Abstract: Apparatus and methods to determine a change in atmospheric pressure between a forward portion of a flying object and a rear portion of the flying object based on at least one radio frequency (RF) return signal, and to determine a password using the determined change in atmospheric pressure.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

Abstract: An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.

Abstract: Fabrication of a reliable circuit board assembly with press-fit connectors is facilitated by identifying a press-fit-connector-to-circuit board connection of a circuit board assembly for testing, with one or more press-fit connector pins of the connector being press-fit into one or more corresponding plated through-holes of the circuit board at a first surface of the circuit board. An electrically insulative liquid is applied at a second surface of the circuit board to the corresponding plated through-hole(s) with the press-fit pin(s), where the second surface and the first surface are opposite surfaces of the circuit board. Connection of the press-fit pin(s) to the corresponding plated through-hole(s) is tested to identify a connection failure, where the electrically insulative liquid facilitates identifying the connection failure. A fabrication adjustment to the circuit board assembly can be identified and implemented to address the identified connection failure.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

Abstract: The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.

Abstract: The present disclosure describes printed circuit board performance evaluation techniques. In some cases, a printed circuit board performance evaluation process may include determining a first set of electrical properties associated with an interface between components of a printed circuit board, where the interface is disposed on an internal or external layer of the printed circuit board. After selective application of a sheet of dielectric material to a portion of a transmission line in the interface, a second set of electrical properties associated with the interface may be determined. The first set of electrical properties may be compared to the second set of electrical properties to evaluate printed circuit board performance. In other cases, the interface may include a trace inductor, and electrical properties of the interface before and after application of a ferrous material may be compared to evaluate printed circuit board performance.

Abstract: An arrangement to reduce refreezing of meltable snow includes a wiper arm configured to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The arrangement also includes a sensor coupled to the wiper arm that is configured to gather and transmit a parameter on the vehicle and environment. The arrangement also includes a processor that is configured to receiving the parameter, determining refreezability of the meltable snow based on the parameter, and defining an action to be performed by the wiper arm.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.

Abstract: An optical electromagnetic radiation (EM) emitter and receiver are located upon a printed circuit board (PCB) layer and are connected to an optical security pathway. A predetermined reference flux is determined, the reference flux being the expected EM transmitted by the optical security pathway and received by the receiver. When the PCB is subject to an unauthorized access thereof (e.g., drilled, sawed, cut, etc.), the optical EM transferred by optical security pathway is altered. An optical monitoring device that monitors the flux of the optical EM received by the receiver detects a change in flux, in relation to the reference flux, and passes a tamper signal to one or more computer system devices to respond to the unauthorized access. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.

Abstract: Embodiments herein describe RFID systems that include multiple RFID tag readers that each use a different frequency to communicate with an RFID tag. For example, each of the tag readers may transmit a tag query command using different modulated frequencies. In one embodiment, the RFID tag includes multiple receivers each tuned to one of the different frequencies generated by the tag readers. For example, one receiver in the tag is tuned to receive 200 MHz signals while another receiver is tuned to receive 900 MHz signals. To provide location information, the RFID tag compares power values associated with the received signals to determine which of the RFID tag readers is closest to the tag. The RFID tag conveys this location information to the tag readers by selecting one of the frequencies of the tag readers to use when generating a reply message.

Abstract: An optical electromagnetic radiation (EM) emitter and receiver are located upon a printed circuit board (PCB) layer and are connected to an optical security pathway. A predetermined reference flux is determined, the reference flux being the expected EM transmitted by the optical security pathway and received by the receiver. When the PCB is subject to an unauthorized access thereof (e.g., drilled, sawed, cut, etc.), the optical EM transferred by optical security pathway is altered. An optical monitoring device that monitors the flux of the optical EM received by the receiver detects a change in flux, in relation to the reference flux, and passes a tamper signal to one or more computer system devices to respond to the unauthorized access. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.

Abstract: An optical electromagnetic radiation (EM) emitter and receiver are located upon a printed circuit board (PCB) layer and are optically connected to an optical security pathway that is between a pair of signal traces. A predetermined reference flux is determined, the reference flux being the expected EM transmitted by the optical security pathway and received by the receiver. When the PCB is subject to an unauthorized access thereof (e.g., drilled, sawed, cut, etc.), the optical EM transferred by optical security pathway is altered. An optical monitoring device that monitors the flux of the optical EM received by the receiver detects a change in flux, in relation to the reference flux, and passes a tamper signal to one or more computer system devices to respond to the unauthorized access. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.

Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

Abstract: A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.