Patents by Inventor Jiun-Rong Pai

Jiun-Rong Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200251367
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Pin-Yi Hsin, Shou-Wen Kuo, Patrick Lin
  • Patent number: 10734206
    Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: August 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Sing-Tsung Li
  • Publication number: 20200243393
    Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 30, 2020
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
  • Publication number: 20200227283
    Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.
    Type: Application
    Filed: March 30, 2020
    Publication date: July 16, 2020
    Inventors: Tsung-Sheng KUO, Yang-Ann CHU, Alan YANG, Vic HUANG, Hsu-Shui LIU, Jiun-Rong PAI
  • Patent number: 10714364
    Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing having an opening on a wall of the housing; a load port outside the housing; a robot arm inside the housing; and a processor. The load port is coupled to the wall and configured to load a wafer carrier for inspection. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Kang Hu, Shou-Wen Kuo, Sheng-Hsiang Chuang, Jiun-Rong Pai, Hsu-Shui Liu
  • Patent number: 10665489
    Abstract: The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: May 26, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Pin-Yi Hsin, Shou-Wen Kuo, Patrick Lin
  • Patent number: 10665507
    Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: May 26, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
  • Publication number: 20200161161
    Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.
    Type: Application
    Filed: October 10, 2019
    Publication date: May 21, 2020
    Inventors: Ren-Hau WU, Yan-Han CHEN, Cheng-Kang HU, Feng-Kuang WU, Hsu-Shui LIU, Jiun-Rong PAI
  • Publication number: 20200161160
    Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.
    Type: Application
    Filed: September 30, 2019
    Publication date: May 21, 2020
    Inventors: Tsung-Sheng KUO, Yi-Fam SHIU, Eason CHEN, Yang-Ann CHU, Jiun-Rong PAI
  • Publication number: 20200156884
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Application
    Filed: October 10, 2019
    Publication date: May 21, 2020
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
  • Publication number: 20200130874
    Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.
    Type: Application
    Filed: June 14, 2019
    Publication date: April 30, 2020
    Inventors: Tsung-Sheng KUO, Hsu-Shui LIU, Jiun-Rong PAI, Yang-Ann CHAU, Chih-Chun LIN, Shine CHEN
  • Publication number: 20200118857
    Abstract: An operating method of a wafer cassette handling apparatus includes at least the following steps. A stage that carries a wafer cassette is moved into a main body of a wafer cassette handling apparatus to open a cassette door of the wafer cassette. The stage that carries the wafer cassette is moved out of the main body after the cassette door is opened. A wafer is extracted from the wafer cassette and transferred to a processing system. Another operating method and a wafer cassette handling apparatus are also provided.
    Type: Application
    Filed: December 15, 2019
    Publication date: April 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsuan Lee, Hsu-Shui Liu, Jiun-Rong Pai, Chih-Hung Huang, Yang-Ann Chu
  • Patent number: 10622236
    Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: April 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Alan Yang, Vic Huang, Hsu-Shui Liu, Jiun-Rong Pai
  • Publication number: 20200111652
    Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 9, 2020
    Inventors: Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Sing-Tsung Li
  • Publication number: 20200075371
    Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.
    Type: Application
    Filed: July 22, 2019
    Publication date: March 5, 2020
    Inventors: Tsung-Sheng KUO, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
  • Publication number: 20200072760
    Abstract: The present disclosure provides an apparatus for substrate inspection, including a chamber, a movable holder in the chamber and configured to hold a substrate and transfer the substrate between a first position and a second position, a first inspector under the first position and the second position in the chamber, and configured to inspect a backside of the substrate, a lifter under the second position in the chamber, and configured to support the substrate and move the substrate from the second position to a third position, and a second inspector near the third position in the chamber and configured to inspect an edge of the substrate at the third position.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 5, 2020
    Inventors: BO-HAN SHIH, SHENG-HSIANG CHUANG, HSU-SHUI LIU, JIUN-RONG PAI, SHOU-WEN KUO
  • Publication number: 20200058535
    Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.
    Type: Application
    Filed: April 26, 2019
    Publication date: February 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Sheng KUO, Chih-Hung HUANG, Ming-Hsien TSAI, Yang-Ann CHU, Hsuan LEE, Jiun-Rong PAI
  • Patent number: 10559453
    Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: February 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Sing-Tsung Li
  • Publication number: 20200043758
    Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 6, 2020
    Inventors: Tsung-Sheng KUO, Chih-Hung Huang, Hsueh-Lei Wang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • Publication number: 20200043812
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Application
    Filed: October 14, 2019
    Publication date: February 6, 2020
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu