Abstract: In a converter unit to convert control information to be transferred between at least first and second processing units of a printing or copying system, at least one first data interface is provided according to a first interface standard for exchange of control information between the converter unit and at least the first processing unit. A control signal interface is provided for at least one signal line between the converter unit and the first processing unit, the signal line being associated with one control signal. At least one real-time-capable second data interface according to a second interface standard is provided for exchange of control information between the converter unit and at least the second processing unit. The converter unit converts data conforming to a signal state of the control signal into data according to the second interface standard and conforming to the real-time-capable second data interface.

Abstract: An elongate solar cell, comprising a semiconductor body having two mutually opposed faces, at least one of the faces being an active face for receiving incident light, and two mutually opposed edges orthogonal to the faces, the edges comprising electrical contacts thereon for conducting electrical current generated by the solar cell from the light; wherein the electrical contact to at least one of the edges includes an electrically conductive material that contacts only a fractional portion of the at least one edge of the semiconductor body to improve the performance of the solar cell.

Abstract: A hand operated hydraulic pump has a cam that is pivoted by a compensation cylinder that rotates the cam so as to move the pivot of an operating handle closer to the pump plunger as the output pressure of the pump increases.

Abstract: A solar cell interconnection process for forming a solar cell sub-module for a photovoltaic device, the process including the steps of mounting a plurality of elongate solar cells (101) on a crossbeam (102) on patches of solderable material (201) which is used to maintain solder in position, the elongate solar cells being in a substantially longitudinally parallel and generally co-planar configuration: and establishing one or more conductive pathways (204) extending between adjacent cells to electrically interconnect the elongate solar cells via the contacts (202, 203): wherein the one or more conductive pathways are established by wave soldering.

Abstract: This disclosure provides various embodiments for archiving a business object. At least one particular business object is identified for archiving. The particular business object has associated data including type data corresponding to a business object type of the at least one particular business object, structured business data, and unstructured attachment data. At least one archive-type object is created corresponding to the particular business object by enriching the unstructured attachment data with type-specific metadata including data identifying at least one attribute of the business object type. The archive-type object is archive-system-independent. The at least one archive-type object is exported to at least one archiving system for storage in at least one memory device of the archiving system.

Abstract: A thin layer of single-crystal silicon is produced by forming first trenches in a silicon substrate having (111) orientation; forming narrower second trenches at the base of the trenches; anisotropically etching lateral channels (4) from the second trenches, until adjacent etch fonts (16) substantially meet; and detaching said layer from the substrate. The trenches may be arranged so that the resultant layer has rows of slots, with the slots in adjacent rows being mutually offset. Solar cells may be formed on strips having two electrical contacts on the same face (6) of each strip (5).

Abstract: The invention relates to a heatable floor for livestock stalls comprising a plurality of hollow, right-angled plate elements whose hollow spaces are filled with a heat transfer fluid and can be heated by means of heating lines (11) running through the hollow spaces, wherein each plate element comprises one upper shell (1) having an inlet opening (5) and forming a standing surface for the livestock and one lower shell (7) supporting the upper shell (1), the shells being connected to one another liquid-tight at their edges and having means for suspending carriers and being supported on one another by supports (6, 9) that run through the hollow space.

Abstract: A operating circuit and control method for protecting a PMT having a photocathode, a plurality of dynodes and an anode against overloading with a shorter reaction time, and to allow it to be switched on again rapidly. For this purpose, a switch is provided for electrically short circuiting the photocathode with the first dynode, or a switch is provided for reversing the polarity of the voltage between the photocathode and the first dynode.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: The invention provides a process for texturing a surface of a semiconductor material, the process comprising: applying a layer of a protective substance on said surface wherein said layer is sufficiently thin that it has a plurality of apertures therethrough; and contacting said layer and said semiconductor material with an etchant capable of etching said semiconductor material faster than said protective substance, said etchant making contact with said semiconductor material at least through said apertures, for a time and under conditions in which said semiconductor material is etched by said etchant in the vicinity of said apertures to produce a textured surface on said semiconductor material, but said protective substance is substantially unetched.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: A method for processing elongate substrates, including forming a plurality of parallel elongate openings (102) through a semiconductor wafer (104) to form a corresponding plurality of elongate substrates (106) between the openings, each of the elongate substrates (106) having opposite edges coplanar with opposite surfaces of the wafer, opposite faces (112) orthogonal to the wafer surfaces, and opposite ends by which the elongate substrates are interconnected; and applying securing means (402) to at least one of the opposite edges of each elongate substrate to engage the edges and thereby inhibit relative movement of the elongate substrates.

Abstract: In a method to transfer data between at least two processing units of a printing or copying system, processing information to be transferred between the at least two processing units is split up into first data and second data, the first data comprising at least form-related paper travel information for which a real-time processing is required, and the second data comprising processing information for which a real-time processing is not required. The at least two processing units are connected via a real-time-capable data transmission path for transferring the first data. The at least two processing units are also connected via a switched network connection that provides at least one physical layer to transfer data. The switched network connection is utilized to transfer the second data.

Abstract: A hand operated hydraulic pump has a cam that is pivoted by a compensation cylinder that rotates the cam so as to move the pivot of an operating handle closer to the pump plunger as the output pressure of the pump increases.

Abstract: A solar cell interconnection process for forming a solar cell sub-module for a photovoltaic device, the process including the steps of mounting a plurality of elongate solar cells (101) on a crossbeam (102) on patches of solderable material (201) which is used to maintain solder in position, the elongate solar cells being in a substantially longitudinally parallel and generally co-planar configuration: and establishing one or more conductive pathways (204) extending between adjacent cells to electrically interconnect the elongate solar cells via the contacts (202, 203): wherein the one or more conductive pathways are established by wave soldering.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: In a converter unit to convert control information to be transferred between at least first and second processing units of a printing or copying system, at least one first data interface is provided according to a first interface standard for exchange of control information between the converter unit and at least the first processing unit. A control signal interface is provided for at least one signal line between the converter unit and the first processing unit, the signal line being associated with one control signal. At least one real-time-capable second data interface according to a second interface standard is provided for exchange of control information between the converter unit and at least the second processing unit. The converter unit converts data conforming to a signal state of the control signal into data according to the second interface standard and conforming to the real-time-capable second data interface.

Abstract: A thin layer of single-crystal silicon is produced by forming first trenches in a silicon substrate having (111) orientation; forming narrower second trenches at the bases of the trenches; anisotropically etching lateral channels (4) from the second trenches, until adjacent etch fronts (16) substantially meet; and detaching said layer from the substrate. The trenches may be arranged so that the resultant layer has rows of slots, whit the slots in adjacent rows being mutually offset. Solar cells may be formed on strips (5) between the trenches, having lengths of more than 50 mm, widths of up to 5 mm, and thicknesses of less than 100 microns, and having two electrical contacts on the same face (6) of each strip (5).