Patents by Inventor Jiun-Rong Pai

Jiun-Rong Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250230851
    Abstract: An apparatus is provided. The apparatus includes an equipment support structure configured to support a semiconductor fabrication component. The apparatus includes a damper assembly configured to resist a lateral force induced by a seismic event to the equipment support structure. The damper assembly includes a gear rack coupled to the equipment support structure. The damper assembly includes a first flywheel assembly including a first mass damper flywheel and a first gear meshed with the gear rack and selectively engaged with the first mass damper flywheel.
    Type: Application
    Filed: January 12, 2024
    Publication date: July 17, 2025
    Inventors: Chen Hao LIAO, Chih-Tsung LEE, Ming-Yi LIN, Cheng-Lung WU, Jiun-Rong PAI
  • Patent number: 12346034
    Abstract: A method of removing a particle from a pellicle includes moving a nozzle over a surface of a membrane of the pellicle to a location of the particle. A droplet of a liquid material is dispensed from the nozzle to cover the particle on the surface of the membrane. A contact of the droplet with the nozzle is monitored and maintained. The droplet carrying the particle is horizontally dragged along the surface of the membrane toward an edge thereof by the nozzle using the surface tension of the droplet. The droplet carrying the particle is sucked off from the edge of the membrane by a vacuum pump, thereby automatically and safely removing the particle without damaging the pellicle.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: July 1, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Kang Hu, Yin Yuan Chen, Ya-Chieh Wen, Hsu-Shui Liu, Jiun-Rong Pai
  • Patent number: 12347704
    Abstract: A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieve from the cassette residing in the storage buffer; and determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: July 1, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Lung Wu, Chih-Hung Huang, Yang-Ann Chu, Jiun-Rong Pai
  • Patent number: 12334373
    Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.
    Type: Grant
    Filed: February 16, 2024
    Date of Patent: June 17, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Kang Hu, Shou-Wen Kuo, Sheng-Hsiang Chuang, Jiun-Rong Pai, Hsu-Shui Liu
  • Publication number: 20250191948
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Application
    Filed: February 19, 2025
    Publication date: June 12, 2025
    Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yi-Fam SHIU, Yu-Chen CHEN, Yang-Ann CHU, Jiun-Rong PAI
  • Patent number: 12327747
    Abstract: A transport carrier docking device may be capable of forming an air-tight seal around a transport carrier while a front portion of the transport carrier is inserted into a chamber of the transport carrier docking device. Semiconductor wafers in the transport carrier may be accessed by a transport tool while the air-tight seal exists around the transport carrier, which prevents and/or reduces the likelihood that contaminants in a semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: June 10, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • Patent number: 12322628
    Abstract: An apparatus for automated wafer carrier handling includes a base plate and an active expansion component movably coupled to the base plate. The active expansion component is configured to change from a contracted form to an expanded form so as to be engaged with a top flange mounted on a wafer carrier.
    Type: Grant
    Filed: January 15, 2024
    Date of Patent: June 3, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ren-Hau Wu, Cheng-Lung Wu, Jiun-Rong Pai, Cheng-Kang Hu
  • Publication number: 20250157842
    Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.
    Type: Application
    Filed: January 16, 2025
    Publication date: May 15, 2025
    Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yang-Ann CHU, Hsuan LEE, Jiun-Rong PAI
  • Publication number: 20250149360
    Abstract: An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Inventors: Tsung-Sheng KUO, Chih-Chun CHIU, Chih-Chieh FU, Chueng-Jen WANG, Hsuan LEE, Jiun-Rong PAI
  • Publication number: 20250125176
    Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.
    Type: Application
    Filed: December 26, 2024
    Publication date: April 17, 2025
    Inventors: Chih-Kuo CHANG, Cheng-Lung WU, Ting-Yau SHIU, Wei-Chen LEE, Yang-Ann CHU, Jiun-Rong PAI
  • Publication number: 20250114803
    Abstract: A plurality of purge nozzles of a purge load port include a nozzle gasket and a nozzle structure to inject a purging fluid into and through an internal chamber of a container (e.g., a FOUP) that is configured to, in operation, transport wafers or workpieces between various locations within a FAB. The nozzle gasket includes a deformable structure that abuts against a surface of a nozzle structure and a sealing structure opposite to the deformable structure that forms a seal between the container and the nozzle gasket. A nozzle hole of a nozzle of the nozzle structure includes a threaded region or portion that is configured to receive a threaded stopper structure to seal off the nozzle hole.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 10, 2025
    Inventors: Cheng-Lung WU, Yang-Ann CHU, Hsu-Shui LIU, Jiun-Rong PAI
  • Patent number: 12272573
    Abstract: A load port is capable of monitoring various environmental parameters associated with a transport carrier to minimize and/or prevent exposure of the semiconductor substrates therein to increased humidity, increased oxygen, increased vibration, and/or one or more other elevated environmental conditions that might otherwise contaminate the semiconductor substrates, damage the semiconductor substrates, and/or cause processing defects. For example, the load port may monitor the environmental parameters as indicators of a potential blockage of a diffuser of the transport carrier, and a relief valve may be used to divert a gas away from the transport carrier based on a determination that a diffuser blockage has occurred. In this way, the gas may be diverted through the relief valve and away from the transport carrier to prevent increased humidity, contaminants, and/or vibration from contaminating and/or damaging the semiconductor substrates.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 8, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Fam Shiu, Ting-Yau Shiu, Cheng-Lung Wu, Yang-Ann Chu, Jiun-Rong Pai
  • Publication number: 20250112081
    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.
    Type: Application
    Filed: December 13, 2024
    Publication date: April 3, 2025
    Inventors: Chien-Fa LEE, Chin-Lin CHOU, Shang-Ying TSAI, Shou-Wen KUO, Kuei-Sung CHANG, Jiun-Rong PAI, Hsu-Shui LIU, Chun-wen CHENG
  • Patent number: 12261069
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Grant
    Filed: January 19, 2024
    Date of Patent: March 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
  • Publication number: 20250096030
    Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.
    Type: Application
    Filed: November 27, 2024
    Publication date: March 20, 2025
    Inventors: Ren-Hau WU, Yan-Han CHEN, Cheng-Kang HU, Feng-Kuang WU, Hsu-Shui LIU, Jiun-Rong PAI
  • Patent number: 12237196
    Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.
    Type: Grant
    Filed: May 15, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • Publication number: 20250062153
    Abstract: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Inventors: Chien-Fa LEE, Hsu-Shui LIU, Jiun-Rong PAI, Shou-Wen KUO, Jian-Hung CHEN, M.C. LIN, C.C. CHIEN, Hsuan LEE, Boris HUANG
  • Patent number: 12217991
    Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Kuo Chang, Cheng-Lung Wu, Ting-Yau Shiu, Wei-Chen Lee, Yang-Ann Chu, Jiun-Rong Pai
  • Patent number: 12198956
    Abstract: An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 14, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Tsung-Sheng Kuo, Chih-Chun Chiu, Chih-Chieh Fu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
  • Patent number: 12191185
    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: January 7, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Chin-Lin Chou, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai, Hsu-Shui Liu, Chun-Wen Cheng