Patents by Inventor Joe M. Jeddeloh

Joe M. Jeddeloh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915774
    Abstract: Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: February 27, 2024
    Assignee: Micron Technology, Inc.
    Inventor: Joe M. Jeddeloh
  • Patent number: 11769534
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: September 26, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Publication number: 20230080130
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 16, 2023
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Patent number: 11450354
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: September 20, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Publication number: 20220027236
    Abstract: Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 27, 2022
    Inventor: Joe M. Jeddeloh
  • Patent number: 11145384
    Abstract: Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 12, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Joe M. Jeddeloh
  • Publication number: 20210295879
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Inventors: Joe M Jeddeloh, Brent Keeth
  • Patent number: 11031049
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: June 8, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Publication number: 20200411064
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Application
    Filed: July 13, 2020
    Publication date: December 31, 2020
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Patent number: 10878933
    Abstract: Some embodiments include apparatuses and methods having a first interface to communicate with a processing unit, a second interface to communicate with a memory device, and a module coupled to the first and second interfaces. In at least one of the embodiments, the module can be configured to obtain information stored in the memory device and perform at least one of testing and repairing of a memory structure of the memory device based at least in part on the information.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: December 29, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Patent number: 10714150
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: July 14, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Publication number: 20200201550
    Abstract: Memory requests for information from a processor are received in an interface device, and the interface device is coupled to a stack including two or more memory devices. The interface device is operated to select a memory device from a number of memory devices including the stack, and to retrieve some or all of the information from the selected memory device for the processor. Additional apparatus, systems and methods are disclosed.
    Type: Application
    Filed: September 30, 2019
    Publication date: June 25, 2020
    Inventor: Joe M. Jeddeloh
  • Publication number: 20200058363
    Abstract: Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
    Type: Application
    Filed: June 3, 2019
    Publication date: February 20, 2020
    Inventor: Joe M. Jeddeloh
  • Publication number: 20190385646
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Application
    Filed: February 19, 2019
    Publication date: December 19, 2019
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Patent number: 10445025
    Abstract: Some embodiments include apparatuses and methods having a memory unit and a controller device. The controller device can be configured to receive a request from a host device and access a data structure in the memory unit to determine whether information associated with the request is in the data structure. The controller device can be configured such that if a fault related to accessing the data structure occurs, the controller device continues searching for the information associated with the request without notifying the host device of the fault.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: October 15, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Joe M. Jeddeloh
  • Patent number: 10430086
    Abstract: Memory requests for information from a processor are received in an interface device, and the interface device is coupled to a stack including two or more memory devices. The interface device is operated to select a memory device from a number of memory devices including the stack, and to retrieve some or all of the information from the selected memory device for the processor. Additional apparatus, systems and methods are disclosed.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 1, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Joe M. Jeddeloh
  • Patent number: 10347356
    Abstract: Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: July 9, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Joe M. Jeddeloh
  • Patent number: 10297340
    Abstract: Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: May 21, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Paul A. LaBerge
  • Patent number: 10283172
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: May 7, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth
  • Patent number: 10242718
    Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: March 26, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Joe M. Jeddeloh, Brent Keeth