Patents by Inventor John Liebeskind

John Liebeskind has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-level integrated circuit for wide-gap substrate bonding
    Publication number: 20020185737
    Abstract: An integrated circuit includes a substrate having an etched surface and a non-etched surface. The etched surface contains circuit elements and the non-etched surface contains a bonding surface. The non-etched surface is located at a predetermined height from the etched surface. Bonding this integrated circuit with another substrate creates a wide-gap between the substrates that is preferably evacuated and hermetically sealed.
    Type: Application
    Filed: June 11, 2001
    Publication date: December 12, 2002
    Inventors: Michael J. Regan, John Liebeskind, Charles C. Haluzak
  • Electronic device sealed under vacuum containing a getter and method of operation
    Publication number: 20020149096
    Abstract: An electronic device that is sealed under vacuum includes a substrate, a transistor formed on the substrate, and a dielectric layer covering at least a portion of the transistor. The electronic device further includes a layer of non-evaporable getter material disposed on a portion of the dielectric layer; and a vacuum device disposed on a portion of the substrate. Electrical power pulses activate the non-evaporable getter material.
    Type: Application
    Filed: April 16, 2001
    Publication date: October 17, 2002
    Inventor: John Liebeskind