor which comprises a bulk hydrogel material formed the lens-forming composition and the insert that is embedded therein and covalently linked to the bulk hydrogel material.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 26, 2023
    Inventors: Jing Cheng, Feng Jing, Steve Yun Zhang
  • Patent number: 11791241
    Abstract: Methods for forming a semiconductor device structure are provided. The method includes forming a conductive feature in a first wafer, and forming a first bonding layer over the conductive feature. The method includes forming a second bonding layer over a second wafer, and bonding the first wafer and the second wafer by bonding the first bonding layer and the second bonding layer. The method also includes forming a second transistor in a front-side of the second wafer, and after forming the second transistor in the front-side of the second wafer, forming a first TSV through the second wafer, wherein the first TSV stops at the conductive feature.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: October 17, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Jing-Cheng Lin
  • Patent number: 11784094
    Abstract: The present disclosure provides a laser lift-off method for separating substrate and semiconductor-epitaxial structure, which includes: providing at least one semiconductor device, wherein the semiconductor device includes a substrate and at least one semiconductor-epitaxial structure disposed in a stack-up manner; irradiating a laser onto an edge area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the edge area; and pressing against the edge area of the semiconductor device vis a pressing device, then irradiating the laser onto an inner area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the inner area wherein gas is generated during separating the portions of the substrate and the semiconductor-epitaxial structure in the inner area and evacuated from the edge area, to prevent damage of the semiconductor-epitaxial structure during the separating process.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: October 10, 2023
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Tsung-Hua Hsieh
  • Patent number: 11773319
    Abstract: The present disclosure provides a quantum dot particle with passivation layer, which mainly includes a one quantum dot (QD) particle, a first-passivation layer and a second-passivation layer, wherein the first-passivation layer is disposed on a surface of the QD particle, and the second-passivation layer is disposed on a surface of the first-passivation layer. A precursor chosen for forming the first-passivation layer does not cause damage to the QD particle. A precursor of the second-passivation layer includes a composition of trimethylaluminum (TMA) and water, or TMA and ozone, wherein a density of the second-passivation layer is greater than that of the first-passivation layer. The precursor of the second-passivation layer is kept out by the first-passivation layer, such that to prevent the precursor of the second-passivation layer from contacting the QD particle and causing deterioration thereto, and hence to improve a life cycle of the QD particle.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: October 3, 2023
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Jung-Hua Chang
  • Patent number: 11776935
    Abstract: An integrated fan out package on package architecture is utilized along with a reference via in order to provide a reference voltage that extends through the InFO-POP architecture. If desired, the reference via may be exposed and then connected to a shield coating that can be used to shield the InFO-POP architecture. The reference via may be exposed by exposing either a top surface or a sidewall of the reference via using one or more singulation processes.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: October 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai
  • Publication number: 20230304001
    Abstract: The present disclosure provides methods and compositions of modulating expression of a target nucleic acid sequence in a cell. The method comprises introducing into the cell a nucleic acid sequence encoding a Cas9 fusion protein and a guide RNA, wherein the Cas9 fusion protein and the guide RNA are expressed and co-localize at a target site and modulate the expression of the target nucleic acid sequence.
    Type: Application
    Filed: April 25, 2023
    Publication date: September 28, 2023
    Inventors: Suhani D. Vora, Alejandro Chavez, Jing Cheng, Benjamin W. Pruitt
  • Publication number: 20230308374
    Abstract: A method includes receiving, by a network management system, network data from a plurality of network devices configured to provide a network at a site; receiving, by the processing circuitry, user impact data from a plurality of client devices that access the network at the site; determining, based on the network data, a pattern of one or more network events occurring over time; correlating in time the pattern of the one or more network events to an adverse user impact event indicated by the user impact data received from the plurality of client devices; and determining, in response to the correlating, an instance of overwhelming network traffic having an adverse user impact. In some examples, the network data includes network traffic impact data, such as a number of packets dropped at a switch port due to congestion.
    Type: Application
    Filed: July 14, 2022
    Publication date: September 28, 2023
    Inventors: Jisheng Wang, Jing Cheng, Abhiram Madhugiri Shamsundar, Randall Frei
  • Patent number: 11767591
    Abstract: A detachable atomic layer deposition apparatus for powders is disclosed, which includes a vacuum chamber, a shaft sealing device, and a driving unit. The driving unit is connected to the shaft sealing device. The vacuum chamber is fixed to one end of the shaft sealing device via at least one fixing member. The driving unit drives the vacuum chamber to rotate via the shaft sealing device to agitate the powders in a reaction space of the vacuum chamber to facilitate the formation of thin films with uniform thickness on the surface of the powders. In addition, the vacuum chamber can be removed from the shaft sealing device for users to take out the powders from the vacuum chamber and clean the vacuum chamber, thereby improving the convenience in usage.
    Type: Grant
    Filed: May 30, 2021
    Date of Patent: September 26, 2023
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Jung-Hua Chang, Chia-Cheng Ku
  • Publication number: 20230295802
    Abstract: The invention provides a vibrating deposition device, which includes a vacuum chamber, a fixed rod and a powder tank. The vacuum chamber includes an inner side surface, and a plurality of bulges and notches are arranged on the inner side surface. The fixed rod and the powder tank are arranged in an accommodating space of the vacuum chamber, wherein the powder tank is used for accommodating powders and contacts the inner side surface of the vacuum chamber through a protruding unit. When the vacuum chamber rotates, the protruding unit will be displaced between the bulge and the notch, and the powder tank will be displaced up and down relative to the vacuum chamber to vibrate powders in the powder tank, so that a uniform film will be formed on the surface of powders.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventor: JING-CHENG LIN
  • Patent number: 11764139
    Abstract: A semiconductor device includes a substrate, a first redistribution layer (RDL) over a first side of the substrate, one or more semiconductor dies over and electrically coupled to the first RDL, and an encapsulant over the first RDL and around the one or more semiconductor dies. The semiconductor device also includes connectors attached to a second side of the substrate opposing the first side, the connectors being electrically coupled to the first RDL. The semiconductor device further includes a polymer layer on the second side of the substrate, the connectors protruding from the polymer layer above a first surface of the polymer layer distal the substrate. A first portion of the polymer layer contacting the connectors has a first thickness, and a second portion of the polymer layer between adjacent connectors has a second thickness smaller than the first thickness.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: September 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai
  • Patent number: 11756802
    Abstract: A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai
  • Publication number: 20230274446
    Abstract: A method for measuring humidity at long range using simplified equipment includes creating a formula according to a relationship between multiple sets of known optical flow feature vectors and a known humidity. First and second images are obtained, wherein the first image and the second image are captured as being in the same range of capture. A plurality of feature points in the first image is obtained and an optical flow feature vector for each of the feature points according to apparent changes in position of each feature point according to the second image are calculated. The degree of current humidity according to the optical flow feature vectors and the formula is thus obtained.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Inventors: JU-LAN LU, JING-CHENG TANG