Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: A spherical silicone additive is selected and introduced into a contact region between a photoreceptor's anti-curl layer and an electrophotographic system's backer bar, and into a bulk material of the electrophotographic system's spots blade. The additive reduces frictional drag and wear at the contact region between the anti-curl layer and the backer bar and at a contact region between a photoreceptor's outermost surface and the system's spots blade. The reduction of photoreceptor drag and wear at the above contact regions reduces photoreceptor surface irregularities, excessive backer bar wear, excessive spots blade wear, belt ripple and belt contamination. As a result, system drive torque requirements may be minimized, the life of the contacting system components may be extended and system performance may be improved.

Abstract: A double screw extruder includes two conical extruder screws whose screw shafts are arranged at an angle to one another corresponding to the conicity of the extruder screws, and a drive apparatus for driving one of the screw shafts. The other screw shaft is driven from the first screw shaft through a bevel gear drive provided with teeth arranged in herringbone or arrow fashion.