Abstract: An approach for saving power in a memory subsystem that uses memory access idle timer to enable low power mode and memory scrub operation within computing system has been provided. The computing system determines that a memory subsystem is switched out of low power operation mode due to a memory scrub operation. In addition, the computing system bypasses the low power operation mode of an idle timer of the memory subsystem such that the memory subsystem is returned to the low power operation mode upon completion of the memory scrub operation. The computing system further sets a scrub flag of the memory subsystem to a high state, and clears the scrub flag to a low state to track if the idle timer should be bypassed.

Abstract: An approach for saving power in a memory subsystem that uses memory access idle timer to enable low power mode and memory scrub operation within computing system has been provided. The computing system determines that a memory subsystem is switched out of low power operation mode due to a memory scrub operation. In addition, the computing system bypasses the low power operation mode of an idle timer of the memory subsystem such that the memory subsystem is returned to the low power operation mode upon completion of the memory scrub operation. The computing system further sets a scrub flag of the memory subsystem to a high state, and clears the scrub flag to a low state to track if the idle timer should be bypassed.

Abstract: A method, system and computer program product are provided for implementing enhanced reliability of memory subsystems utilizing a dual port Dynamic Random Access Memory (DRAM) configuration. The DRAM configuration includes a first buffer and a second buffer, each buffer including a validity counter. The validity counter for a receiving buffer is incremented as each respective data row from a transferring buffer is validated through Error Correction Code (ECC), Reliability, Availability, and Serviceability (RAS) logic and transferred to the receiving buffer, while the validity counter for the transferring buffer is decremented. Data are read from or written to either the first buffer or the second buffer based upon a respective count value of the validity counters.

Abstract: A method, system and computer program product are provided for implementing enhanced reliability of memory subsystems utilizing a dual port Dynamic Random Access Memory (DRAM) configuration. The DRAM configuration includes a first buffer and a second buffer, each buffer including a validity counter. The validity counter for a receiving buffer is incremented as each respective data row from a transferring buffer is validated through Error Correction Code (ECC), Reliability, Availability, and Serviceability (RAS) logic and transferred to the receiving buffer, while the validity counter for the transferring buffer is decremented. Data are read from or written to either the first buffer or the second buffer based upon a respective count value of the validity counters.

Abstract: According to embodiments of the disclosure, methods, systems, and computer program products for memory module testing are disclosed. The method may include accessing, with a first stress test, a plurality of memory modules, the plurality of memory modules coupled in a computer system, the plurality of memory modules including a first module having a first memory characteristic and a second module having a second memory characteristic. The method may include determining for the first module, a first traffic-to-temperature parameter, and determining that the first module was sufficiently stressed in response to determining that the first traffic-to-temperature parameter is within a first traffic-to-temperature range. The method may also include determining, for the second module, a second traffic-to-temperature parameter, and determining that the second module was sufficiently stressed in response to determining that the second traffic-to-temperature parameter is within a second traffic-to-temperature range.

Abstract: According to embodiments of the disclosure, methods, systems, and computer program products for memory module testing are disclosed. The method may include accessing, with a first stress test, a plurality of memory modules, the plurality of memory modules coupled in a computer system, the plurality of memory modules including a first module having a first memory characteristic and a second module having a second memory characteristic. The method may include determining for the first module, a first traffic-to-temperature parameter, and determining that the first module was sufficiently stressed in response to determining that the first traffic-to-temperature parameter is within a first traffic-to-temperature range. The method may also include determining, for the second module, a second traffic-to-temperature parameter, and determining that the second module was sufficiently stressed in response to determining that the second traffic-to-temperature parameter is within a second traffic-to-temperature range.

Abstract: A method of operating a computer memory system with ECC features that will enable operational modes with less electrical power consumption. A chip mark normally used to mark a failing DRAM device may instead be used to mark a non-failing DRAM device before a computer memory system shuts off electrical power to the marked non-failing DRAM device to reduce power consumption, putting the rank of memory that contains the DRAM device in a low power consumption mode. Upon a request from the computer memory system, the chip mark may be removed from the marked non-failing DRAM device in order to return the non-failing DRAM device to normal operation.

Abstract: A method of operating a computer memory system with ECC features that will enable operational modes with less electrical power consumption. A chip mark normally used to mark a failing DRAM device may instead be used to mark a non-failing DRAM device before a computer memory system shuts off electrical power to the marked non-failing DRAM device to reduce power consumption, putting the rank of memory that contains the DRAM device in a low power consumption mode. Upon a request from the computer memory system, the chip mark may be removed from the marked non-failing DRAM device in order to return the non-failing DRAM device to normal operation.

Abstract: A method and apparatus for modifying a reference voltage between refreshes in a memory device are disclosed. The memory array may include a plurality of memory cells. The memory device may also include a sense amplifier. The sense amplifier may be configured to read data from the plurality of memory cells using a reference voltage. The memory device may also include a sense amplifier reference voltage modification circuit. The sense amplifier reference voltage modification circuit may be configured to detect a triggering event and modify the reference voltage in response to detecting a triggering event.

Abstract: A method, system and memory controller are provided for implementing simultaneous read and write operations in a memory subsystem utilizing a dual port Dynamic Random Access Memory (DRAM) configuration. A DRAM includes a first partition and a second partition. A memory controller determines if memory requirements are above or below a usage threshold. If the memory requirements are below the usage threshold, the memory is partitioned into a read buffer and a write buffer, with writes going to the write buffer and reads coming from the read buffer, data being transferred from the write buffer to the read buffer through an Error Correction Code (ECC) engine. If the memory requirements are above the usage threshold, the entire memory is used for reads and writes.

Abstract: A method, system and memory controller are provided for implementing simultaneous read and write operations in a memory subsystem utilizing a dual port Dynamic Random Access Memory (DRAM) configuration. A DRAM includes a first partition and a second partition. A memory controller determines if memory requirements are above or below a usage threshold. If the memory requirements are below the usage threshold, the memory is partitioned into a read buffer and a write buffer, with writes going to the write buffer and reads coming from the read buffer, data being transferred from the write buffer to the read buffer through an Error Correction Code (ECC) engine. If the memory requirements are above the usage threshold, the entire memory is used for reads and writes.

Abstract: Exemplary embodiments of the present invention disclose a method and system for monitoring a first Error Correcting Code (ECC) device for failure and replacing the first ECC device with a second ECC device if the first ECC device begins to fail or fails. In a step, an exemplary embodiment performs a loopback test on an ECC device if a specified number of correctable errors is exceeded or if an uncorrectable error occurs. In another step, an exemplary embodiment replaces an ECC device that fails the loopback test with an ECC device that passes a loopback test.

Abstract: A method, system and computer program product are provided for implementing hardware assisted Dynamic Random Access Memory (DRAM) repair in a computer system that supports ECC. A data register providing DRAM repair is selectively provided in one of the Dynamic Random Access Memory (DRAM), a memory controller, or a memory buffer coupled between the DRAM and the memory controller. The data register is configured to map to any address. Responsive to the configured address being detected, the reads to or the writes from the configured address are routed to the data register.

Abstract: A method of operating a computer memory system with ECC features that will enable operational modes with less electrical power consumption. A chip mark normally used to mark a failing DRAM device may instead be used to mark a non-failing DRAM device before a computer memory system shuts off electrical power to the marked non-failing DRAM device to reduce power consumption, putting the rank of memory that contains the DRAM device in a low power consumption mode. Upon a request from the computer memory system, the chip mark may be removed from the marked non-failing DRAM device in order to return the non-failing DRAM device to normal operation.

Abstract: A method of operating a computer memory system with ECC features that will enable operational modes with less electrical power consumption. A chip mark normally used to mark a failing DRAM device may instead be used to mark a non-failing DRAM device before a computer memory system shuts off electrical power to the marked non-failing DRAM device to reduce power consumption, putting the rank of memory that contains the DRAM device in a low power consumption mode. Upon a request from the computer memory system, the chip mark may be removed from the marked non-failing DRAM device in order to return the non-failing DRAM device to normal operation.

Abstract: A refresh command is communicated to a memory device to initiate an interruptible refresh which contains multiple segment refreshes separated by interrupt boundaries. A command is communicated to the memory device before execution of a segment refresh and the segment refresh is delayed at an interrupt boundary. Alternatively, a first number of commands in a queue is determined. A first number of segment refreshes to execute is determined based on the first number of commands. The first number of segment refreshes to execute is communicated to the memory device to cause execution of the first number of segment refreshes. A second number of commands in the queue is determined. A second number of segment refreshes to execute is determined based on the second number of commands. The second number of segment refreshes to execute is communicated to the memory device to cause execution of the second number of segment refreshes.

Abstract: A refresh command is received from a memory controller. An interruptible refresh containing multiple segment refreshes is initiated. The segment refreshes are separated by interrupt boundaries. A command is received before execution of a segment refresh. The first command is executed and execution of the first segment refresh is delayed at a first interrupt boundary. Alternatively, a first number of segment refreshes to execute is received from a memory controller. The received first number of segment refreshes is executed. A second number of segment refreshes to execute is received from a memory controller. The received second number of segment refreshes is executed. No segment refreshes are executed between the execution of the first number of segment refreshes and the execution of the second number of segment refreshes.

Abstract: Exemplary embodiments of the present invention disclose a method and system for monitoring a first Error Correcting Code (ECC) device for failure and replacing the first ECC device with a second ECC device if the first ECC device begins to fail or fails. In a step, an exemplary embodiment detects that a specified number of correctable errors is exceeded. In another step, an exemplary embodiment detects the occurrence of an uncorrectable error. In another step, an exemplary embodiment performs a loopback test on an ECC device if a specified number of correctable errors is exceeded or if an uncorrectable error occurs. In another step, an exemplary embodiment replaces an ECC device that fails the loopback test with an ECC device that passes a loopback test.

Abstract: A method, system and computer program product are provided for implementing command timing adjustments to alleviate Dynamic Random Access Memory (DRAM) failures in a computer system. A predefined DRAM failure is detected. Responsive to the detected failure, a set of timers is adjusted for controlling predetermined timings used to access the DRAM. Responsive to the failure being resolved by the adjusted set of timers, checking for a predetermined level of performance is performed.

Abstract: A method and structures are provided for implementing decoupling capacitors within a DRAM TSV stack. A DRAM is formed with a plurality of TSVs extending completely through the substrate and filled with a conducting material. A layer of glass is grown on both the top and bottom of the DRAM providing an insulator. A layer of metal is grown on each glass layer providing a conductor. The metal and glass layers are etched through to TSVs with a gap provided around the perimeter of via pads. A respective solder ball is formed on the TSVs to connect to another DRAM chip in the DRAM TSV stack. The metal layers are connected to at least one TSV by one respective solder ball and are connected to a voltage source and a dielectric is inserted between the metal layers in the DRAM TSV stack to complete the decoupling capacitor.