Patents by Inventor Jochen Dangelmaier

Jochen Dangelmaier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11410942
    Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Patent number: 11239176
    Abstract: A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: February 1, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Publication number: 20210300749
    Abstract: A sensor package comprises a MEMS sensor chip, a cover arranged over a first main surface of the MEMS sensor chip, said cover being fabricated from a mold compound, and an electrical through contact extending through the cover and to electrically couple the sensor package to a circuit board arranged over the cover.
    Type: Application
    Filed: March 16, 2021
    Publication date: September 30, 2021
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER
  • Patent number: 11073572
    Abstract: A current sensor device may include a routable molded lead frame that includes a molded substrate. The current sensor device may include a conductor and a semiconductor chip mounted to the molded substrate. The semiconductor chip may include a magnetic field sensor that is galvanically isolated from the conductor by the molded substrate and is configured to sense a magnetic field created by current flowing through the conductor. The current sensor device may include one or more leads configured to output a signal generated by the semiconductor chip. The one or more leads may be galvanically isolated from the conductor by the molded substrate.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: July 27, 2021
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Rainer Markus Schaller
  • Publication number: 20210181151
    Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER, Matthias EBERL, Simon GASSNER, Franz JOST, Stefan KOLB, Horst THEUSS
  • Patent number: 11024565
    Abstract: A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: June 1, 2021
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang
  • Patent number: 10978418
    Abstract: A method of forming an electrical contact and a method of forming a chip package are provided. The methods may include arranging a metal contact structure including a non-noble metal and electrically contacting the chip, arranging a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 13, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Publication number: 20210082861
    Abstract: In various embodiments, a method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.
    Type: Application
    Filed: November 6, 2020
    Publication date: March 18, 2021
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Publication number: 20210028125
    Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.
    Type: Application
    Filed: July 22, 2020
    Publication date: January 28, 2021
    Applicant: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Patent number: 10818805
    Abstract: A semiconductor sensor device includes a substrate including a first main face and a second main face opposite the first main face, a semiconductor element including a sensing region, the semiconductor element on the first main face of the substrate and being electrically coupled to the substrate, a lid on the first main face of the substrate and forming a cavity, wherein the semiconductor element is in the cavity, and a vapor deposited dielectric coating covering the semiconductor element and the first main face of the substrate, the vapor deposited dielectric coating having an opening over the sensing region, wherein the second main face of the substrate is at least partially free of the vapor deposited dielectric layer.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: October 27, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Franz-Peter Kalz, Jochen Dangelmaier
  • Publication number: 20200335451
    Abstract: A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
    Type: Application
    Filed: March 31, 2020
    Publication date: October 22, 2020
    Applicant: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Patent number: 10781095
    Abstract: Examples provided herein are associated with a molded lead frame of a sensor package. An example sensor package may include a molded lead frame that includes an opening in the molded lead frame, wherein the opening extends from a mount-side of the molded lead frame to a chip-side of the molded lead frame, wherein the chip-side of the molded lead frame is opposite the mount-side; and a sensor mounted to the chip-side of the molded lead frame.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: September 22, 2020
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Manfred Schindler, Horst Theuss, Mathias Vaupel
  • Publication number: 20200233044
    Abstract: A current sensor device may include a routable molded lead frame that includes a molded substrate. The current sensor device may include a conductor and a semiconductor chip mounted to the molded substrate. The semiconductor chip may include a magnetic field sensor that is galvanically isolated from the conductor by the molded substrate and is configured to sense a magnetic field created by current flowing through the conductor. The current sensor device may include one or more leads configured to output a signal generated by the semiconductor chip. The one or more leads may be galvanically isolated from the conductor by the molded substrate.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 23, 2020
    Inventors: Jochen DANGELMAIER, Rainer Markus Schaller
  • Publication number: 20200189908
    Abstract: Examples provided herein are associated with a molded lead frame of a sensor package. An example sensor package may include a molded lead frame that includes an opening in the molded lead frame, wherein the opening extends from a mount-side of the molded lead frame to a chip-side of the molded lead frame, wherein the chip-side of the molded lead frame is opposite the mount-side; and a sensor mounted to the chip-side of the molded lead frame.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 18, 2020
    Inventors: Jochen DANGELMAIER, Manfred SCHINDLER, Horst THEUSS, Mathias VAUPEL
  • Publication number: 20200013749
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 9, 2020
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Patent number: 10461056
    Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 29, 2019
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Publication number: 20190237396
    Abstract: A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 1, 2019
    Inventors: Jochen Dangelmaier, Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang
  • Patent number: 10297536
    Abstract: A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: May 21, 2019
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang
  • Publication number: 20190148566
    Abstract: A semiconductor sensor device includes a substrate including a first main face and a second main face opposite the first main face, a semiconductor element including a sensing region, the semiconductor element on the first main face of the substrate and being electrically coupled to the substrate, a lid on the first main face of the substrate and forming a cavity, wherein the semiconductor element is in the cavity, and a vapor deposited dielectric coating covering the semiconductor element and the first main face of the substrate, the vapor deposited dielectric coating having an opening over the sensing region, wherein the second main face of the substrate is at least partially free of the vapor deposited dielectric layer.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 16, 2019
    Inventors: Franz-Peter Kalz, Jochen Dangelmaier
  • Patent number: 10107867
    Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: October 23, 2018
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Jochen Dangelmaier, Franz Michael Darrer, Thomas Mueller, Mathias Vaupel, Manfred Fries, Guenther Ruhl, Horst Theuss, Matthias Rose, Stephan Auer, Tue Fatt David Wee, Sie Boo Chiang