Patents by Inventor Jinqiang (Jeff) Wang

Jinqiang (Jeff) Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for allocating SPI values
    Patent number: 11075949
    Abstract: Certain embodiments described herein are generally directed to allocating security parameter index (“SPI”) values to a plurality of endpoints in a network. The SPI values may be derived using an SPI derivation formula and a plurality of parameters. In some embodiments, the SPI values may be derived by an endpoint and in other embodiments by a server. Using the SPI derivation formula and the plurality of parameters enables endpoints and servers to instantaneously derive SPI values without the need for servers to store them.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 27, 2021
    Assignee: Nicira, Inc.
    Inventors: Amit Chopra, Chen Li, Ganesan Chandrashekhar, Jinqiang Yang, Sanal Pillai, Bin Qian
  • COATING COMPOSITIONS FOR IMPROVING APPEARANCE OF A MONO-COLOR WHITE PAINT AND ARTICLES COATED THEREWITH
    Publication number: 20210189169
    Abstract: A coating composition comprises 10-20 wt % of polyester resin, 2-8 wt % of amino resin, and 0-6 wt % of acrylic resin, based on the total weigh of the coating composition. A substrate coated with the coating composition is also provided.
    Type: Application
    Filed: April 17, 2018
    Publication date: June 24, 2021
    Applicant: PPG Coatings (Tianjin) Co., Ltd.
    Inventors: Weijie Si, Nan Lv, Jinqiang Wang
  • CORE-SHELL MICRONEEDLE PATCH FOR H2O2 AND PH CASCADE-TRIGGERED INSULIN DELIVERY
    Publication number: 20210186865
    Abstract: Disclosed are compositions and methods for microneedle patches comprising diblock copolymer micelles designed for pH cascade and H2O2 triggered insulin delivery.
    Type: Application
    Filed: October 10, 2018
    Publication date: June 24, 2021
    Inventors: Zhen GU, Jinqiang WANG
  • Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
    Patent number: 11032915
    Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: June 8, 2021
    Assignee: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
  • High power and high insulation performance relay for solar photovoltaic inverter
    Patent number: 11031201
    Abstract: A high power and high insulation performance relay for a solar photovoltaic inverter includes a base, a coil, an iron core, an armature part, a yoke iron, a movable spring and a stationary spring. The armature part includes a connecting piece as one side of the armature part, an armature as the other side of the armature part, and a plastic member; the armature and the connecting piece are connected with the plastic member respectively and are insulated and isolated; the plastic member is provided with at least one groove or rib; the stationary spring includes a stationary reed which includes a first coupling part for fixing a stationary contact, a second coupling part used as a lead-out pin, and a bending part between the both: the bending part is located outside of a base plate of the base when the stationary reed is mounted on the base.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 8, 2021
    Assignee: Xiamen Hongfa Electroacoustic Co., Ltd.
    Inventors: Feifei Fu, Jinqiang Liu, Zhonghua Tan, Yiqing Zhu
  • Fiber optic connector
    Patent number: 11029473
    Abstract: A fiber optic connector is provided. The fiber optic connector includes a housing, a ferrule received in the housing, and an arc-shaped tail tube. The arc-shaped tail tube is secured to a rear end of the housing and includes a ring end portion and a main body. The ring end portion is connected to the rear end, while the main body extends from the ring end portion away from the housing.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: June 8, 2021
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Zhang Jinqiang, Zhao Liqi, Wu Xifei
  • BACK PLATE ASSEMBLY AND ELECTRONIC DEVICE
    Publication number: 20210143083
    Abstract: A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 13, 2021
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Jiefeng Zhang, Zhiqiang Li, Biaobing Lv, Guoxiao Shen, Wei Zhao, Jinqiang Wang
  • Loading Assembly
    Publication number: 20210045254
    Abstract: A loading assembly includes a base plate configured to support a circuit board placed thereon, a pressing plate configured to press an electrical member on the circuit board, and a first connection assembly connecting the pressing plate to the base plate and pressing the electrical member on the circuit board through the pressing plate. The first connection assembly includes a first nut fixed on the base plate, a first bolt passing through the pressing plate and screwed to the first nut, and a first spring sleeved on the first bolt and compressed between a head of the first bolt and the pressing plate. A first locking part is formed on the first bolt. The first locking part is pressed against an end face of the first nut when the first bolt is screwed to an installation position to prevent the first bolt from being rotated relative to the first nut.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 11, 2021
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics AMP Qingdao Ltd
    Inventors: Jiefeng Zhang, Zhiqiang Li, Jianfeng Wang, Guoxiao Shen, Wei Zhao, Jinqiang Wang
  • APPARATUS AND METHOD FOR PROVIDING MEASUREMENT INFORMATION
    Publication number: 20210029574
    Abstract: An apparatus and a method for providing measurement information are provided. The method for providing measurement information of a user equipment (UE) includes measuring an uplink duty cycle percentage within a measurement duration, wherein the measurement duration is one of a configuration duration form a network node, a default duration, and a pre-defined duration, and reporting a maximum uplink duty cycle percentage according to a measured uplink duty cycle percentage within the measurement duration.
    Type: Application
    Filed: October 15, 2020
    Publication date: January 28, 2021
    Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Zhi ZHANG, Jinqiang Xing
  • SUBSTITUTED PYRIMIDINE COMPOUND AND PREPARATION METHOD AND USE THEREOF
    Publication number: 20210015100
    Abstract: The present invention discloses a substituted pyrimidine compound. The structure is shown in general formula I. The definition of each substituent in the formula is described in the description. The compound of the present invention has broad-spectrum fungicidal, insecticidal and acaricidal activity, and has excellent control effects on cucumber downy mildew, powdery mildew, corn rust, anthrax, rice blast, aphids, Tetranychus cinnabarinus and the like.
    Type: Application
    Filed: November 22, 2018
    Publication date: January 21, 2021
    Applicant: SHENYANG SINOCHEM AGROCHEMICALS R&D CO., LTD.
    Inventors: Aiying GUAN, Miao LI, Junfeng WANG, Leichuan XU, Qin SUN, Xufeng SUN, Jinqiang SUN, Changling LIU
  • MAGNETIC LATCHING RELAY
    Publication number: 20210012989
    Abstract: A magnetic latching relay includes a base, a magnetic circuit portion, a pushing card and a contact portion; the base is provided with a first blocking wall to divide the base into an upper cavity and a lower cavity, the magnetic circuit portion and the contact portion are installed in the upper cavity and the lower cavity respectively; an iron core, two yokes and a magnetic steel of the magnetic circuit portion are formed an E-shaped magnetic conductive structure with a 90 degrees side turn; the middle position of an armature is rotatably supported above the magnetic steel, two ends of the armature respectively correspond to the tops of the two yokes; an upper end of the pushing card is connected to one end of the armature, and a lower end of the pushing card is connected to a free end of a movable spring of the contact portion.
    Type: Application
    Filed: June 24, 2020
    Publication date: January 14, 2021
    Inventors: Jinghuang Lin, Yiqing Zhu, Zhonghua Tan, Jinqiang Liu, Zhengji Lin
  • Fiber optic connector
    Patent number: 10877221
    Abstract: A fiber optic connector comprises an outer housing, an inner housing installed in the outer housing, a fiber optic ferrule accommodated in the inner housing, an optical cable inserted into the inner housing and connected to the fiber optic ferrule, an elastic boot that is wrapped around both a connecting portion of the fiber optic ferrule connecting to the optical cable and a portion of the optical cable adjacent to the connecting portion, and a sealing structure. The sealing structure is disposed between a rear end portion of the outer housing and the elastic boot to provide a seal between the outer housing and the elastic boot.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: December 29, 2020
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Haibo Zhang, Zhigang Song, Jinqiang Zhang, Zhiyun Zhong
  • CHARGE-SWITCHABLE POLYMERIC DEPOT FOR GLUCOSE-TRIGGERED INSULIN DELIVERY WITH ULTRAFAST RESPONSE
    Publication number: 20200360269
    Abstract: A composition comprising a glucose-responsive charge-switchable polymer is described. In the absence of glucose or under normoglycemic conditions, the positively charged polymer can be complexed with negatively charged therapeutic agents, such as insulin. Under hyperglycemic conditions, the positive charge of the polymer is reduced, and the polymer/therapeutic agent complex can disassemble, allowing the therapeutic agent to be released. Pharmaceutical compositions, nanoparticles, and microneedle arrays of the polymer and/or polymer/therapeutic agent complex and methods of treating diabetes are also described.
    Type: Application
    Filed: November 20, 2018
    Publication date: November 19, 2020
    Inventors: Zhen Gu, Jinqiang Wang
  • SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR
    Publication number: 20200344895
    Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 29, 2020
    Applicant: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
  • SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR
    Publication number: 20200329567
    Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Applicant: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
  • REFRIGERATOR DOOR BODY
    Publication number: 20200278147
    Abstract: A refrigerator door body comprises a door body frame and a glass panel attached to a front side of the door body frame. The door body frame comprises sheet metal frames located on two sides, end covers located on upper and lower sides, and connecting assemblies connecting the sheet metal frames to the end covers. The end cover is provided with a side flange and a covering edge located on an outer side of the side flange. After the end covers and the sheet metal frames are assembled, the side flange is fitted to an inner side of the sheet metal frame, and the covering edge is fitted to an outer side of the sheet metal frame, thereby ensuring that an end portion of the sheet metal frame is not easily eroded by moisture.
    Type: Application
    Filed: November 15, 2018
    Publication date: September 3, 2020
    Inventors: JINQIANG DOU, SHUFEI REN, MENG WANG, PENG WANG
  • METHOD FOR PREPARING AGONIST FOR IMPROVING BOAR SPERM MOTILITY
    Publication number: 20200270580
    Abstract: A method for preparing an agonist for improving boar sperm motility includes: (1) collecting and infiltrating a testicular tissue of a young boar 3-5 days after born; (2) washing the tissue with PBS; (3) incubating the tissue in a cell culture medium, and centrifuging the cell suspension to remove a supernatant; (4) adding hyaluronidase and collagenase IV followed by shaking, and adding the cell culture medium and centrifuging to remove a supernatant; (5) adding trypsin and deoxyribonuclease followed by shaking, and adding the cell culture medium; (6) filtering the cell suspension by a cell sieve; (7) centrifuging to remove a supernatant, and adding the cell culture medium; (8) culturing and passaging the cells; (9) culturing and storing the cell suspension. The invention has the advantages of good application effect, low cost and simple production process.
    Type: Application
    Filed: October 18, 2019
    Publication date: August 27, 2020
    Inventors: Huansheng DONG, Jinqiang CUI, Qingjie PAN, Jiaojiao HUANG
  • Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
    Patent number: 10757821
    Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: August 25, 2020
    Assignee: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
  • Opening locator
    Patent number: D896617
    Type: Grant
    Filed: December 23, 2018
    Date of Patent: September 22, 2020
    Inventor: Jinqiang Zhan
  • Multifunctional pet bowl
    Patent number: D919195
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: May 11, 2021
    Inventor: Jinqiang Tan