Patents by Inventor John McCormick

John McCormick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5757521
    Abstract: Security devices which are difficult to reproduce include a grid screen metallization pattern. The grid screen metallization pattern may be laid down over a hologram or diffraction grating formed as a surface relief pattern on a substrate, to form a visually identifiable, semi-transparent security device. Additionally, the metallization pattern may include resonant structures in which information about the security device is encoded. In some embodiments of these security devices, the metallization pattern is disposed in accurate registration with the underlying hologram or diffraction grating. These security devices are made by methods which include printing an oil pattern on the substrate. Areas on which oil is deposited do not receive metal during a metallization step. Since these methods do not use caustics, metallization patterns including features which would otherwise trap and hold caustics are possible.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: May 26, 1998
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, Richard C. Shea, John A. McCormick
  • Patent number: 5748005
    Abstract: A radial position sensor includes four capacitive electrodes oriented about a shaft, arranged in two diametrically opposite pairs. Sensor circuitry generates an output signal in proportion to the capacitance between the electrodes and the shaft; the capacitance between an electrode and the shaft increases as the shaft approaches the electrode and decreases as the shaft recedes from the electrode. The sensor circuitry applies an alternating voltage to one electrode of a pair and a 180 degree out of phase alternating voltage to the other electrode of the pair. The electrical responses of the two electrodes to their respective input signals are summed to form a radial deviation signal which is relatively free from the alternating voltage and accurately represents the position of the shaft relative to the electrodes of the pair.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: May 5, 1998
    Assignee: Creare, Inc.
    Inventors: John A. McCormick, Herbert Sixsmith
  • Patent number: 5681777
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: October 28, 1997
    Assignee: LSI Logic Corporation
    Inventors: Brian Lynch, John McCormick
  • Patent number: 5638596
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. Another aspect of the present invention provides a semiconductor device assembly including a first conductive layer with a plurality of traces formed on an insulating layer, a second conductive layer with an inner edge portion exposed within the central opening in the insulating layer, and a leadframe having a number of leads the inner end of one or more of the leads being electrically connected to an outer end of one or more of the traces.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: June 17, 1997
    Assignee: LSI Logic Corporation
    Inventor: John McCormick
  • Patent number: 5639385
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: June 17, 1997
    Assignee: LSI Logic Corporation
    Inventor: John McCormick
  • Patent number: 5552631
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. Another aspect of the present invention provides a semiconductor device assembly including a first conductive layer with a plurality of traces formed on an insulating layer, a second conductive layer with an inner edge portion exposed within the central opening in the insulating layer, and a leadframe having a number of leads the inner end of one or more of the leads being electrically connected to an outer end of one or more of the traces.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: September 3, 1996
    Assignee: LSI Logic Corporation
    Inventor: John McCormick
  • Patent number: 5550406
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: August 27, 1996
    Assignee: LSI Logic Corporation
    Inventor: John McCormick
  • Patent number: 5530231
    Abstract: A conductive structure for use in microwave food packaging which adapts itself to heat food articles in a safer, more uniform manner is disclosed. The structure includes a conductive layer disposed on a non-conductive substrate. Provision in the structure's conductive layer of fuse links and base areas causes microwave induced currents to be channeled through the fuse links, resulting in a controlled heating. When over-exposed to microwave energy, fuses break more readily than the conductive base areas resulting in less absorption of microwave energy in the area of fuse breaks than in other regions where fuses do not break. The arrangement and dimensions of fuse links compensate for known uneven stresses in the substrate, giving uniform fuse performance. In addition, by varying the dimensions of the fuse links and base areas it is possible to design and fabricate different fused microwave conductive structures having a wide range of heating characteristics.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: June 25, 1996
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, John A. McCormick
  • Patent number: 5489766
    Abstract: A bag for heating food products in a microwave oven and a blank for forming the bag are disclosed. The bag is formed of a dielectric substrate having a laminated layer including at least one microwave interactive patch. The microwave interactive patches are positioned to avoid overheating at creases and seams formed in the bag. At least one of the microwave interactive patches includes a heat sensitive fuse.
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: February 6, 1996
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, John A. McCormick
  • Patent number: 5412187
    Abstract: A conductive structure for use in microwave food packaging which adapts itself to heat food articles in a safer, more uniform manner is disclosed. The structure includes a conductive layer disposed on a non-conductive substrate. Provision in the structure's conductive layer of fuse links and base areas causes microwave induced currents to be channeled through the fuse links, resulting in a controlled heating. When over-exposed to microwave energy, fuses break more readily than the conductive base areas resulting in less absorption of microwave energy in the area of fuse breaks than in other regions where fuses do not break. In this way the fused microwave conductive structure compensates for the uneven microwave field within a microwave oven and at the same time provides a safer conductive structure less likely to overheat.
    Type: Grant
    Filed: January 25, 1994
    Date of Patent: May 2, 1995
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, John A. McCormick
  • Patent number: 5410451
    Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surface of the printed circuit board.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: April 25, 1995
    Assignee: LSI Logic Corporation
    Inventors: Emily Hawthorne, John McCormick
  • Patent number: 5300746
    Abstract: Microwave diffuser films are describe that provide a modified microwave energy field on one side of the diffuser film and on the other side. The films include an insulative substrate having a first side upon which is deposited a metallic coating capable of selectively reflecting a portion of incoming microwave energy. A coating is formed in a plurality of discrete areas having a predetermined reflectivity. The shape and spacing of the areas may be varied so that energy emission from noncoated surfaces of the substrate is spatially distributed in one or more ways; i.e. the energy emission more uniform than the energy impinging on the coated surface, the energy emission is focused on one or more particular location and/or the energy emission is shielded. A food packaging system for microwave cooking, which includes the microwave diffuser film of this invention, is also described.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: April 5, 1994
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, John A. McCormick
  • Patent number: 4973980
    Abstract: An ink jet apparatus having a scanning head employing at least one ink jet with a variable volume chamber which includes an ink droplet ejecting orifice, and a transducer, having a length mode resonant frequency, adapted to expand and contract along an axis of elongation in response to an electric field substantially transverse to the axis of elongation for ejection of droplets on demand from the ink droplet ejecting orifice is acoustically microstreamed by exciting the transducers during non-printing periods to eliminate start-up problems and to maintain pigments or other particles in dispersion within the ink.
    Type: Grant
    Filed: March 30, 1989
    Date of Patent: November 27, 1990
    Assignee: Dataproducts Corporation
    Inventors: Stuart D. Howkins, John A. McCormick
  • Patent number: 4809024
    Abstract: An ink jet apparatus has a manifold and a feed tube of substantially the same cross-sectional areas as the manifold, thereby connecting the manifold with an ink reservoir so as to effectively present the large compliance characteristic of the reservoir at the manifold, and enabling a reduced volume print head construction which efficiently reduces cross talk and vibrational problems.
    Type: Grant
    Filed: August 17, 1987
    Date of Patent: February 28, 1989
    Assignee: Dataproducts Corporation
    Inventors: Thomas W. DeYoung, John A. McCormick
  • Patent number: 4785315
    Abstract: A method and apparatus for supplying ink to an array of ink jets is provided by two fluidically independent reservoirs, each reservoir supplying ink to a respective end of a manifold which communicates with the array of ink jets via their inlet restrictors. During normal operations involving an acceleration of the array along a scanning path, the ink levels in the two reservoirs will remain the same since any difference in their levels will create a pressure differential that drives a flow of ink through the manifold from the higher level reservoir until such time that their levels equalize.
    Type: Grant
    Filed: February 6, 1987
    Date of Patent: November 15, 1988
    Assignee: Dataproducts Corporation
    Inventors: John A. McCormick, Lisa M. Schmidle
  • Patent number: 4702259
    Abstract: A device for measuring and indicating changes in the resistance of a living body including an analog portion, a digital portion and a source of power for supplying stable power to the analog and digital portions. The analog portion includes a bridge network which includes a potentiometer for setting a reference level for the device. The digital portion includes a potentiometer which turns together with the potentiometer provided in the analog portion and digital processing circuitry and digital displays for determining and displaying a count indicative of the position of the potentiometer and the total amount of rotation of said potentiometer. In addition, a computer could be interfaced with the device to record or play back the changes in the resistance of the living body.
    Type: Grant
    Filed: September 4, 1986
    Date of Patent: October 27, 1987
    Assignee: Author's Family Trust
    Inventors: Marc Ferreira, John McCormick, Raymond Bernard, Joseph Butryn, Ronald Clifford
  • Patent number: 4459995
    Abstract: In accordance with the invention there is provided an electrical resistance measuring indicating device including a bridge network having on one side thereof a first resistance arm connected to a second resistance arm and on the other side thereof, first voltage arm connected to a second voltage arm, there being between the junction of the first and second resistance arms and the junction of the first and second arms are transisterized amplifier circuit and an undamped indicating means responsive to changes in the balance of the bridge networks so as to indicate or measure the resistance or variation in resistance of a subject such as a body are part connected to the network across one of the resistance arms. The indicating means includes a moving coil meter which includes a metal frame of zero conductivity having a meter coil wound thereon and an indicating needle coupled to the frame.
    Type: Grant
    Filed: September 22, 1981
    Date of Patent: July 17, 1984
    Assignee: Lafayette R. Hubbard
    Inventors: Ron Conners, John McCormick
  • Patent number: 4208076
    Abstract: A compliant, hydrodynamic fluid film bearing for supporting a rotating rotor on a stationary mount, includes a bearing sheet supported by a compliant resilient support member formed of two sheets, each having raised resilient elevations in the form of corrugations. One of these sheets is inverted with respect to the other and the corrugations on the two sheets are vertically aligned and face in opposite directions, each corrugation forming one-half of an elongated tubular spring. A metal sheet lies between the two support sheets and all three sheets, and the bearing sheet, are fastened at one end to a pair of spacer blocks. The yield strength of the support member is thus raised above the yield strength of a single support sheet while maintaining low stiffness.
    Type: Grant
    Filed: December 29, 1978
    Date of Patent: June 17, 1980
    Assignee: Mechanical Technology Incorporated
    Inventors: Stanley Gray, John A. McCormick
  • Patent number: D341129
    Type: Grant
    Filed: August 21, 1992
    Date of Patent: November 9, 1993
    Assignee: Authors Family Trust
    Inventor: John McCormick